Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a polyglycol or polyglycol derivative; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a thiolalkoxy compound; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a dihydroxy bis-sulfide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A combined computer case is provided which includes two first panels opposing to each other, at least three support posts respectively located round the first panels and perpendicular to the first panels, and at least three side panels. Each side panel is provided between two neighboring support posts. Each first panel has at least three connecting portions for corresponding to the other first panel. Each support post has first connecting sheets on both ends thereof for corresponding to the first connecting potions of the first panels. The first panels, the support posts and the side panels are pillar or planar components, and respectively act as minimum units of a cubic computer case. In assembly, the first connecting sheets respectively connect with the first panels to form a support frame of a computer case. Finally the side panels are assembled to complete assembly of the computer case.

Abstract: A heat sink pad for notebook computer has a supporting unit and a guiding unit attached to the supporting unit. The supporting unit includes a flat plate which has a supporting portion bending downwardly from an end thereof. A plurality of through hole areas is defined in the flat plate. A guiding rail is formed on a downward surface of the flat plate. The guiding unit includes two casings movably provided on the guiding rail. Each casing defines a slot at a side thereof for corresponding to opposite sides of the flat plate. A fan is placed in each casing. Positions of the guiding units are freely adjusted to be suitable for diverse notebook computers for dissipating heat effectively.

Abstract: A heat sink pad for notebook computer has a supporting unit and a guiding unit attached to the supporting unit. The supporting unit includes a flat plate which has a supporting portion bending downwardly from an end thereof. A plurality of through hole areas is defined in the flat plate. A guiding rail is formed on a downward surface of the flat plate. The guiding unit includes two casings movably provided on the guiding rail. Each casing defines a slot at a side thereof for corresponding to opposite sides of the flat plate. A fan is p laced in each casing. Positions of the guiding units are freely adjusted to be suitable for diverse notebook computers for dissipating heat effectively.

Abstract: A computer casing has a frame, two fixing panels arranged inside the frame, and two side panels assembled on opposing sides of the frame. The frame, the fixing panels and the side panels are all made of aluminum. The frame includes a top panel, a bottom panel, a front panel and a rear panel fixed together by means of soldering. The computer casing is secured in entirety and has large dissipation area. Additionally, the computer casing is easily classified and recycled in the case of expiration.

Abstract: A power supply with heat sink is mounted inside a computer, and includes a support, a circuit board arranged on a surface of the support, and a heat sink provided on another surface of the support. The support defines a slot substantially therein. A plurality of electronic components and a plurality of thermal components are respectively provided on opposite surfaces of the circuit board. The thermal components are evenly attached to the heat sink. The heat sink conducts and dissipates heat generated by the thermal components, thereby reducing noise and cooling large area. The power supply with heat sink is assembled flexibly for saving space.

Abstract: A computer casing has a frame, two fixing panels arranged inside the frame, and two side panels assembled on opposing sides of the frame. The frame, the fixing panels and the side panels are all made of aluminum. The frame includes a top panel, a bottom panel, a front panel and a rear panel fixed together by means of soldering. The computer casing is secured in entirety and has large dissipation area. Additionally, the computer casing is easily classified and recycled in the case of expiration.

Abstract: A lacrosse stick includes a handle, a head mounted on a front end of the handle, a pocket mounted on the head, and a grip mounted on a rear end of the handle. Thus, the handle has a surface provided with a helical holding face to increase the friction between the surface of the handle and a user's one hand so as to provide an enhanced holding effect to facilitate the user holding the handle so that the user holds the handle closely without incurring slip from the handle. In addition, the helical holding face increases the strength of the surface of the handle so that the handle has a reinforced strength to prevent the handle from being bent or cracked by hit.

Abstract: A heat dissipation device for a computer mother board includes a computer enclosure, a heat sink and a mother board. The computer enclosure includes a frame, front and rear panels, two side panels and top and bottom panels respectively connecting to the frame. One side panel is disposed with a support board at the inner side thereof. The heat sink is fixed to one surface of the support board and between the support board and the side panel. The mother board is connected to the other surface of the support board. A plurality of connectors and electronic modules are disposed at one side of the mother board and heat generation modules including a CPU and an electronic chip are disposed at the other side of the mother board. The heat generation modules are in thermal contact with the heat sink.

Abstract: A power supply with heat sink is mounted inside a computer, and includes a support, a circuit board arranged on a surface of the support, and a heat sink provided on another surface of the support. The support defines a slot substantially therein. A plurality of electronic components and a plurality of thermal components are respectively provided on opposite surfaces of the circuit board. The thermal components are evenly attached to the heat sink. The heat sink conducts and dissipates heat generated by the thermal components, thereby reducing noise and cooling large area. The power supply with heat sink is assembled flexibly for saving space.

Abstract: A heat dissipation device for a computer mother board includes a computer enclosure, a heat sink and a mother board. The computer enclosure includes a frame, front and rear panels, two side panels and top and bottom panels respectively connecting to the frame. One side panel is disposed with a support board at the inner side thereof. The heat sink is fixed to one surface of the support board and between the support board and the side panel. The mother board is connected to the other surface of the support board. A plurality of connectors and electronic modules are disposed at one side of the mother board and heat generation modules including a CPU and an electronic chip are disposed at the other side of the mother board. The heat generation modules are in thermal contact with the heat sink.

Abstract: A computer cooler fixed on top of CPU for dissipating heat generated by CPU includes at least a base whose bottom surface is connected with upper surface of CPU and a plurality of cooling fins positioned on top of the base. The invention features on that the cooling fins are made of thin metal plate, then rivet two cooling fins with a metal bar to form a fin unit which can be inserted into parallel slots mounted on the top of the base. The parallel slot has a width equivalent to or slight narrower than the thickness of the fin unit. According to the above structure, the components can be assembled easily, processed conveniently. The density of fins is also increased and the heat dissipating efficiency is improved.

Abstract: A fastening device of the CPU heat sink comprising a heat sink with a base contacting the top of a CPU, a plurality numbers of heat dissipating plates on top of the base, a hollow space formed on top of heat dissipating plates, a fan located in and fixed on the hollow space, two identical fasteners fasten the fan on said hollow space, a fixing part on both top ends of the fasteners that corresponds to a fixing hole of said fan, at least one hook on bottom of the fasteners that corresponds to a fastening hole of the fan heat dissipating plate, an elastic arm is between and ties said fixing part and said hook together. The device is to reduce the material cost, and simplify the manufacturing process to fasten the fan onto the heat dissipating plate without any tool to reduce the manufacturing cost.

Abstract: A lamp suspension track assembly includes an elongated positioning guide track having two opposite sides each defining a guide groove therein, two elongated flexible guide tracks each having a first side formed with a guide rail received in the guide groove of the positioning guide track, and a second side defining a receiving channel therein, two conducting strips each received in the receiving channel, and a positioning cap attached to one end of the positioning guide track and secured to one end of each of the two flexible guide tracks. By such an arrangement, the lamp suspension track assembly can be bent around a proper angle due to the flexibility of the flexible guide tracks, thereby increasing the versatility of the lamp suspension track assembly.