Patents by Inventor Cheng-Po Yu
Cheng-Po Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10616992Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: December 20, 2017Date of Patent: April 7, 2020Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu
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Patent number: 10433413Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.Type: GrantFiled: August 15, 2014Date of Patent: October 1, 2019Assignee: Unimicron Technology Corp.Inventors: Cheng-Po Yu, Ming-Chia Li
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Patent number: 10314179Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: GrantFiled: June 21, 2018Date of Patent: June 4, 2019Assignee: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
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Publication number: 20180302992Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: ApplicationFiled: June 21, 2018Publication date: October 18, 2018Applicant: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
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Patent number: 10051748Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: GrantFiled: January 18, 2016Date of Patent: August 14, 2018Assignee: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
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Publication number: 20180160543Abstract: A manufacturing method of a circuit board including the following steps is provided. A first patterned circuit layer is formed on a surface of a circuit substrate, and the first patterned circuit layer exposes a portion of the surface of the circuit substrate. A patterned glue layer is formed on the portion of the surface of the circuit substrate exposed by the first patterned circuit layer. A second patterned circuit layer is transfer-printed on the corresponding patterned glue layer. In addition, a structure of the circuit board is also mentioned.Type: ApplicationFiled: February 13, 2017Publication date: June 7, 2018Applicant: Unimicron Technology Corp.Inventors: Po-Hsuan Liao, Chi-Min Chang, Cheng-Po Yu
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Publication number: 20180116056Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: December 20, 2017Publication date: April 26, 2018Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Patent number: 9883598Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: October 10, 2016Date of Patent: January 30, 2018Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu
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Patent number: 9805875Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.Type: GrantFiled: May 6, 2015Date of Patent: October 31, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Patent number: 9739963Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.Type: GrantFiled: May 12, 2016Date of Patent: August 22, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
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Publication number: 20170229248Abstract: A manufacturing method for a capacitor is provided. The method includes the following steps. A nano carbon material and an electrolyte solution are mixed to obtain an electrolyte composition. A porous substrate is immersed in the electrolyte composition. The electrodes are formed on two opposite surfaces of the porous substrate.Type: ApplicationFiled: April 25, 2017Publication date: August 10, 2017Applicant: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Publication number: 20170164468Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: ApplicationFiled: January 18, 2016Publication date: June 8, 2017Inventors: HUNG-LIN CHANG, MING-HAO WU, SYUN-SIAO CHANG, CHENG-PO YU, CHI-MIN CHANG
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Publication number: 20170129454Abstract: A safety system for preventing a living body from being locked in a vehicle comprises a warning unit, a detection device and a limiting device. The detection device is disposed in a passenger's protection device which has to be used by a passenger when the vehicle is being driven. The detection device detects whether the passenger's protection device is in use or not to generate a corresponding detection signal. The warning unit turns on or turns off a warning device according to the detection signal and generates a corresponding control signal. The limiting device locks the vehicle key in the key slot or to release the vehicle key from the key slot according to the control signal after the vehicle has been parked.Type: ApplicationFiled: November 10, 2015Publication date: May 11, 2017Inventors: Pei-Chang HUANG, Cheng-Po YU
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Patent number: 9635757Abstract: A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.Type: GrantFiled: August 11, 2016Date of Patent: April 25, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Chi-Min Chang, Cheng-Po Yu
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Patent number: 9581774Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.Type: GrantFiled: May 26, 2016Date of Patent: February 28, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
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Publication number: 20170034925Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: October 10, 2016Publication date: February 2, 2017Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Publication number: 20160363974Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: August 25, 2016Publication date: December 15, 2016Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Patent number: 9514629Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.Type: GrantFiled: April 7, 2015Date of Patent: December 6, 2016Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Publication number: 20160329154Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.Type: ApplicationFiled: May 6, 2015Publication date: November 10, 2016Inventors: Yin-Ju Chen, Cheng-Po Yu
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Patent number: 9491865Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: April 24, 2015Date of Patent: November 8, 2016Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu