Abstract: Exemplary video processing methods and apparatuses for encoding or decoding a current block by inter prediction are disclosed. Input data of a current block is received and partitioned into sub-partitions and motion refinement is independently performed on each sub-partition. A reference block for each sub-partition is obtained from one or more reference pictures according to an initial motion vector (MV). A refined MV for each sub-partition is derived by searching around the initial MV with N-pixel refinement. One or more boundary pixels of the reference block for a sub-partition is padded for motion compensation of the sub-partition. A final predictor for the current block is generated by performing motion compensation for each sub-partition according to its refined MV. The current block is then encoded or decoded according to the final predictor.

Abstract: A patient interface including a plenum chamber, a first seal-forming structure for forming a seal around the patient's mouth, and a second seal-forming structure for forming a seal around the patient's nares. The patient interface further includes at least one stopper rib disposed in the cavity of the plenum chamber spaced apart from the first seal-forming structure in a rest position. The first seal-forming structure configured to contact the at least one stopper rib in an operational position. The at least one stopper rib configured to oppose compression of the first seal-forming structure in an anterior direction. The second seal-forming structure is not configured to contact the at least one stopper rib.

Abstract: A data reading method, a memory storage device, and a memory control circuit unit are disclosed. The method includes: receiving a read command from a host system, and the read command instructs reading data from at least one logical unit, and the logical unit is mapped to a first physical unit; obtaining state information of at least two neighboring memory cells in the first physical unit; determining an electrical parameter offset value corresponding to the neighboring memory cells according to the state information; and sending a read command sequence according to the electrical parameter offset value, and the read command sequence instructs reading the first physical unit based on at least one electrical parameter, and the electrical parameter is controlled by the electrical parameter offset value.

Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate; forming isolation regions on opposing sides of the fin; forming a dummy gate electrode over the fin; removing lower portions of the dummy gate electrode proximate to the isolation regions, where after removing the lower portions, there is a gap between the isolation regions and a lower surface of the dummy gate electrode facing the isolation regions; filling the gap with a gate fill material; after filling the gap, forming gate spacers along sidewalls of the dummy gate electrode and along sidewalls of the gate fill material; and replacing the dummy gate electrode and the gate fill material with a metal

Abstract: The invention provides a display device and a display panel. The display device includes the display panel and a reading circuit. The display panel includes an upper substrate, a lower substrate, a thin-film transistor (TFT) layer, and a photosensitive circuit. The TFT layer is disposed between the upper substrate and the lower substrate. A plurality of TFTs of a pixel array of the display panel are disposed in the TFT layer. The photosensitive circuit is disposed in the TFT layer to sense an ambient light. The reading circuit is coupled to the photosensitive circuit to read a sensing result.

Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.

Abstract: The present invention provides a multi-element, regionally doped, cobalt-free positive electrode material, which has a molecular formula of LixNiaMnbAlcMgdWeO2, wherein 0.95?x?1.1, 0.5?a?0.9, 0.1?b?0.5, 0?c?0.01, 0?d?0.01, 0?e?0.01, and a+b=1. The positive electrode material comprises an Al-doped region, an Mg-doped region and a W-doped region in an order from the inside to the outside. Also provided is a method of preparing the positive electrode material. The cobalt-free positive electrode material of the present invention can better adapt to a stress release by the positive electrode material regionally doped with Al, Mg, and W elements, achieving a moderate adjustment and avoiding imbalance, so that the material has more stable structure, and better rate performance and cycle performance. The method of preparing the material has a simple process, is easy to implement, and can stably prepare a positive electrode material with excellent structure and performance.

Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a plurality of semiconductor layers having a first group of semiconductor layers, a second group of semiconductor layers disposed over and aligned with the first group of semiconductor layers, and a third group of semiconductor layers disposed over and aligned with the second group of semiconductor layers. The structure further includes a first source/drain epitaxial feature in contact with a first number of semiconductor layers of the first group of semiconductor layers and a second source/drain epitaxial feature in contact with a second number of semiconductor layers of the third group of semiconductor layers. The first number of semiconductor layers of the first group of semiconductor layers is different from the second number of semiconductor layers of the third group of semiconductor layers.

Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.

Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.

Abstract: Exemplary embodiments may provide a unified computing platform for multiple units of an organization that may interface with different clients, management and other stakeholders. The computing platform may include a unifying layer that provides personalization of access to computing resources across business areas and enables access to legacy computing resources. A unified experience is provided for the clients, management and stakeholders by the unifying layer. Common reusable code may be used across organizational units via the unifying layer. Exemplary embodiments may provide an onboarding software tool that improves onboarding of clients to a business organization, including interfacing with the unified computing platform. Exemplary embodiments may provide intelligent handling of trade or transaction exceptions in the unified computing platform across business lines.

Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.

Abstract: A method and device of removing and recycling metals from a mixing acid solution, includes adsorbing a mixing acid solution with a pH value of ?1 to 4 and a cobalt ion concentration of 100 to 1,000 mg/L by at least two cation resins in series setting to the cobalt ion concentration in the mixing acid solution is less than 10 mg/L, and then adjusting the pH value of the mixing acid solution after adsorption to meet a discharge standard, wherein the particle size of the at least two cation resins in series setting is 150˜1,200 ?m. After the cation resins are saturated by adsorption, regenerating the cation resins by sulfuric acid to form a cobalt sulfate solution, and then electrolytically treating the cobalt sulfate solution to obtain electrolytic cobalt and sulfuric acid electrolyte. The operation process is simple without complicated equipment, and it can effectively recycle metals from mixing acid solutions.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.

Abstract: A connection structure of an (light-emitting diode) LED wall lamp having a hidden switch contains: a fixer, a rotatable sleeve, a coupling ring, a lampshade, a connection seat, a LED light module, and a decoration element. The fixer includes multiple positioning orifices and a through orifice. The rotatable sleeve is configured to be rotatably connected with the coupling ring and includes a connecting shaft, a locating post, and a rotary section. The coupling ring is configured to connect the lampshade, the connection seat and the decoration element. The lampshade includes a circular platform and multiple threaded orifices. The connection seat is configured to connect the LED light module. The LED light module is configured to illuminate lights and includes multiple LED units and a switch built in the LED light module. The decoration element is mounted on the coupling ring to cover a central orifice of the circular disc.

Abstract: A computer-implemented method, a computer system, and computer program product for associating security events. The method includes obtaining a result of implementation of one or more Locality-Sensitive Hashing (LSH) functions to feature data of a first event detected by a first device. The method also includes mapping the result to one or more positions in a data structure. In response to data elements of the one or more positions indicating first information associating with the one or more positions exists in a storage, the method includes obtaining the first information from the storage. The method further includes sending the first information to the first device.