Patents by Inventor Cheng Shen

Cheng Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971565
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: April 30, 2024
    Assignees: PTOT (SUZHOU) INC., PLATINUM OPTICS TECHNOLOGY INC.
    Inventors: Chung-Han Lu, Hsiao-Ching Shen, Chun-Cheng Hsieh, Ming-Zhan Wang
  • Publication number: 20240138272
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first conductive structure over a substrate. A data storage structure overlies the first conductive structure. The data storage structure comprises a first dielectric layer on the first conductive structure and a second dielectric layer on the first dielectric layer. The first dielectric layer comprises a dielectric material and a first dopant having a concentration that changes from a top surface of the first dielectric layer in a direction towards the first conductive structure. A second conductive structure overlies the data storage structure.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Fa-Shen Jiang, Cheng-Yuan Tsai, Hai-Dang Trinh, Hsing-Lien Lin, Hsun-Chung Kuang, Bi-Shen Lee
  • Patent number: 11961545
    Abstract: Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh, Cheng-Yuan Tsai
  • Patent number: 11961724
    Abstract: The present disclosure provides a thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier and a shielding device, wherein a portion of the shielding device and the carrier are disposed within the reaction chamber. The shielding device includes a first-shield member, a second-shield member and a driver. The driver interconnects the first-shield member and the second-shield member, for driving the first-shield member and the second-shield member to move in opposite directions. During a deposition process, the driver swings the shield members away from each other into an open state. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier, such that to prevent polluting the carrier during the process of cleaning the thin-film-deposition equipment.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 16, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Yu-Te Shen
  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Patent number: 11953738
    Abstract: The present invention discloses a display including a display panel and a light redirecting film disposed on the viewing side of the display panel. The light redirecting film comprises a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at the bottom of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 9, 2024
    Assignee: BenQ Materials Corporation
    Inventors: Cyun-Tai Hong, Yu-Da Chen, Hsu-Cheng Cheng, Meng-Chieh Wu, Chuen-Nan Shen, Kuo-Jung Huang, Wei-Jyun Chen, Yu-Jyuan Dai
  • Publication number: 20240113345
    Abstract: A battery module and a short protection method thereof are provided. The battery module has a battery cell pack and a control circuit. The method includes: detecting a temperature of the battery cell pack as a battery cell temperature through the control circuit; determining whether the battery cell temperature shows a downward trend when the battery cell temperature is higher than a first predetermined temperature value; and deactivating the battery module when the battery cell temperature does not show the downward trend.
    Type: Application
    Filed: May 23, 2023
    Publication date: April 4, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chunyen Lai, Yu-Cheng Shen, Chun Tsao, Chaochan Tan, Huichuan Lo, Wen-Che Chung, Ming Hung Yao
  • Publication number: 20240106122
    Abstract: A near-field communication (NFC) antenna system comprising an antenna, a plurality of chips, and an antenna matching network connected on one side to the plurality of chips and on another side to the antenna. Wherein only one of the plurality of chips is active at a time with inactive chips have an impedance set combined with the antenna matching network to provide antenna matching with the active chip. The NFC antenna inactive chips are set to open having a corresponding impedance and the impedance is set based on any of transmission line length, width, and gap between. The plurality of chips includes a charging chip and a payment chip.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Miroslav Samardzija, Hsiangyin Cheng, Shu Chun Shen, Liem Hieu Dinh Vo
  • Publication number: 20240105128
    Abstract: A method for driving an electronic device includes the following steps: receiving a first image data, detecting a first frame rate corresponding to the first image data, generating at least one first scanning signal according to the first image data, receiving a second image data, detecting a second frame rate corresponding to the second image data, and generating at least one second scanning signal according to the second image data. The at least one first scanning signal has a first high voltage level value. The at least one second scanning signal has a second high voltage level value. When the first frame rate is different from the second frame rate, the first high voltage level value is different from the second high voltage level value.
    Type: Application
    Filed: August 16, 2023
    Publication date: March 28, 2024
    Inventors: Yu-Lin HSIEH, Chien-Hao KUO, Cheng-Shen PAN
  • Patent number: 11939486
    Abstract: An aqueous dispersion of polymeric particles comprising an emulsion polymer and a polyalkylene oxide with a weight average molecular weight in the range of 450 to 1,500 g/mole, and an aqueous coating composition with low VOCs comprising the aqueous dispersion and providing coatings made therefrom with improved water whitening resistance and hardness.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: March 26, 2024
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Yan Li, Junyu Chen, Cheng Shen, James C. Bohling, Zhi Juan Gong, Tao Wang
  • Publication number: 20240094793
    Abstract: Apparatuses, systems, and techniques to optimize processor performance. In at least one embodiment, a method increases an operation voltage of one or more processors, based at least in part, on one or more error rates of the one or more processors.
    Type: Application
    Filed: June 23, 2022
    Publication date: March 21, 2024
    Inventors: Benjamin D. Faulkner, Padmanabhan Kannan, Srinivasan Raghuraman, Peng Cheng Shen, Divya Ramakrishnan, Swanand Santosh Bindoo, Sreedhar Narayanaswamy, Amey Y. Marathe
  • Publication number: 20240086109
    Abstract: A data writing method, a memory storage device, and a memory control circuit unit are provided. The method includes: receiving a write command from a host system, and the write command including first data; checking a status of a first physical programming unit in a first physical erasing unit; in response to the status of the first physical programming unit being a first status, sending a first command sequence to a rewritable non-volatile memory module, and the first command sequence being configured to instruct the rewritable non-volatile memory module to store at least part of the first data to the first physical programming unit.
    Type: Application
    Filed: October 17, 2022
    Publication date: March 14, 2024
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Wei-Cheng Li, Yu-Chung Shen, Jia-Li Xu, Ping-Cheng Chen
  • Publication number: 20240087917
    Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Ji CHEN, Chih-Shen YANG, Cheng-Yi HUANG
  • Publication number: 20240079263
    Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.
    Type: Application
    Filed: February 22, 2023
    Publication date: March 7, 2024
    Inventors: Kai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Yuan-Cheng KUO, Chih-Hsiung HUANG, Wen-Chih CHIANG
  • Publication number: 20240078422
    Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.
    Type: Application
    Filed: June 29, 2023
    Publication date: March 7, 2024
    Inventors: Huaiyu Meng, Yichen Shen, Yelong Xu, Gilbert Hendry, Longwu Ou, Jingdong Deng, Ronald Gagnon, Cheng-Kuan Lu, Maurice Steinman, Mike Evans, Jianhua Wu
  • Publication number: 20240077755
    Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Inventors: Huaiyu Meng, Cheng-Kuan Lu, Jonathan Terry, Jingdong Deng, Maurice Steinman, Gilbert Hendry, Yichen Shen
  • Patent number: 11922654
    Abstract: A computer device, obtains a mammographic image of a unilateral breast. The mammographic image includes a cranial-caudal (CC)-position mammographic image and a mediolateral-oblique (MLO)-position mammographic image. The computer device invokes a breast detection model to perform a prediction of a condition of the unilateral breast according to the CC-position mammographic image and the MLO-position mammographic image. The device obtains a prediction result of the unilateral breast, and generates and outputs a detection report that includes the prediction result.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 5, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Kuan Tian, Cheng Jiang, Kezhou Yan, Rongbo Shen
  • Publication number: 20240068089
    Abstract: The invention provides a deposition equipment with a shielding mechanism, which includes a reaction chamber, a carrier, a cover ring and a shielding mechanism. The shielding mechanism includes a first bearing arm, a second bearing arm, a first shielding plate and a second shielding plate. The first and second shielding plates are respectively placed on the first and second bearing arms. There are corresponding alignment units between the lower surface of the first and second shielding plates and the upper surface the carrier, so that the first and second shielding plates can be aligned with the carrier. There is also a corresponding alignment unit between the upper surface of the first and second shielding plates and the lower surface the cover ring, so that the cover ring can be aligned with the first and second shielding plates to define a cleaning space in the reaction chamber.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: JING-CHENG LIN, YU-TE SHEN
  • Patent number: 11869850
    Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: January 9, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Lee-Cheng Shen, Chao-Hsuan Wang, Po-Sheng Huang
  • Publication number: 20240005799
    Abstract: A drone communication system and an operation method thereof are provided. The operation method of the drone communication system is applicable for obtaining a plurality of base station coordinates corresponding to a plurality of base stations in a flight field. The operation method includes the following steps: communicating with at least three base stations adjacent to a parking apron apparatus to obtain at least three base station coordinates of the at least three base stations; communicating with another base station adjacent to the at least three base stations through the at least three base stations; estimating another base station coordinate of the another base station according to the at least three base station coordinates of the at least three base stations; and storing the plurality of base station coordinates and providing the plurality of base station coordinates to a drone parked on the parking apron apparatus.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Applicant: Coretronic Intelligent Robotics Corporation
    Inventors: Cheng-Shen Lee, Chih-Neng Tseng, Kuan-Chou Ko