HEAT DISSIPATION MECHANISM
A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
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This Application claims priority of Taiwan Patent Application No. 101215052, filed on Aug. 6, 2012, the entirety of which is incorporated by reference herein.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a heat dissipation mechanism, and in particular, relates to a heat dissipation mechanism for a stacking system.
2. Description of the Related Art
Various external components such as a graphics processing units, memories, and hard disks can be connected to traditional notebook computers due to their compact dimensions. However, the external components all need heat dissipation devices, which increase production costs. Thus, decreasing the cost of heat dissipation devices, while maintaining efficiency has become an important issue in the field.
BRIEF SUMMARY OF THE INVENTIONThe present invention provides a heat dissipation mechanism, comprising a main casing, an air exhaust device, and at least a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
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Specifically, when the main joining portions 11, 11′, the first joining portion 21, the second joining portion 22, and the third joining portion 31 are engaged with each other, the mechanical strength between the casings is improved, and electrical signals can be transmitted between the electronic components in the casings through the joining portions. Thus, the heat dissipation mechanism can form a flow channel by engaging the main casing with the sub-casing, so as to rapidly dissipate heat and improve cooling efficiency of a stacking system.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims
1. A heat dissipation mechanism is provided, comprising:
- a main casing, including an opening, an air outlet and a main joining portion;
- an air exhaust device, disposed in the main casing to exhaust air through the air outlet from the main casing; and
- at least a first sub-casing, including a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
2. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two first sub-casings, and the main casing further comprises two openings and two main joining portions,
- wherein the first sub-casings are respectively disposed on opposite sides of the main casing, the first joining portions of the first sub-casings are respectively engaged with the main joining portions, and the first through holes are respectively communicated with the openings.
3. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises a second sub-casing and the first sub-casing further comprises a second joining portion, and the first and second joining portions are respectively disposed on opposite sides of the first sub-casing, and the second sub-casing includes a second through hole and a third joining portion, wherein the second through hole communicates with the first through hole, and the third joining portion engages with the second joining portion.
4. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings, and one of the main casings comprises two openings, and the first sub-casing joining portions are respectively disposed on opposite sides of the first sub-casing and respectively engaged with the main casings, and the openings are communicated with the first through hole.
5. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the main casings are engaged with each other, and the first sub-casings are disposed on opposite sides of the main casings.
6. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the first sub-casings are engaged with each other, and the main casings are disposed on opposite sides of the first sub-casings.
7. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings engaged with each other and arranged in a staggered manner.
8. The heat dissipation mechanism as claimed in claim 1, wherein the main joining portion is engaged with and electrically connected to the first joining portion.
9. The heat dissipation mechanism as claimed in claim 1, wherein the first sub-casing further comprises an air inlet, and air flows into the first sub-casing through the air inlet.
10. The heat dissipation mechanism as claimed in claim 1, wherein the main casing further comprises a meshed structure, disposed in the opening, and the ventilation area ratio ranges from 30%˜50%.
Type: Application
Filed: Dec 31, 2012
Publication Date: Feb 6, 2014
Applicant: Acer Incorporated (Taipei Hsien)
Inventors: Cheng-Pang WANG (Taipei Hsien), Wen-Neng LIAO (Taipei Hsien)
Application Number: 13/731,267