Abstract: A semiconductor package includes a first chip, a plurality of through vias and an encapsulant. The first chip has a first via and a protection layer thereon. The first via is disposed in the protection layer. The through vias are disposed aside the first chip. The encapsulant encapsulates the first chip and the plurality of through vias. A surface of the encapsulant is substantially coplanar with surfaces of the protection layer and the plurality of through vias.

Abstract: Novel organic compounds comprising a bicarbazole core are provided. In particular, the compounds has a 3,3?-bicarbazole core substituted at the 9-position with a triazine or pyrimidine. The compounds may be used in organic light emitting devices to provide devices having improved efficiency and improved lifetime.

Abstract: A method is disclosed herein. The method includes: adjusting first parameters associated with parameterized cells in a netlist of an integrated circuit (IC) to generate second parameters associated with the parameterized cells in the netlist of the IC; updating the netlist of the IC according to the second parameters; and performing a simulation according to the netlist.

Abstract: The present invention provides an autonomous cleaning robot device for cleaning in the animal husbandry environment. The cleaning robot is composed of a master machine (autonomous moving controller) and a slave machine (self-propelled cleaning head). The master machine and the slave machine are connected by a robotic arm and a traction hose. The robotic arm can adapt to the movement of the cleaning slave machine to reduce the resistance and secondary pollution or damage caused by friction between the traction cable and the ground during the movement. The traction hose combined with the robotic arm allows slave machine to enter and exit the fence without opening and closing the door to improve efficiency. In the treatment of dirt, the excrement is collected by a suction driving device, and is centrally collected in a storage tank, and then is compacted into blocks by the excrement compression device.

Abstract: A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove.

Abstract: The disclosed computer-implemented method may include tracking (1) a position of a primary real-world object within a real-world environment via a primary tracking method, and (2) a position of a secondary real-world object within the real-world environment via a secondary tracking method. The method may further include presenting (1) a primary virtual object at a position within an artificial environment corresponding to the tracked position of the primary real-world object, and (2) a secondary virtual object at a position within the artificial environment corresponding to the tracked position of the secondary real-world object. The method may further include (1) detecting an interaction of the primary real-world object with the secondary real-world object, and (2) transitioning to tracking the position of the primary real-world object via the secondary tracking method. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method comprises depositing a protection layer over a first substrate, wherein the first substrate is part of a first semiconductor die, forming an under bump metallization structure over the protection layer, forming a connector over the under bump metallization structure, forming a first dummy plane along a first edge of a top surface of the first semiconductor die and forming a second dummy plane along a second edge of the top surface of the first semiconductor die, wherein the first dummy plane and the second dummy plane form an L-shaped region.

Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 ?m.

Abstract: The integrated CMOS-MEMS device includes a CMOS structure, a cap structure, and a MEMS structure. The CMOS structure, fabricated on a first substrate, includes at least one conducting layer. The cap structure, including vias passing through the cap structure, has an isolation layer deposited on its first side and has a conductive routing layer deposited on its second side. The MEMS structure is deposited between the first substrate and the cap structure. The integrated CMOS-MEMS device also includes a conductive connector that passes through one of the vias and through an opening in the isolation layer on the cap structure. The conductive connector conductively connects a conductive path in the conductive routing layer on the cap structure with the at least one conducting layer of the CMOS structure.

Abstract: Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a die and a stiffener. The substrate has an upper surface. The die is disposed on the upper surface of the substrate. The stiffener is disposed on the upper surface of the substrate and surrounds the die. The stiffener has a first upper surface adjacent to the die, a second upper surface far from the die and a lateral surface extending from the first upper surface to the second upper surface. A first distance between the first upper surface of the stiffener and the upper surface of the substrate is less than a second distance between the second upper surface of the stiffener and the upper surface of the substrate.

Abstract: Embodiments are directed to a near eye display (NED) system for displaying artificial reality content to a user and to manipulate displayed content items based upon gestures performed by users of the NED system. A user of the NED system may perform a gesture simulating the throwing of an object to “cast” a content item to a target location in an artificial reality (AR) environment displayed by the NED system. The gesture may comprise a first portion in which the user's hand “grabs” or “pinches” a virtual object corresponding to the content item and moves backwards relative to their body, and a second portion in which the user's hand moves forwards relative to their body and releases the virtual object. The target location may be identified based upon a trajectory associated with the backwards motion of the first portion of the gesture.

Abstract: A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove. A method for fluid-assisted assembly is also disclosed.

Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.

Abstract: A method for indicating to a user the exact location of a parked vehicle includes obtaining a plurality of panoramic images of a vehicle when being driven using a panoramic lens. A direction of driving of the vehicle is identified based on the panoramic images and a determination as to location is made when the vehicle arrives at a parking location. When the vehicle is parked, parking position information is sent to a mobile terminal held by the driver or other user. A vehicle-mounted device for implementing the method is also disclosed.

Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.

Abstract: Provided is a use of a Macaranga tanarius preparation or extract for manufacturing a composition for enhancing immunity of an insect, particularly a bee. Also provided is a method for enhancing immunity of an insect, particularly a bee. The method comprises administering an effective amount of a composition of the present invention to the insect.

Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.

Abstract: A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove. A method for fluid-assisted assembly is also disclosed.