Abstract: Systems and methods for actuating micro-magnetic latching switches in an array of micro-magnetic latching switches are described. The array of switches is defined by Y rows aligned with a first axis and X columns aligned with a second axis. Each switch in the array of switches is capable of being actuated by a coil. In an aspect, a row of coils is moved along the second axis to be positioned adjacent to a selected one of the Y rows of switches. A sufficient driving current is proved to a selected coil in the row of coils to actuate a selected switch in the selected one of the Y rows of switches. In another aspect, a plurality of first axis drive signals and a plurality of second axis drive signals are generated. These signals drive an array of coils, wherein each coil in the array of coils is positioned adjacent to a corresponding switch in the array of switches. Each first axis drive signal is coupled to coils in a corresponding column of coils in the array of coils.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, backplate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, back-plate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, back-plate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

Abstract: A micro-machined magnetic latching switch is described. A moveable micro-machined cantilever has a magnetic material and a longitudinal axis. The cantilever has a conducting layer. A permanent magnet produces a first magnetic field, which induces a magnetization in the magnetic material. The magnetization is characterized by a magnetization vector pointing in a direction along the longitudinal axis of the cantilever. The first magnetic field is approximately perpendicular to longitudinal axis. A three-dimensional solenoid coil produces a second magnetic field to switch the cantilever between a first stable state and a second stable state. The temporary current is input to the three-dimensional solenoid coil, producing the second magnetic field such that a component of the second magnetic field parallel to the longitudinal axis changes direction of the magnetization vector. The cantilever is thereby caused to switch between the first stable state and the second stable state.

Abstract: A method, apparatus, and system to couple photons between optoelectronic devices and small form factor fiber connectors. An optical block includes refraction surfaces to narrow the distance between two or more light transmission paths through the optical block thereby enabling a module to be coupled to closely spaced fiber optic connectors. In one embodiment, light from a first light path through the optical block is refracted in the direction of a second light path through the optical block. Prior to intersecting the second light path, the light from the first light path is refracted again to provide the first light path closer to, but independent of, the second light path.

Abstract: Pluggable fiber optic modules having a receive printed circuit board and a transmit printed circuit board perpendicular with an interface printed circuit board with an edge connection. The edge connection of the interface printed circuit board to plug into and out from an edge connector of a host printed circuit board. A transmitter optoelectronic device is coupled to the transmit printed circuit board. A receiver optoelectronic device is coupled to the receive printed circuit board. The pluggable fiber optic modules may further include a support base, a nose receptacle, and an alignment plate.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, backplate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers for a flush mounting in one embodiment and backward fingers for an extended mounting in another embodiment. The fingers can contact a bezel, face-plate or wall of host system to ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and grounded as well through a host system faceplate or otherwise to the chassis ground. A transmit ground for transmitter components and a receive ground for receiver components are isolated from the chassis ground.

Abstract: Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and transmit vertical boards respectively to nearly face each other but being offset to avoid optical cross talk. In a second embodiment, receiver and transmitter are mounted parallel with the printed circuit boards to save additional space. The vertical boards have ground planes to minimize electrical cross talk. A shielded housing provides further shielding for EMI. Manufacturing steps of the fiber optic transceiver are disclosed which provide reduced manufacturing costs.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and N×N arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and N×N arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and NxN arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: Multiple board fiber optic modules and methods related thereto. Fiber optic modules include one or more vertical printed circuit boards and/or one or more horizontal printed circuit boards and/or one or more slanted printed circuit boards. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk. Horizontal, vertical, and N×N arrays of fiber optic channels in fiber optic modules. Fiber optic modules including a mini back plane for edge connecting printed circuit boards.

Abstract: Fiber optic modules and methods of assembly of fiber optic modules. Fiber optic modules include one or more printed circuit boards arranged at a an angle with a base. The one or more printed circuit boards are parallel to optical axis of one or more optoelectronic devices such as a receiver or transmitter. The one or more printed circuit boards may include a ground plane to minimize electrical cross talk. A shielded housing or cover provides shielding for electromagnetic interference. The base or shielded housing or cover may include a septum to separate the fiber optic modules into a first side and a second side and provide additional shielding to minimize crosstalk.

Abstract: Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and transmit vertical boards respectively to nearly face each other but being offset to avoid optical cross talk. In a second embodiment, receiver and transmitter are mounted parallel with the printed circuit boards to save additional space. The vertical boards have ground planes to minimize electrical cross talk. A shielded housing provides further shielding for EMI. Manufacturing steps of the fiber optic transceiver are disclosed which provide reduced manufacturing costs.

Abstract: An array of OEDs is arranged in rows and columns with a plurality of row buses and a plurality of column buses. Each of the OEDs has a first terminal coupled to an associated row bus and a second terminal coupled to an associated column bus. A switching circuit is connected to a shadow canceling row bus of the plurality of row buses. The switching circuit is constructed to receive a shadow canceling signal on a terminal thereof and to connect the shadow canceling row bus to a pull down potential in response to the shadow canceling signal, whereby all of the OEDs in the array, other than those associated with the shadow canceling row bus, are coupled to the pull down potential and discharged.

Abstract: A method of fabricating an organic electroluminescent array and the array are disclosed. Column buses of indium-tin-oxide (ITO) are formed on a light transparent substrate and a resistor network is simultaneously formed of the ITO. An array of organic electroluminescent devices is formed on the column buses with each column bus connected to a terminal of each device in an associated column of devices. Row buses are formed on the organic electroluminescent devices with each row bus connected to a second terminal of each device in an associated row of devices and, simultaneously, the resistor network is connected to the row buses. The resistor network is part of a "pull up" circuit integrally formed with the organic electroluminescent devices to dynamically reverse bias the devices and neutralize forward bias voltage of a scan of the devices.

Abstract: A phase spatial light modulator composed of a liquid crystal cell having molecular orientation recorded during the fabrication process as a direct result of a photochemical reaction exerted upon the liquid crystal material, a mechanically-induced change of a liquid crystal alignment layer, or by varying a plurality of polymer materials that compose the liquid crystal alignment layer, thereby affecting the liquid crystal material contained within the cell. The modulator, or scanner, thereby capable of altering the phase, thus steering light passing therethrough. During operation, the liquid crystal molecules deflect the light beam passing therethrough based on their orientation as recorded during fabrication when the applied voltage is "OFF" or in an altered state when the applied voltage is "ON".

Abstract: A hard plastic card display device including a hard plastic card having a major surface and a driver circuit. A display, including a plurality of inverted organic light emitting diodes, is formed on the major surface and coupled to the driver circuit.