Patents by Inventor Cheng-Wen Hsieh

Cheng-Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220342455
    Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 27, 2022
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Chuan-Hua Wang, Yi-Ta Huang
  • Publication number: 20220325962
    Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 13, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Tsung-Ting Chen, Chi-Tai Ho, Kuan-Lin Chen, Jau-Han Ke
  • Publication number: 20220316493
    Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 6, 2022
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen
  • Patent number: 11454249
    Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: September 27, 2022
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wei-Chin Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • FAN
    Publication number: 20220290684
    Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
  • Publication number: 20220270832
    Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.
    Type: Application
    Filed: September 17, 2021
    Publication date: August 25, 2022
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Cheng-Wen Hsieh
  • Patent number: 11402157
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 2, 2022
    Assignee: ACER INCORPORATED
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • Publication number: 20220229477
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Patent number: 11379021
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 5, 2022
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11353041
    Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 7, 2022
    Assignee: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
  • Fan
    Patent number: 11339796
    Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 24, 2022
    Assignee: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • Publication number: 20220132700
    Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.
    Type: Application
    Filed: September 10, 2021
    Publication date: April 28, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20220124937
    Abstract: A heat dissipation device includes a heat dissipation member and a fan. The heat dissipation member includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group. The first heat dissipation fin group includes a plurality of first heat dissipation fins, and the second heat dissipation fin group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group. The fan is configured to rotate around an axis. The first heat dissipation fins and the second heat dissipation fins are arranged around the axis.
    Type: Application
    Filed: October 19, 2021
    Publication date: April 21, 2022
    Applicant: Acer Incorporated
    Inventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen, Chun-Chieh Wang, Chi-Tai Ho, Kuan-Lin Chen
  • Patent number: 11268525
    Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 8, 2022
    Assignee: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Hung-Chi Chen, Yu-Shih Wang, Ming-Fei Tsai
  • Patent number: 11262818
    Abstract: A portable electronic device including a body, a door, a carrier and at least one electronic module is provided. The door is movably mounted on the body. The carrier includes a first side and a second side opposite to each other, the first side is pivoted to the body, and the second side is movably pivoted to the door. The electronic module is disposed on the carrier. At least one opening is formed between the door and the body when the door moves away from the body, and the door drives the carrier to rotate relative to the body, such that the electronic module is tilted with respect to the body along with the movement of the door, and the electronic module is exposed to an external environment via the opening for heat dissipation.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: March 1, 2022
    Assignee: Acer Incorporated
    Inventors: Yi-Ta Huang, Chun-Chieh Wang, Wu-Chen Lee, Cheng-Nan Ling, Cheng-Wen Hsieh
  • Patent number: 11208897
    Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: December 28, 2021
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11209014
    Abstract: An axial flow fan includes a hub and a plurality of fan sets disposed around the hub. The hub rotates around a center axis and has a positive pressure side and a negative pressure side opposite to each other. Each of the fan sets includes at least two blades, and each blade has a wind inlet end, a wind outlet end opposite to the wind inlet end, a negative pressure surface, and a positive pressure surface opposite to the negative pressure surface. The wind outlet end of one of the adjacent two blades corresponds to the wind inlet end of the other one of the adjacent two blades. A gap is provided between the negative pressure surface of one of the adjacent two blades and the positive pressure surface of the other one of the adjacent two blades.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: December 28, 2021
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Tsung-Ting Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11187248
    Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: November 30, 2021
    Assignee: ACER INCORPORATED
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Chun-Chieh Wang, Yu-Ming Lin
  • Publication number: 20210364238
    Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 25, 2021
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Jau-Han Ke
  • Patent number: D962879
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 6, 2022
    Assignee: Acer Incorporated
    Inventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh