Patents by Inventor Cheng Tu Wang

Cheng Tu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090279262
    Abstract: A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Inventors: Meng-Cheng HUANG, Cheng-Tu Wang
  • Publication number: 20090260793
    Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicated with the vapor channel are formed in the chamber. The heat-absorption part is formed on the metal tube and corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and the liquid channel of the heat-absorption part. The working fluid is filled in the chamber.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Tsai CHANG
  • Publication number: 20090260785
    Abstract: In a heat plate having a hollow plate and capillary supporting structures, the plate body includes a capillary tissue attached on an internal wall of the plate body, and each of the capillary supporting structures is erected, supported and distributed in the plate body. Each capillary supporting structure is in a cylindrical shape and has a capillary object made of sintered powder and disposed on the circumferential surface of the cylindrical capillary supporting structure and contacted with the capillary tissue to form a continuous capillary channel and provide a capillary action to the capillary supporting structures in the heat plate.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu Wang, Pang-Hung Liao
  • Publication number: 20090260790
    Abstract: In metal tubes for heat pipes and a method of manufacturing the metal tubes, a metal tube includes a tube defining an inner space, and at least one dividing portion extruding from an inner sidewall of the metal tube. The at least one dividing portion divides the inner space into a vapor channel and a liquid channel connected to the vapor channel. The metal tubes can prevent heat pipe form being dried out and improve heat dissipation efficiency of heat pipes.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG
  • Publication number: 20090109620
    Abstract: A heat-dissipating device of a portable electronic apparatus includes a heat-conducting plate disposed on a heat-generating element. One end of a heat-conducting pipe is disposed on the heat-conducting plate, and the other end of the heat-conducting pipe is disposed on a surface of a power generator to form a high-temperature source. The opposite surface of the power generator is fixedly disposed on a heat-dissipating body to form a low-temperature source. A heat-dissipating fan is provided on one side of the heat-dissipating body. The positive and negative lines of the heat-dissipating fan are electrically connected to the positive and negative lines of the power generator.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuan-Ming Lai
  • Publication number: 20090095460
    Abstract: A capillary structure includes a bare core shown as a long rod shape; and a capillary layer wound around the bare core and covered a surrounding thereof. The capillary layer is constructed by strands that are woven in a plurality of directions (i.e. curly interwoven) and continuously wound around an outer surrounding of the bare core. In the meantime, each woven strands is a strand bundled from a weaving material.
    Type: Application
    Filed: October 11, 2007
    Publication date: April 16, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng
  • Patent number: 6657865
    Abstract: A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one rim and a hooking projection on an opposite rim. The metallic fins thereby assemble with one another by engagement of the hooking projection of one fin with the groove of one neighboring fin. Below the first folded edge, each fin further forms an inclined edge. The second folded edges of the fins are further in contact with a highly thermal conductive body. With the metallic fins being assembled with one another, a plurality of gaps are constituted between their inclined edges. Via a fan, the air circulation through the gaps is thereby promoted to rapidly dissipate the heat and prevent the hothouse effect.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: December 2, 2003
    Assignee: Wuh Chuong Indutrial Co., Ltd.
    Inventors: Wen Hai Tseng, Cheng Tu Wang, Jian Chian Kang