Patents by Inventor Cheng-Tien Lai

Cheng-Tien Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060137863
    Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).
    Type: Application
    Filed: August 15, 2005
    Publication date: June 29, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-Jian Wen
  • Publication number: 20060126301
    Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.
    Type: Application
    Filed: December 14, 2004
    Publication date: June 15, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Bo-Tao Wang
  • Patent number: 7061764
    Abstract: A clip (10) includes a main body (20), a buckling piece (40), and a camming member (30). The main body includes a pressing part (22), a first leg (24) extending downwardly from one end of the pressing part, and a supporting portion (26) extending horizontal from an opposite end of the pressing part. The supporting portion defining a hole. The cam member located above the supporting portion which comprises a cam (32) and a handle (34) extending from the cam for rotating the cam. The buckling piece located below the supporting portion which comprises a connecting part (42) and a second leg (44) extending from the connecting part. The connecting part move up through the hole of the supporting portion to pivotally connect with the cam, and the heak sink can be secured to the electronic device by rotating the cam to a locked position from an unlocked position.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: June 13, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Tien Lai, LiangHui Li
  • Publication number: 20060120053
    Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
    Type: Application
    Filed: August 23, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Shao-Long Zhai, Zhi-Yong Zhou
  • Publication number: 20060118276
    Abstract: A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integratedly from the plate body, a bearing part depending from the interval part, a lateral position portion and a detaining portion extend continuously from the bearing part. A tab is formed on each detaining portion. The fins are combined in such a manner that the bearing part of each fin bears against an adjacent fin; the plate body of each fin is sandwiched between the bearing part and the detaining portion of each locking structure of an adjacent fin, and between the lateral position portions of a pair of locking structures of the adjacent fin, the tabs of each fin bear against the corresponding interval parts of the adjacent fin.
    Type: Application
    Filed: May 24, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Tecnology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Publication number: 20060104032
    Abstract: A heat dissipation device for an electronic unit includes a heat sink and at least a heat pipe. The heat sink includes a base for contacting with the electronic unit and a plurality of fins arranged on the base to create a first heat transfer path for the electronic unit. The heat pipe is attached to the heat sink and includes an evaporating portion for contacting with the electronic unit, and a condensing portion thermally contacting with the fins to create a second heat transfer path for the electronic unit.
    Type: Application
    Filed: November 16, 2004
    Publication date: May 18, 2006
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-jian Wen
  • Publication number: 20060096743
    Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a base (11) and a liquid inlet port (18) in communication with the container (14). The base (11) comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid, and the rough surface is opposing to the heat-absorbing surface.
    Type: Application
    Filed: March 2, 2005
    Publication date: May 11, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 7028761
    Abstract: A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: April 18, 2006
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Shi Wen Zhou
  • Patent number: 7013959
    Abstract: A liquid cooling system includes a heat absorbing unit (4) defining a chamber therein for containing coolant, and a heat dissipation unit (2) comprising a liquid circulation module (20) in flow communication with the heat absorbing unit, and a plurality of cooling fins (27). The liquid circulation module comprises first and second hollow cooling bodies (21, 23) cooperatively defining a space therebetween to receive the cooling fins, and a pump (24) coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: March 21, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Zhi Yong Zhou
  • Publication number: 20060051222
    Abstract: A miniature pump in accordance with the present invention comprises a pump casing (1) and a liquid circulating unit (2) received in the pump casing. The pump casing defines an enclosed space (15) for storing liquid therein. A spacing plate (12) is arranged in the pump casing to divide the enclosed space into a first chamber (16) and a second chamber. The spacing plate defines a through opening (122) at a center portion thereof to make the first and second chambers communicate with each other. An inlet (104) and an outlet (110) are formed on the pump casing respectively communicating with the first and second chambers. The liquid circulating unit is mounted in the second chamber for circulating the liquid in a liquid cooling system.
    Type: Application
    Filed: February 1, 2005
    Publication date: March 9, 2006
    Applicant: Foxconn Technology Co.,Ltd
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Publication number: 20060021737
    Abstract: A liquid cooling device includes a hollow heat absorbing unit (2) containing liquid therein, a first heat exchange body (32) and a second heat exchange body (34). The first heat exchange body defines isolated first and second rooms (330, 331) therein. The second heat exchange body defines flow-communicated first and second chambers (350, 351) therein. The first chamber is communicated to the first room, and the second chamber is communicated to the second room. The liquid cooling device further includes a pump (4) fluidly connected between the heat absorbing unit and the second room, and a pipe (7) fluidly connecting the heat absorbing unit and the first room.
    Type: Application
    Filed: June 28, 2005
    Publication date: February 2, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 6988536
    Abstract: A heat dissipation device includes a base (10), a tube (20), a fin member, a fan (50) and a heat pipe (60). The tube, the fin member and the heat pipe are all in contact with the base, for absorbing heat away from the base. The fin member and the fan are juxtaposed with each other along an axial direction of the tube. The fan blows air toward the fin member and enhances airflow within the heat dissipation device. The tube prevents the air from the fan from being dispersed, so that complete uniform airflow through the heat dissipation is maintained.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: January 24, 2006
    Assignee: Hon Hai Precision Ind. Co., LTD
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Alan Zhou
  • Publication number: 20060005953
    Abstract: A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10).
    Type: Application
    Filed: February 25, 2005
    Publication date: January 12, 2006
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Publication number: 20050276703
    Abstract: A miniature pump includes a pump casing (1) defining therein an inner space with an inlet (104) and an outlet (110) both being in flow communication with the inner space, a liquid circulating unit (2) having an impeller (26) received in the inner space, a motor driving unit (3) received in the inner space to drive the impeller to rotate, and a partition wall (14) arranged in the pump casing to space the liquid circulating unit and the motor driving unit. The impeller carries a first permanent magnet (260). The motor driving unit includes a motor having a rotor (34) and a second permanent magnet (340) attached to the rotor. The second permanent magnet corresponds to the first permanent magnet with a flux gap formed therebetween. Each of the first and second permanent magnets has a plurality of alternating N and S poles.
    Type: Application
    Filed: December 17, 2004
    Publication date: December 15, 2005
    Applicant: HON HAI Precision Industry CO., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Publication number: 20050241804
    Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port (18), and radiuses of the funnel-shaped channel are descended along a liquid flow direction.
    Type: Application
    Filed: March 1, 2005
    Publication date: November 3, 2005
    Applicant: Foxconn Technology Co.,Ltd
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 6935410
    Abstract: A heat sink assembly includes a fan (10), a heat sink (20) and a mounting device (50). The heat sink includes a base (22) and plural of fins (24) extending upwardly from the base. Plural of claws (26) are formed in a top end of one fin which extends from a side of the base. A locking hole (30) is defined in another fin which extends from an opposite side of the base. A vent (52) is defined in the center of the mounting device, and four fixing holes (54) are defined in four comers of the mounting device for engaging with four screws (14) which extend through the fan to the mounting device. Plural of pivots (56) are provided in a first side of the mounting device for pivotably received in the claws of the heat sink thereby pivotably attaching the mounting device to the heat sink. A hook (62) is provided in an opposite side of the mounting device for engaging with the locking hole of the heat sink thereby fixing the mounting device to the heat sink.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: August 30, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Shi Wen Zhou
  • Patent number: 6924984
    Abstract: A heat sink clip comprises a connecting member (12), two pressing members (14) connecting to the connection member, each of the pressing members comprising a pressing portion (141) and two spring portions (142, 143) extending from opposite ends of the pressing portion, a first locking portion (144) depending from one of the spring portions of each pressing member, two operating members (16) each having spaced first and second pivot means, the second pivot means being below the first pivot means, the operating members respectively pivotably connected to the other one of the spring portions, and two second locking portions (18) respectively pivotably connected to the operating members. When the operating members are rotated downwardly, the first and second locking portions are raised, adapted for engaging with a retention frame and securing a heat sink to an electronic package.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: August 2, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Tony Zhou
  • Publication number: 20050141198
    Abstract: A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.
    Type: Application
    Filed: September 21, 2004
    Publication date: June 30, 2005
    Inventors: Hsieh Lee, Cheng-Tien Lai, Zhi-Bin Tan
  • Publication number: 20050111197
    Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
    Type: Application
    Filed: September 21, 2004
    Publication date: May 26, 2005
    Inventors: Hsieh Lee, Cheng-Tien Lai, Shi-Wen Zhou
  • Publication number: 20050103475
    Abstract: A liquid cooling system includes a heat absorbing unit (4) defining a chamber therein for containing coolant, and a heat dissipation unit (2) comprising a liquid circulation module (20) in flow communication with the heat absorbing unit, and a plurality of cooling fins (27). The liquid circulation module comprises first and second hollow cooling bodies (21, 23) cooperatively defining a space therebetween to receive the cooling fins, and a pump (24) coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.
    Type: Application
    Filed: August 19, 2004
    Publication date: May 19, 2005
    Inventors: Hsieh Lee, Cheng-Tien Lai, Zhi Zhou