Patents by Inventor Cheng Tu Wang
Cheng Tu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180031329Abstract: A heat dissipating device applied to a heat generating element includes a cooling device, a vapor chamber and a heat pipe, and the vapor chamber is attached to the heat generating element, and the heat pipe is thermally coupled to the cooling device and communicated with the vapor chamber, and the heat pipe has at least one flexible portion. The heat pipe may be bent or deformed at any angle or in any direction through the flexible portion, so that the heat pipe can be installed and aligned and the height difference can be adjusted with respect to the cooling device, the vapor chamber and the heat generating element in a better way. In the meantime, the heat dissipating device has a shock absorbing capability.Type: ApplicationFiled: July 26, 2016Publication date: February 1, 2018Inventors: Cheng-Tu WANG, Shih-Ming WANG, Wen-Wei TAI
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Patent number: 9726436Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.Type: GrantFiled: July 21, 2015Date of Patent: August 8, 2017Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
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Patent number: 9689623Abstract: A flat heat pipe includes a tube, a sealed section, an insulation section and a heat conduction section. The tube includes a metal shell and a chamber. The sealed section is formed by rolling the metal shell and making two opposite inner walls of the tube combined closely on the tube that separate the chamber into a first chamber and a second chamber. The insulation section is a hollow chamber including the first chamber. The conduction section includes the second chamber, a capillary and working fluid. Further, the heat conduction device includes a heat dissipating shell, a heating element and a flat heat pipe. The plate heat pipe is disposed in the heat dissipating shell and thermally conducted with the heating element.Type: GrantFiled: November 5, 2015Date of Patent: June 27, 2017Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Kuan-Ming Lai, Cheng-Tu Wang
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Publication number: 20170131036Abstract: A flat heat pipe includes a tube, a sealed section, an insulation section and a heat conduction section. The tube includes a metal shell and a chamber. The sealed section is formed by rolling the metal shell and making two opposite inner walls of the tube combined closely on the tube that separate the chamber into a first chamber and a second chamber. The insulation section is a hollow chamber including the first chamber. The conduction section includes the second chamber, a capillary and working fluid. Further, the heat conduction device includes a heat dissipating shell, a heating element and a flat heat pipe. The plate heat pipe is disposed in the heat dissipating shell and thermally conducted with the heating element.Type: ApplicationFiled: November 5, 2015Publication date: May 11, 2017Inventors: Kuan-Ming LAI, Cheng-Tu WANG
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Publication number: 20170108285Abstract: A lateral surrounding heat pipe is for contacting a heating element while the heating element has a working surface and a sidewall formed around the working surface. The heat pipe includes a heated section and a cooling section. The heated section has a heated surface, which is flat, for contacting and being attached to the sidewall of the heating element. The cooling section is integrally connected to the heated section and extends from the heating element towards any direction.Type: ApplicationFiled: October 16, 2015Publication date: April 20, 2017Inventors: Cheng-Tu WANG, Kuan-Ming LAI
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Publication number: 20170023307Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.Type: ApplicationFiled: July 21, 2015Publication date: January 26, 2017Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Publication number: 20170010048Abstract: A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.Type: ApplicationFiled: July 9, 2015Publication date: January 12, 2017Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Patent number: 9488418Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.Type: GrantFiled: July 8, 2014Date of Patent: November 8, 2016Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
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Patent number: 9481056Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: GrantFiled: April 14, 2014Date of Patent: November 1, 2016Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu Wang, Pang-Hung Liao
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Publication number: 20160209122Abstract: A slim-type vapor chamber and a capillary structure thereof are provided, including an upper board and a lower board. The upper and lower boards respectively include a metal plate. Trenches are formed on one side surface of the metal plate. The upper board and the lower board overlap each other to make the corresponding side surfaces of the two metal plates contact each other. The trenches of the two metal plates are correspondingly disposed to form passages. The trenches of one of the metal plates are staggered from the trenches of the other metal plate by an offset distance to form staggered passages. Therefore, the capillary force during reverse flow of a working fluid is enhanced, the contact area between the vapor and the passage is increased, and the heat transfer efficiency of the vapor chamber is improved.Type: ApplicationFiled: January 20, 2015Publication date: July 21, 2016Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20160010926Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.Type: ApplicationFiled: July 8, 2014Publication date: January 14, 2016Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Patent number: 9188394Abstract: The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.Type: GrantFiled: November 23, 2011Date of Patent: November 17, 2015Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu Wang, Chi-Chung Tseng
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Patent number: 8919427Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.Type: GrantFiled: April 21, 2008Date of Patent: December 30, 2014Assignee: Chaun-Choung Technology Corp.Inventors: Cheng-Tu Wang, Pang-Hung Liao, Kuo-Feng Tseng, Wen-Tsai Chang
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Publication number: 20140230248Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: ApplicationFiled: April 14, 2014Publication date: August 21, 2014Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20140190358Abstract: A flatware item for thermally melting a food product includes a metal body (10), a low-temperature-evaporable circulation fluid (20), and a reflux medium (30). The metal body (10) has a vacuum chamber (100), a hand holding portion (11), and a food contacting portion (12). The circulation fluid (20) is filled in the vacuum chamber (100), whereby the circulation fluid (20) absorbs external energy through the hand holding portion (11) and vaporizes, and the vaporized circulation fluid (20) flows to the food contacting portion (12). The reflux medium (30) is spread on the inner wall of the vacuum chamber (100).Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20130126125Abstract: The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.Type: ApplicationFiled: November 23, 2011Publication date: May 23, 2013Inventors: Cheng-Tu Wang, Chi-Chung Tseng
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Patent number: 8431873Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.Type: GrantFiled: September 29, 2008Date of Patent: April 30, 2013Assignee: Chaun-Choung Technology Corp.Inventors: Cheng-Tu Wang, Meng-Cheng Huang
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Publication number: 20130043004Abstract: In a lightweight heat pipe and a method for making the lightweight heat pipe, a first hollow pipe and a second hollow pipe making of two different materials are provided. The first hollow pipe is disposed into the second hollow pipe along an axial direction of the second hollow pipe. An inner wall surface of the second hollow pipe is attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe. An inner space of the first hollow pipe is then vacuumed, and the pipe body is sealed after the working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: ApplicationFiled: October 19, 2011Publication date: February 21, 2013Inventors: Cheng-Tu WANG, Pang-Hung Liao
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Publication number: 20100078425Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.Type: ApplicationFiled: September 29, 2008Publication date: April 1, 2010Inventors: Cheng-Tu Wang, Meng-Cheng Huang
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Publication number: 20090308576Abstract: A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.Type: ApplicationFiled: June 17, 2008Publication date: December 17, 2009Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng, Chuan-Yu Lee