Abstract: A tunneling field-effect transistor (TFET) device is disclosed. A protrusion structure is disposed over the substrate and protrudes out of the plane of substrate. Isolation features are formed on the substrate. A drain region is disposed over the substrate adjacent to the protrusion structure and extends to a bottom portion of the protrusion structure as a raised drain region. A drain contact is disposed over the drain region and overlap with the isolation feature.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

Abstract: A semiconductor device and method of making a conductive connector is provided. In an embodiment an opening is formed within a photoresist by adjusting the center point of an in-focus area during the exposure process. Once the photoresist has been developed to form an opening, an after development baking process is utilized to reshape the opening. Once reshaped, a conductive material is formed into the opening to take on the shape of the opening.

Abstract: A light bar includes a circuit board, a plurality of light emitting units, a connector and a frame module. The light emitting units are disposed on the circuit board. The connector is disposed on the circuit board. The frame module includes a plurality of frames arranged side by side. Each of the frames includes an accommodating recess. The circuit board is accommodated in the accommodating recess of each frame. The connector is located between a first end and a second end of the frame module, wherein the first end is opposite to the second end.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

Abstract: Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.

Abstract: The present invention provides a uniform poultry feeding system that is comprised of a trough and a fodder conveyor unit. The trough consists of a pair of trough bodies and a fencing. The fodder conveyor unit is installed above the trough and has a conveyor being set between the trough bodies and the fencing, a slot at the bottom to enable fodder falling into the trough bodies, several stopcocks fixed onto the pipe, several suspension cables extending and connecting to the stopcocks to control the rise and fall of the stopcocks and the conveyor by moving up and down, prevent rotation of the pipe and displacement of the slot and adjust the discharge of fodder into the trough bodies by changing the distance between the conveyor and the bottom of the trough bodies.

Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.

Abstract: Disclosed herein are related to a system and a method for controlling a virtual reality based on a physical object. In one aspect, a shape of a hand of a user corresponding to a surface or a structure of a physical object is detected. In one aspect, according to the detected shape of the hand, an interactive feature for the surface or the structure of the physical object is generated in a virtual reality or augmented reality application. In one aspect, a user interaction with the interactive feature is detected. In one aspect, an action of the virtual reality or augmented reality application is initiated, in response to detecting the user interaction with the interactive feature.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

Abstract: A method for monitoring the spindle preload amount of a spindle by: S1 obtaining a spindle preload amount through a PPC Preload Analyzer; and S2 obtaining an axial force sensor output of the spindle through an axial force sensor, wherein the axial force sensor output is calibrated using the spindle preload amount that is obtained through the PPC Preload Analyzer; establishing a relationship between the spindle preload amount and the axial force sensor output, then regarding the axial force sensor output as the spindle preload amount, and then monitoring the spindle preload amount by monitoring the axial force sensor output.

Abstract: Various embodiments of the present disclosure are directed towards a microphone including a particle filter disposed between a microelectromechanical systems (MEMS) substrate and a carrier substrate. A MEMS device structure overlies the MEMS substrate. The MEMS device structure includes a diaphragm having opposing sidewalls that define a diaphragm opening. The carrier substrate underlies the MEMS substrate. The carrier substrate has opposing sidewalls that define a carrier substrate opening underlying the diaphragm opening. A filter stack is sandwiched between the carrier substrate and the MEMS substrate. The filter stack includes an upper dielectric layer, a lower dielectric layer, and a particle filter layer disposed between the upper and lower dielectric layers. The particle filter layer includes the particle filter spaced laterally between the opposing sidewalls of the carrier substrate.

Abstract: A method of fabricating a semiconductor package includes providing a substrate having at least one contact and forming a redistribution layer on the substrate. The formation of the redistribution layer includes forming a dielectric material layer over the substrate and performing a double exposure process to the dielectric material layer. A development process is then performed and a dual damascene opening is formed in the dielectric material layer. A seed metallic layer is formed over the dual damascene opening and over the dielectric material layer. A metal layer is formed over the seed metallic layer. A redistribution pattern is formed in the first dual damascene opening and is electrically connected with the at least one contact.

Abstract: Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.

Abstract: Various embodiments of the present disclosure are directed towards a microphone including a particle filter disposed between a microelectromechanical systems (MEMS) substrate and a carrier substrate. A MEMS device structure overlies the MEMS substrate. The MEMS device structure includes a diaphragm having opposing sidewalls that define a diaphragm opening. The carrier substrate underlies the MEMS substrate. The carrier substrate has opposing sidewalls that define a carrier substrate opening underlying the diaphragm opening. A filter stack is sandwiched between the carrier substrate and the MEMS substrate. The filter stack includes an upper dielectric layer, a lower dielectric layer, and a particle filter layer disposed between the upper and lower dielectric layers. The particle filter layer includes the particle filter spaced laterally between the opposing sidewalls of the carrier substrate.

Abstract: An electronic device includes a communication port, a display, a processor, and a memory. The processor detects whether an external device plugs into the communication port, displays a user interface on the display when an external device plugs into the communication port, detects whether the user interface receives a predetermined user operation, recommends relevant data linked to the external device according to predetermined rules when the user interface receives the predetermined user operation, and displays the relevant data linked to the external device on the display.

Abstract: A system includes a near eye display (NED) comprising a substantially transparent electronic display that is configured to display images in accordance with display instructions, and an imaging device configured to capture one or more images of a portions of a local area surrounding the NED. The system further includes a controller configured to determine a position of an object within the local area using the captured one or more images and location information associated with the object. The controller accesses supplemental information regarding the object, and updates the display instructions to cause the substantially transparent electronic display to display at least a portion of the supplemental information about the object. The display of the at least a portion of the supplemental information is positioned within a threshold distance of the determined position of the object in an augmented reality environment as presented via the substantially transparent electronic display.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.