Abstract: Semiconductor devices and methods of forming the same are provided. A semiconductor device according to one embodiment includes an active region including a channel region and a source/drain region adjacent the channel region, a gate structure over the channel region of the active region, a source/drain contact over the source/drain region, a dielectric feature over the gate structure and including a lower portion adjacent the gate structure and an upper portion away from the gate structure, and an air gap disposed between the gate structure and the source/drain contact. A first width of the upper portion of the dielectric feature along a first direction is greater than a second width of the lower portion of the dielectric feature along the first direction. The air gap is disposed below the upper portion of the dielectric feature.

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A method for removing a heavy metal from water includes subjecting a microbial solution containing a liquid culture of a urease-producing bacterial strain and a reaction solution containing a manganese compound and urea to a microbial-induced precipitation reaction, so as to obtain biomineralized manganese carbonate (MnCO3) particles, admixing the biomineralized MnCO3 particles with water containing a heavy metal, so that the biomineralized MnCO3 particles adsorb the heavy metal in the water to form a precipitate, and removing the precipitate from the water.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a substrate. A gate electrode is over the substrate and a spacer structure laterally surrounds the gate electrode. A conductive via is disposed on the gate electrode. A liner is arranged along one or more sidewalls of the spacer structure. The conductive via has a bottommost surface that has a larger width than a part of the conductive via that is laterally adjacent to one or more interior sidewalls of the liner.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first insulating layer over a substrate. A first metal feature is formed in the first insulating layer and a second insulating layer is formed over the first insulating layer. A first metal via is formed through the second insulating layer to connect the first metal feature. A second metal feature is formed over the second insulating layer. The second metal feature has a convex top surface and a plane bottom surface, and the plane bottom is electrically connected to the first metal feature through the first metal via.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a gate structure sandwiched between and in contact with a first spacer feature and a second spacer feature, a top surface of the first spacer feature and a top surface of the second spacer feature extending above a top surface of the gate structure, a gate self-aligned contact (SAC) dielectric feature over the first spacer feature and the second spacer feature, a contact etch stop layer (CESL) over the gate SAC dielectric feature, a dielectric layer over the CESL, a gate contact feature extending through the dielectric layer, the CESL, the gate SAC dielectric feature, and between the first spacer feature and the second spacer feature to be in contact with the gate structure, and a liner disposed between the first spacer feature and the gate contact feature.

Abstract: An electronic apparatus and a secure firmware update method thereof are provided. The electronic apparatus includes a first integrated circuit chip, a first non-volatile memory chip, a second integrated circuit chip and a second non-volatile memory chip. The first integrated circuit chip includes a secure firmware update console, and the first non-volatile memory chip includes a spare data storage space. The first non-volatile memory chip and the second non-volatile memory chip store a first firmware code of the first integrated circuit chip and a second firmware code of the second integrated circuit chip, respectively. Firmware code update data are transferred to and stored in the spare data storage space. The secure firmware update console performs a firmware update procedure by writing the firmware code update data into the second non-volatile memory chip to overwrite the second firmware code after passing a verification procedure on the firmware code update data.

Abstract: A method of removing hydrogen peroxide from sulfuric acid includes the following steps: First step of pouring the sulfuric acid having 0.1 wt % to 10 wt % of hydrogen peroxide into a vessel. Second step of adding a catalyst containing copper and a copper compound to the vessel to undergo a reaction with the sulfuric acid to remove the hydrogen peroxide from the sulfuric acid, to generate heat, and to generate metal ions in the sulfuric acid. Third step of activating a cooling device to cool the vessel to a predetermined temperature range. Fourth step of adding hydrogen sulfide to the vessel to undergo a reaction with the metal ions to generate metallic sulfide and metal free sulfuric acid. Fifth step of purifying the metallic sulfide and the metal free sulfuric acid to obtain purified metallic sulfide and purified sulfuric acid as products.

Abstract: An electronic apparatus and a secure firmware update method thereof are provided. The electronic apparatus includes a first integrated circuit chip, a first non-volatile memory chip, a second integrated circuit chip and a second non-volatile memory chip. The first integrated circuit chip includes a secure firmware update console, and the first non-volatile memory chip includes a spare data storage space. The first non-volatile memory chip and the second non-volatile memory chip store a first firmware code of the first integrated circuit chip and a second firmware code of the second integrated circuit chip, respectively. Firmware code update data are transferred to and stored in the spare data storage space. The secure firmware update console performs a firmware update procedure by writing the firmware code update data into the second non-volatile memory chip to overwrite the second firmware code after passing a verification procedure on the firmware code update data.

Abstract: A method of removing hydrogen peroxide from sulfuric acid includes pouring sulfuric acid (H2SO4) having 0.1% to 10% of hydrogen peroxide (H2O2) into a vessel; adding a catalyst containing metal or metal compound to the vessel to undergo a reaction with the sulfuric acid (H2SO4) to remove hydrogen peroxide (H2O2) from the sulfuric acid (H2SO4), to generate heat, and to generate metal ions in the sulfuric acid (H2SO4); activating a cooling device to cool the vessel to a predetermined temperature range; adding sulfur (S2?) to the vessel to undergo a reaction with the metal ions to generate metallic sulfide; and purifying the metal free sulfuric acid (H2SO4) to obtain the metallic sulfide and highly purified, diluted sulfuric acid (H2SO4) as products.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a serial advanced technology attachment (SATA) physical layer, a clock generator and a control unit. The SATA physical layer is configured to provide connection with an SATA device and perform data transmission with the SATA device is performed at a first clock frequency. The clock generator is configured to provide a clock signal having the first clock frequency to the SATA physical layer. When at least one specific event is detected by the control unit, the control unit controls the clock generator to provide the clock signal having a second clock frequency to the SATA physical layer, so that the SATA physical layer performs data transmission with the SATA device at the second clock frequency. The second clock frequency is lower than the first clock frequency.

Abstract: A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.

Abstract: A motor vehicle image correction system includes an image correction module, an image generating module, an image processing unit and an image display unit. The image correction module is installed at a vehicle periphery and includes a plurality of regularly arranged patterns. The image generating module includes a plurality of image generating units, and each image generating unit is installed on a side of the motor vehicle for generating a corresponding image signal, receiving the image signal, and capturing a characteristic image of the image signal, processing the characteristic image, and generating a processed display signal, such that the image processing unit can adjust the vehicle image device according to the regularly arranged pattern of the image correction module to correct the vehicle image device.

Abstract: The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a serial advanced technology attachment (SATA) physical layer, a clock generator and a control unit. The SATA physical layer is configured to provide connection with an SATA device and perform data transmission with the SATA device is performed at a first clock frequency. The clock generator is configured to provide a clock signal having the first clock frequency to the SATA physical layer. When at least one specific event is detected by the control unit, the control unit controls the clock generator to provide the clock signal having a second clock frequency to the SATA physical layer, so that the SATA physical layer performs data transmission with the SATA device at the second clock frequency. The second clock frequency is lower than the first clock frequency.

Abstract: The present invention provides a visual tracking system and its method comprising: a sensor unit, for capturing monitored scenes continuously; an image processor unit, for detecting when a target enters into a monitored scene, and extracting its characteristics to establish at least one model, and calculating the matching scores of the models; a hybrid tracking algorithm unit, for combining the matching scores to produce optimal matching results; a visual probability data association filter, for receiving the optimal matching results to eliminate the interference and output a tracking signal; an active moving platform, for driving the platform according to the tracking signal to situate the target at the center of the image. Therefore, the visual tracking system of the present invention can help a security camera system to record the target in details and maximize the visual information of the intruding target.

Abstract: A cutting device includes a housing, a bearing, a base, and a rotary cutter. The housing defines a receiving chamber. The bearing is received in the receiving chamber and includes an inner ring and an exterior ring contacting an interior wall of the housing. The base is secured to the inner ring of the base and has one end protruding out of the housing. The rotary cutter includes a head and a securing shaft, and the securing shaft has a first end secured to the head and a second end secured to the end of the base protruding out of the housing. The cutting device can prevent small glass pieces from dropping into the bearing and affecting the rotation of the bearing, thereby extending the service life of the bearing as well as guaranteeing smooth rotation of the bearing to improve the quality of the cutting operation.

Abstract: The present disclosure provides an edge-grinding machine used for grinding a liquid crystal panel. The edge-grinding machine includes a chamfering grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel for chamfering the cutting edge and further removing a sharp portion of the cutting edge; and a reshaping grinding wheel assembly corresponding to a complete cutting surface of the liquid crystal panel for reshaping the complete cutting surface and further removing a step and unwanted objects on the complete cutting surface. The edge-grinding machine of the present disclosure is capable of chamfering the corresponding cutting edge of the liquid crystal panel while reshaping the complete cutting surface for removing the step and unwanted objects thereon, which saves resources and labors required to reshape the liquid crystal panel and thus improves the yield rate of the liquid crystal panel.