Abstract: A noise reduction module includes a casing, at least one sound weakening mechanism and at least one sound absorbing mechanism. The at least one sound weakening mechanism is disposed in the casing. Each of the at least one sound weakening mechanism includes two plate members and a passage is formed between the two plate members. The at least one sound absorbing mechanism is disposed in the casing. Each of the at least one sound absorbing mechanism includes a bracket and at least one first sound absorbing structure, and the at least one first sound absorbing structure is disposed on the bracket.

Abstract: A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

Abstract: A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

Abstract: A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

Abstract: An electronic device is provided, including a main body, a display module, a rotary member, a slider, a first hinge, and a second hinge. The display module has a recess and a first surface. The main body, the display module, and the rotary member are pivotally connected by the first hinge. The rotary member and the slider are pivotally connected by the second hinge. When the display module is in a closed position relative to the main body, the slider is accommodated in the recess. When the display module rotates relative to the main body from the closed position to an open position, the display module pushes the slider to rotate relative to the rotary member, and the rotary member rotates relative to the display module, such that the slider protrudes from the first surface.

Abstract: A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: A cooling module for a computer system has a fan module, a heat sink module and an air wall. The heat sink module is connected to a circuit of the computer system for conducting heat generated by the circuit. The fan module makes air flow from an air inlet of the fan to the heat sink module where air absorbs heat generated by the circuit, and flow out from an air outlet of the heat sink module. The air wall is set between the air inlet of the fan and the air outlet of the heat sink module for isolating airflow from the air outlet of the heat sink module to the air inlet of the fan, such that heated air from the air outlet of the heat sink module will not significantly flow into the air inlet of the fan, and cooling efficient is therefore increased.