Abstract: A cutting device includes a housing, a bearing, a base, and a rotary cutter. The housing defines a receiving chamber. The bearing is received in the receiving chamber and includes an inner ring and an exterior ring contacting an interior wall of the housing. The base is secured to the inner ring of the base and has one end protruding out of the housing. The rotary cutter includes a head and a securing shaft, and the securing shaft has a first end secured to the head and a second end secured to the end of the base protruding out of the housing. The cutting device can prevent small glass pieces from dropping into the bearing and affecting the rotation of the bearing, thereby extending the service life of the bearing as well as guaranteeing smooth rotation of the bearing to improve the quality of the cutting operation.

Abstract: The present disclosure provides an edge-grinding machine used for grinding a liquid crystal panel. The edge-grinding machine includes a chamfering grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel for chamfering the cutting edge and further removing a sharp portion of the cutting edge; and a reshaping grinding wheel assembly corresponding to a complete cutting surface of the liquid crystal panel for reshaping the complete cutting surface and further removing a step and unwanted objects on the complete cutting surface. The edge-grinding machine of the present disclosure is capable of chamfering the corresponding cutting edge of the liquid crystal panel while reshaping the complete cutting surface for removing the step and unwanted objects thereon, which saves resources and labors required to reshape the liquid crystal panel and thus improves the yield rate of the liquid crystal panel.

Abstract: A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.

Abstract: A cutting machine for cutting a liquid crystal panel includes a transferring device for transferring the panel, a positioning device for positioning the panel, and a main body for driving the transferring device and the positioning device to position the panel and for cutting the panel after the panel is positioned. The transferring device includes a first roller array for supporting and transferring the panel along a first direction and a second roller array for supporting and transferring the panel along a second direction. The positioning device includes a first positioning assembly, a second positioning assembly, a third positioning assembly, and a forth positioning assembly. The first positioning assembly cooperates with the second positioning assembly to position the panel along the first direction before the panel is cut, and the third positioning assembly cooperates with the forth positioning assembly to position the panel along the second direction.

Abstract: The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.

Abstract: A panel fabricating method is provided. A first substrate having at least two first units arranged along a first direction is provided, wherein each first unit has a first display region and a terminal region sequentially arranged along the first direction. A second substrate having at least two second units arranged along the first direction is provided, wherein each second unit has a second display region and a removal region sequentially arranged along the first direction. The first substrate and the second substrate are stacked so that each first display region is opposite to each second display region and each terminal region is opposite to each removal region, so as to form a plurality of panels. The second substrate is cut in a discontinuous manner along the first direction to form at least one first discontinuous cut portion, wherein the first discontinuous cut portion is partially overlapped with the removal region.

Abstract: The present invention provides a visual tracking system and its method comprising: a sensor unit, for capturing monitored scenes continuously; an image processor unit, for detecting when a target enters into a monitored scene, and extracting its characteristics to establish at least one model, and calculating the matching scores of the models; a hybrid tracking algorithm unit, for combining the matching scores to produce optimal matching results; a visual probability data association filter, for receiving the optimal matching results to eliminate the interference and output a tracking signal; an active moving platform, for driving the platform according to the tracking signal to situate the target at the center of the image. Therefore, the visual tracking system of the present invention can help a security camera system to record the target in details and maximize the visual information of the intruding target.