Liquid cooling device

A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10).

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Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.

2. Description of Related Art

Liquid cooling devices were commonly utilized to cool huge systems such as furnaces. Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.

Generally, a liquid cooling device comprises a casing, forming a liquid container made of metal material. The casing comprises a base and a lid covering the base. The base is for contacting a wait-to-be-cooled component and comprises an upper surface. The lid comprises a liquid outlet and a liquid inlet. Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank. The liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.

However, the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited. As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.

In order to achieve the object set out above, a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing, a liquid inlet port and a liquid outlet port in communication with the casing. The casing comprises a heat-absorbing base. The base comprises a porous layer interior of the casing.

Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention;

FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1;

FIG. 3 is a cross-sectional view of FIG. 2, taken along line III-III; and

FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1-3, a liquid cooling device for a heat-generating component in accordance with a preferred embodiment of the present invention comprises a casing 10, and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50 to form a cooling liquid circulation system.

The casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation. The base 11 and the lid 12 are hermetizated by calk packing, shim, or seal, for keeping the liquid from leaking out of the container 14. A pair of tubular connectors, for connecting the pipes 100, 200 to the casing 10, extends outwardly from the lid 12. The connectors are respectively named as liquid inlet port 18 and liquid outlet port 19, according to the directions along which the liquid flows in the connectors. The liquid inlet port 18 is disposed at a middle of the lid 12.

The container 14, the liquid outlet pipe 100, the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid. The actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1.

For promoting the cooling efficiency of the device, a radiator is arranged on the liquid circulation route. A fin member 30 is an example of the radiator. In the preferred embodiment of the present invention, a portion of the liquid outlet pipe 100 enters into the fin member 30, so that heat, still contained in the liquid after naturally cooled in the casing 10, is removed to the fin member 30 and is dissipated to ambient air. Thus, the liquid is extremely cooled before entering the container 14 for a subsequent circulation. Understandably, a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30.

FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention. The base 11 comprises a porous layer 16. The layer 16 defines a plurality of minute pores therein by sintering metal powder. This structure increases surface between the layer 16 and the liquid. Heat exchange surface between the base 11 and the liquid is increased accordingly In use, the liquid enters into the container 14 from the liquid inlet port 18. The liquid flows in the layer 16 to sufficiently absorb heat from the base 11, so that heat exchange efficiency between the liquid and the base 11 is improved.

Moreover, it is understood that the layer 16 of the base 11 can be other porous metal layer, such as foaming metal.

For showing clearly, the casing 10, the fin member 30 and the actuator 50 are positioned separately, and connected by the 100, 200 in the preferred embodiment of the present invention. However, it is also understood that the fin member 30 can be directly positioned on the casing 10, and the actuator 50 can be positioned within the fin member 30, without the liquid outlet pipe 100 and the liquid inlet pipe 200, to thereby save space occupied by the liquid cooling device.

It is understood that the invention may be embodied in other forms without departing from the spirit thereof Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims

1. A liquid cooling device comprising:

a casing comprising a heat-absorbing base, the base comprising a porous layer interior of the casing;
liquid accommodated in the casing;
an actuator,
pipes connecting the casing and the actuator,
a liquid inlet port which renders the liquid to enter the casing; and
a liquid outlet port which allows the liquid to leave the casing when actuated by the actuator.

2. The liquid cooling device of claim 1, wherein the layer is made of sintered metal powder.

3. The liquid cooling device of claim 1, wherein the layer is made of foaming metal.

4. The liquid cooling device of claim 1, further comprising a heat sink connected to the pipes.

5. A liquid cooling device for a heat-generating component, comprising:

a casing disposed next to said component, comprising a heat-absorbing base thermally contacting with said component for heat transmission from said component via said base, and a container used to receive cooling liquid therein;
a cooling liquid circulation system connected to said casing and in communication with said container for said cooling liquid so as to urge said cooling liquid flowing into said container for said heat transmission and out of said container for heat dissipation; and
at least one porous layer formed in said casing next to said base and in communication with said container so that liquid in said container is accessible and containable in said layer for said heat transmission.

6. The liquid cooling device of claim 5, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.

7. A method for cooling a heat-generating component, comprising the steps of

providing a casing having a cooling-liquid-receivable container and a heat-absorbing base disposed next to said container for thermally contacting with said component;
circulating cooling liquid between said casing and a radiator so that said cooling liquid absorbs heat from said component via said base in said container and dissipates said heat via said radiator, and
sucking said cooling liquid via a porous layer formed in said casing next to said base for enhancing heat absorption of said liquid in said container.

8. The method of claim 7, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.

Patent History
Publication number: 20060005953
Type: Application
Filed: Feb 25, 2005
Publication Date: Jan 12, 2006
Applicant: Foxconn Technology Co., Ltd (Tu-Cheng City)
Inventors: Hsieh-Kun Lee (Tu-Cheng), Cheng-Tien Lai (Tu-Cheng), Zhi-Yong Zhou (Shenzhen)
Application Number: 11/066,779
Classifications
Current U.S. Class: 165/104.330
International Classification: F28D 15/00 (20060101);