Abstract: Methods, systems, and apparatuses are disclosed for magnetically-actuated relays/switches that suppress cantilever and/or hinge deformation. A permanent magnet produces a first magnetic field. A movable element is held between a pair of axially-aligned, rotationally flexible hinges. A space is present between the permanent magnet and the movable element. The space allows at least one end portion of the movable element to move toward the permanent magnet. A bar member is positioned in the space. A coil produces a second magnetic field to switch the moveable element between first and second stable states. At least the central portion of the movable element is magnetically attracted toward the permanent magnet. The bar member physically prevents the central portion of the movable element from flexing toward the permanent magnet due to the magnetic attraction.

Abstract: A micro-machined magnetic latching switch is described. A moveable micro-machined cantilever has a magnetic material and a longitudinal axis. The cantilever has a conducting layer. A permanent magnet produces a first magnetic field, which induces a magnetization in the magnetic material. The magnetization is characterized by a magnetization vector pointing in a direction along the longitudinal axis of the cantilever. The first magnetic field is approximately perpendicular to longitudinal axis. A three-dimensional solenoid coil produces a second magnetic field to switch the cantilever between a first stable state and a second stable state. The temporary current is input to the three-dimensional solenoid coil, producing the second magnetic field such that a component of the second magnetic field parallel to the longitudinal axis changes direction of the magnetization vector. The cantilever is thereby caused to switch between the first stable state and the second stable state.

Abstract: A method, system, and apparatus for testing one or more micro-magnetic switches on a wafer is described. A magnet is positioned adjacent to a first switch on the wafer. A probe card is positioned adjacent to the first switch. The probe card mounts a first set of probes and a second set of probes. The first set of probes interface with contact areas of a coil associated with the first switch. The second set of probes interface with conductors on the wafer associated with the cantilever of the first switch. A current source is electrically coupled to the first set of probes. The current source activates the coil of the first switch using the first set of probes to switch the cantilever from a first state to a second state. A switch state monitor is electrically coupled to the second set of probes. The switch state monitor determines whether the cantilever of the first switch is in the first state prior to the current source activating the coil of the first switch.

Abstract: Methods and systems of assembling and making laminated electro-mechanical systems and structures are described. A plurality of structural layers are formed that include at least one structural layer having a movable element formed therein. The plurality of structural layers are stacked and aligned into a stack. Each structural layer in the stack is attached to an adjacent structural layer of the stack.

Abstract: Systems and methods for actuating micro-magnetic latching switches in an array of micro-magnetic latching switches are described. The array of switches is defined by Y rows aligned with a first axis and X columns aligned with a second axis. Each switch in the array of switches is capable of being actuated by a coil. In an aspect, a row of coils is moved along the second axis to be positioned adjacent to a selected one of the Y rows of switches. A sufficient driving current is proved to a selected coil in the row of coils to actuate a selected switch in the selected one of the Y rows of switches. In another aspect, a plurality of first axis drive signals and a plurality of second axis drive signals are generated. These signals drive an array of coils, wherein each coil in the array of coils is positioned adjacent to a corresponding switch in the array of switches. Each first axis drive signal is coupled to coils in a corresponding column of coils in the array of coils.

Abstract: Methods and systems of assembling and making laminated electro-mechanical system (LEMS) switches are described. A plurality of structural layers are formed that include at least two structural layers that each include a flexible member. The plurality of structural layers are stacked and aligned into a stack, to form at least one switch. Each structural layer in the stack is attached to an adjacent structural layer of the stack. When the formed switch is in an “on” state, the first flexible member is in contact with the second flexible member. When making contact with the second flexible member, the second flexible member flexes in response. In a further aspect, three flexible members may be present. When the switch is in an “on” state, the first flexible member is in contact with the second and third flexible members. When making contact with the second and third flexible members, the second and third flexible members flex in response.

Abstract: Pluggable fiber optic modules having a receive printed circuit board and a transmit printed circuit board perpendicular with an interface printed circuit board with an edge connection. The edge connection of the interface printed circuit board to plug into and out from an edge connector of a host printed circuit board. A transmitter optoelectronic device is coupled to the transmit printed circuit board. A receiver optoelectronic device is coupled to the receive printed circuit board. The pluggable fiber optic modules may further include a support base, a nose receptacle, and an alignment plate.

Abstract: A multichannel fiber optic module has an electromagnetic shield surrounding high frequency electrical components which is electrically and mechanically coupled to one or more guide rails near edges of a printed circuit board. The one or more guide rails of the printed circuit board include a ground trace on the top and/or bottom surfaces of the printed circuit board. The fiber optic module can be hot inserted into a module cage which has guide rail slots for mating with the guide rails of the fiber optic module. Through the guide rail slots, electromagnetic radiation from the fiber optic module is shunted to a ground plane to which the module cage is coupled on a host chassis ground. Standard singular fiber receptacles are used for the parallel data link modules to allow field cable termination.

Abstract: A method, system, and apparatus for testing one or more micro-magnetic switches on a wafer is described. A magnet is positioned adjacent to a first switch on the wafer. A probe card is positioned adjacent to the first switch. The probe card mounts a first set of probes and a second set of probes. The first set of probes interface with contact areas of a coil associated with the first switch. The second set of probes interface with conductors on the wafer associated with the cantilever of the first switch. A current source is electrically coupled to the first set of probes. The current source activates the coil of the first switch using the first set of probes to switch the cantilever from a first state to a second state. A switch state monitor is electrically coupled to the second set of probes. The switch state monitor determines whether the cantilever of the first switch is in the first state prior to the current source activating the coil of the first switch.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and NxN arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. An optical block implements lenses and reflecting surfaces to minimize manufacturing costs. The light receiver and light transmitter are mounted to receive and transmit non-orthogonal to the fiber axis to avoid optical cross talk. In one embodiment, receiver and transmitter are mounted at an angle greater than forty-five degrees with a perpendicular line to the reflective surfaces. In another embodiment, receiver and transmitter are mounted at an angle less than forty-five degrees with a perpendicular line to the reflective surfaces. The reflective surface for transmission may be a beam shaper to improve light beam uniformity and optical coupling and to avoid active alignment. The vertical boards have ground planes facing each other to minimize electrical cross talk. An optional shielded housing provides further shielding for reducing EMI.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers for a flush mounting in one embodiment and backward fingers for an extended mounting in another embodiment. The fingers can contact a bezel, faceplate or wall of host system to ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and grounded as well through a host system faceplate or otherwise to the chassis ground. A transmit ground for transmitter components and a receive ground for receiver components are isolated from the chassis ground.

Abstract: A fiber optic module for transferring data as pulses of light has an optical element with a first light transducer having a straddle mount lead and a second light transducer having a formed or bent signal lead. A first fiber optic receptacle optically couples to the first light transducer and a second fiber optic receptacle optically couples to a second light. A printed circuit board subassembly includes first and second printed circuit boards with an interconnection therebetween to couple to an electrical connector on the first. The first printed circuit board and second printed circuit boards are aligned so that the straddle mount leads couple to contacts on the first and the formed signal lead couple to contacts on the second. One or more electrical components in the fiber optic module process data for communication using light or photons over one or more optical fibers. An outer housing encloses the optical element subassembly and the printed circuit board subassembly.

Abstract: Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and transmit vertical boards respectively to nearly face each other but being offset to avoid optical cross talk. In a second embodiment, receiver and transmitter are mounted parallel with the printed circuit boards to save additional space. The vertical boards have ground planes to minimize electrical cross talk. A shielded housing provides further shielding for EMI. Manufacturing steps of the fiber optic transceiver are disclosed which provide reduced manufacturing costs.

Abstract: Methods and systems of assembling and making laminated electro-mechanical systems and structures are described. A plurality of structural layers are formed that include at least one structural layer having a movable element formed therein. The plurality of structural layers are stacked and aligned into a stack. Each structural layer in the stack is attached to an adjacent structural layer of the stack.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and N×N arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers for a flush mounting in one embodiment and backward fingers for an extended mounting in another embodiment. The fingers can contact a bezel, faceplate or wall of host system to ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and grounded as well through a host system faceplate or otherwise to the chassis ground. A transmit ground for transmitter components and a receive ground for receiver components are isolated from the chassis ground.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers for a flush mounting in one embodiment and backward fingers for an extended mounting in another embodiment. The fingers can contact a bezel, face-plate or wall of host system to ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and grounded as well through a host system faceplate or otherwise to the chassis ground. A transmit ground for transmitter components and a receive ground for receiver components are isolated from the chassis ground.

Abstract: A method, apparatus, and system to couple photons between optoelectronic devices and small form factor fiber connectors. An optical block includes refraction surfaces to narrow the distance between two or more light transmission paths through the optical block thereby enabling a module to be coupled to closely spaced fiber optic connectors. In one embodiment, light from a first light path through the optical block is refracted in the direction of a second light path through the optical block. Prior to intersecting the second light path, the light from the first light path is refracted again to provide the first light path closer to, but independent of, the second light path.

Abstract: Pluggable fiber optic modules having a receive printed circuit board and a transmit printed circuit board perpendicular with an interface printed circuit board with an edge connection. The edge connection of the interface printed circuit board to plug into and out from an edge connector of a host printed circuit board. A transmitter optoelectronic device is coupled to the transmit printed circuit board. A receiver optoelectronic device is coupled to the receive printed circuit board. The pluggable fiber optic modules may further include a support base, a nose receptacle, and an alignment plate.