Abstract: Provided is an electronic package structure, including a substrate, a first electronic component disposed on the substrate, at least one second electronic component disposed on the substrate, an insulating film disposed on the second electronic component and the substrate, an insulating glue filled onto the second electronic component and the substrate to cover at least part of the insulating film, a liquid metal disposed on the first electronic component, and a heat-dissipating plate disposed on the first electronic component to squeeze the liquid metal. The insulating film and the insulating glue prevent the overflowing liquid metal from contacting the second electronic component and the substrate.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

Abstract: A fan including a frame and an impeller is disclosed. The frame has an air inlet and an air outlet. The impeller is disposed in the frame and includes a hub and multiple blades. Each blade has a negative pressure surface facing the air inlet, a positive pressure surface facing the air outlet, a blade root, and a blade tip opposite to the blade root. In a first region extending from the blade root to the blade tip by a first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a plane. In a second region extending from the blade tip to the blade root by a second length smaller than the first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a concave arc surface or both are convex arc surfaces.

Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.

Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.

Abstract: A heat dissipation system suitable for a portable electronic device with two heat sources is provided. The heat dissipation system includes a fan, two heat dissipation fin sets, a gate, a first heat pipe, a second heat pipe, and a control unit. The fan is a centrifugal fan and has a main outlet and a sub outlet. The heat dissipation fin sets are disposed respectively at the main outlet and the sub outlet, and the gate is disposed at the sub outlet. The first heat pipe thermally contacts the heat sources and the heat dissipation fin set located at the main outlet. The second heat pipe thermally contacts one of the heat sources and the two heat dissipation fin sets. The control unit is electrically connected to the gate to drive the gate to open or close the sub outlet according to a load of the two heat sources.

Abstract: Provided is a centrifugal heat dissipation fan including a housing and an impeller. The impeller is disposed in the housing. The impeller has a hub and multiple blades disposed surrounding the hub. Every two adjacent blades have different blade structures relative to the housing such that the blade structures pass by a fixed position of the housing and generate blade tones of varying frequencies when the impeller rotates.

Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.

Abstract: A graphics card including a circuit board module, a first heat dissipation fin, and a pair of fans is provided. The circuit board module includes a circuit board and a heat source. The circuit board has first to fourth sides surrounding the heat source. The first and second sides are opposite sides. The third and fourth sides are opposite sides. The first heat dissipation fin is in thermal contact with the heat source and has multiple channels communicating with the first to fourth sides. The fans disposed on the first and second sides respectively have first flow outlets facing the first heat dissipation fin and generate flows towards the first heat dissipation fin through the first flow outlets. The flows meet and squeeze in the channels to form turbulent flows and flow out of the graphics card through the third and fourth sides respectively. A computer host is also provided.

Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A thermal module includes a fan and a fin assembly. The fan has an air outlet. The fin assembly has multiple fins, and is disposed to the air outlet of the fan. The fins are disposed side by side to form multiple flow channels. Each of the flow channels has a first inlet, at least one second inlet, and an outlet. In each of the flow channels, a gas flow generated by the fan flows into the flow channel from the first inlet and flows out of the flow channel from the outlet, and a gas flow outside the fin assembly is drawn by the gas flow in the flow channel to flow into the flow channel from the at least one second inlet.

Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second flow dissipating heat from the second fin set. The first flow and the second flow are separated from each other, and the second flow passes through the bracket and the graphic card module.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.

Abstract: Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is disposed on and thermally coupled to the conductive member. The heat source is located between the conductive member and the circuit board. The conductive member is located between the heat pipe and the heat source. The circuit board is located between the heat source and the heat storage component, and is thermally coupled to the heat source. The heat storage component is thermally coupled to the circuit board and is filled with a working medium absorbing heat conducted from the heat source to the circuit board by latent heat of absorption during phase change. An electronic device is also provided.

Abstract: A portable electronic device including a first body, a second body, a heat source, a first heat pipe, a second heat pipe, and a heat conducting element is provided. The second body is pivotally connected to the first body. The heat source is disposed in the first body and thermally coupled to the heat source. The second heat pipe is disposed in the first body and thermally coupled to the first heat pipe. The heat conducting element is connected to and thermally coupled to the second body, and the heat conducting element slidably contacts the second heat pipe and is thermally coupled to the second heat pipe.