Patents by Inventor Cheng-Wei Tsai

Cheng-Wei Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210136483
    Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 6, 2021
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Cheng-Wei Tsai, Chien-Hsing Lee
  • Patent number: 10841710
    Abstract: A package structure of MEMS microphone is provided. The MEMS microphone includes a MEMS microphone chip disposed on a circuit board. The MEMS microphone chip comprises a first bonding pad, including a metal pad on a top of the MEMS microphone chip; and a protection layer fully enclosing a sidewall of the metal pad and also partially disposed on a top of the metal pad. A circuit chip is disposed on the circuit board, wherein the circuit chip comprises a second bonding pad. A bonding wire is connected between the first bonding pad and the second bonding pad.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 17, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Cheng-Wei Tsai
  • Patent number: 10798493
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: October 6, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 10390145
    Abstract: A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 20, 2019
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Cheng-Wei Tsai, Chien-Hsing Lee
  • Publication number: 20190124452
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 25, 2019
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 10250998
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: April 2, 2019
    Assignee: Solid State Systems Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Publication number: 20180115836
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Application
    Filed: October 26, 2016
    Publication date: April 26, 2018
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 9955268
    Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 24, 2018
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai, Jhyy-Cheng Liou
  • Patent number: 9399242
    Abstract: A method of preparing polyurethane prepolymer does not require using a toxic isocyanate monomer (manufactured by harmful phosgene) as a raw material. Epoxy resin and carbon dioxide are used as major raw materials to form cyclic carbonates to be reacted with a functional group oligomer, and then amino groups in a hydrophilic (ether group) or hydrophobic (siloxane group) diamine polymer are used for performing a ring-opening polymerization, and the microwave irradiation is used in the ring-opening polymerization to efficiently synthesize the amino-terminated PU prepolymer, and then an acrylic group at an end is added to manufacture an UV cross-linking PU (UV-PU) oligomer which can be coated onto a fabric surface, and the fabric is dried by UV radiation for a surface treatment to form a washing-resisted long lasting hydrophilic or hydrophobic PU fabric.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: July 26, 2016
    Assignee: TAMKANG UNIVERSITY (A UNIVERSITY OF TAIWAN)
    Inventors: Jing-Zhong Hwuang, Guei-Jia Chang, Jhong-Jheng Lin, Cheng-Wei Tsai, Shih-Chieh Wang, Po-Cheng Chen, Kan-Nan Chen, Jen-Taut Yeh
  • Patent number: 9264832
    Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 16, 2016
    Assignee: Solid State System Co., Ltd.
    Inventors: Cheng-Wei Tsai, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20150315013
    Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
    Type: Application
    Filed: July 11, 2014
    Publication date: November 5, 2015
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai, Jhyy-Cheng Liou
  • Publication number: 20150118780
    Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Applicant: Solid State System Co., Ltd.
    Inventors: Cheng-Wei Tsai, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20140242292
    Abstract: A method of preparing polyurethane prepolymer does not require using a toxic isocyanate monomer (manufactured by harmful phosgene) as a raw material. Epoxy resin and carbon dioxide are used as major raw materials to form cyclic carbonates to be reacted with a functional group oligomer, and then amino groups in a hydrophilic (ether group) or hydrophobic (siloxane group) diamine polymer are used for performing a ring-opening polymerization, and the microwave irradiation is used in the ring-opening polymerization to efficiently synthesize the amino-terminated PU prepolymer, and then an acrylic group at an end is added to manufacture an UV cross-linking PU (UV-PU) oligomer which can be coated onto a fabric surface, and the fabric is dried by UV radiation for a surface treatment to form a washing-resisted long lasting hydrophilic or hydrophobic PU fabric.
    Type: Application
    Filed: February 24, 2014
    Publication date: August 28, 2014
    Applicant: Tamkang University
    Inventors: Jing-Zhong Hwuang, Guei-Jia Chang, Jhong-Jheng Lin, Cheng-Wei Tsai, Shih-Chieh Wang, Po-Cheng Chen, Kan-Nan Chen, Jen-Taut Yeh
  • Patent number: 8815970
    Abstract: A method of preparing polyurethane prepolymer does not require using a toxic isocyanate monomer (manufactured by harmful phosgene) as a raw material. Epoxy resin and carbon dioxide are used as major raw materials to form cyclic carbonates to be reacted with a functional group oligomer, and then amino groups in a hydrophilic (ether group) or hydrophobic (siloxane group) diamine polymer are used for performing a ring-opening polymerization, and the microwave irradiation is used in the ring-opening polymerization to efficiently synthesize the amino-terminated PU prepolymer, and then an acrylic group at an end is added to manufacture an UV cross-linking PU (UV-PU) oligomer which can be coated onto a fabric surface, and the fabric is dried by UV radiation for a surface treatment to form a washing-resisted long lasting hydrophilic or hydrophobic PU fabric.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: August 26, 2014
    Assignee: Tamkang University (A University of Taiwan)
    Inventors: Jing-Zhong Hwang, Guei-Jia Chang, Jhong-Jheng Lin, Cheng-Wei Tsai, Shih-Chieh Wang, Po-Cheng Chen, Kan-Nan Chen, Kan-Nan Chen
  • Publication number: 20130004677
    Abstract: A method of preparing polyurethane prepolymer does not require using a toxic isocyanate monomer (manufactured by harmful phosgene) as a raw material. Epoxy resin and carbon dioxide are used as major raw materials to form cyclic carbonates to be reacted with a functional group oligomer, and then amino groups in a hydrophilic (ether group) or hydrophobic (siloxane group) diamine polymer are used for performing a ring-opening polymerization, and the microwave irradiation is used in the ring-opening polymerization to efficiently synthesize the amino-terminated PU prepolymer, and then an acrylic group at an end is added to manufacture an UV cross-linking PU (UV-PU) oligomer which can be coated onto a fabric surface, and the fabric is dried by UV radiation for a surface treatment to form a washing-resisted long lasting hydrophilic or hydrophobic PU fabric.
    Type: Application
    Filed: September 22, 2011
    Publication date: January 3, 2013
    Inventors: Jing-Zhong HWANG, Guei-Jia CHANG, Jhong-Jheng LIN, Cheng-Wei TSAI, Shih-Chieh WANG, Po-Cheng CHEN, Kan-Nan CHEN, Jen-Taut YEH
  • Publication number: 20090132907
    Abstract: An annotation structure for web pages, a system and a method for annotating web pages are disclosed. In the invention, a web page displayed by a web browser is treated as a bottom web page, and an XML-based vector graphic annotation is overlaid on the bottom web page, wherein the XML-based vector graphic annotation includes annotation layers created by users. All users can create their respective annotation layer on the same bottom web page, edit various annotation objects on their own annotation layer, and save the edited annotation objects onto their respective annotation layer, wherein the annotation objects are XML-based vector graphic elements having better controllability. This will constitute multiple vector graphic annotation layers on the bottom web page. When sharing, the user only needs to transmit the address (e.g. URL) of the bottom web page and his own annotation layer to other users.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 21, 2009
    Inventors: Shin-Chung Shao, Cheng-Wei Tsai, Chuan-Kai Kao, Hao-Yu Lee
  • Publication number: 20070284211
    Abstract: An electric hub having a clutch means is used in wheels of an electric wheelchair and includes a hub means, a clutch means and an elastic body. The hub means includes an outer hub and an inner hub provided in its interior. The end face on one side of the outer hub is provided with a first gear. A projecting shaft extends from one side of the inner hub to correspond to the first gear. One side of the hub means is connected to the clutch means. The clutch means includes a rotary assembly and a movable disk connected to the projecting shaft. The movable disk is movable relative to the axial direction of the projecting shaft. A mating second gear is provided to correspond to the first gear. The elastic body is provided between the inner hub and the movable disk to control the clutching operation between the outer hub and the movable disk.
    Type: Application
    Filed: June 13, 2006
    Publication date: December 13, 2007
    Inventors: Cheng-Shing Tin, Shen-Yang Mao, Cheng-Wei Tsai
  • Publication number: 20070089946
    Abstract: A slimmed wheel motor having a brake. The slimmed wheel motor includes a motor device and a braking mechanism. The motor device includes a fixed spindle, a first cover being harnessed on the fixed spindle, and a second cover connecting the first cover. A motor stator and a motor rotor are disposed in the first and the second covers. The braking mechanism, which is disposed at one side of the motor device, includes an electromagnetic coil, an armature plate disposed in the electromagnetic coil, and a brake pad disposed between the armature plate and the second cover. Therefore, a friction force can be induced between the brake pad and the second cover to brake the wheel and to stop the rotation. In this manner, the thickness of the wheel motor is significantly reduced, which can effectively reduce the size and the cost of the wheel motor.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 26, 2007
    Inventors: Sheng-Yang Mao, Cheng-Wei Tsai, Cheng-Shing Tin