Patents by Inventor Cheng-Wen Hsieh
Cheng-Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220342455Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.Type: ApplicationFiled: April 19, 2022Publication date: October 27, 2022Applicant: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Chuan-Hua Wang, Yi-Ta Huang
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Publication number: 20220325962Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.Type: ApplicationFiled: April 1, 2022Publication date: October 13, 2022Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Tsung-Ting Chen, Chi-Tai Ho, Kuan-Lin Chen, Jau-Han Ke
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Publication number: 20220316493Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.Type: ApplicationFiled: April 1, 2022Publication date: October 6, 2022Applicant: Acer IncorporatedInventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen
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Patent number: 11454249Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.Type: GrantFiled: January 14, 2021Date of Patent: September 27, 2022Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wei-Chin Chen, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20220290684Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.Type: ApplicationFiled: March 8, 2022Publication date: September 15, 2022Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
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Publication number: 20220270832Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.Type: ApplicationFiled: September 17, 2021Publication date: August 25, 2022Applicant: Acer IncorporatedInventors: Hung-Chi Chen, Cheng-Wen Hsieh
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Patent number: 11402157Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.Type: GrantFiled: December 20, 2019Date of Patent: August 2, 2022Assignee: ACER INCORPORATEDInventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
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Publication number: 20220229477Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.Type: ApplicationFiled: January 11, 2022Publication date: July 21, 2022Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Patent number: 11379021Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.Type: GrantFiled: December 9, 2019Date of Patent: July 5, 2022Assignee: Acer IncorporatedInventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 11353041Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.Type: GrantFiled: December 4, 2019Date of Patent: June 7, 2022Assignee: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
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Patent number: 11339796Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.Type: GrantFiled: December 5, 2019Date of Patent: May 24, 2022Assignee: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
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Publication number: 20220132700Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.Type: ApplicationFiled: September 10, 2021Publication date: April 28, 2022Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Publication number: 20220124937Abstract: A heat dissipation device includes a heat dissipation member and a fan. The heat dissipation member includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group. The first heat dissipation fin group includes a plurality of first heat dissipation fins, and the second heat dissipation fin group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group. The fan is configured to rotate around an axis. The first heat dissipation fins and the second heat dissipation fins are arranged around the axis.Type: ApplicationFiled: October 19, 2021Publication date: April 21, 2022Applicant: Acer IncorporatedInventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen, Chun-Chieh Wang, Chi-Tai Ho, Kuan-Lin Chen
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Patent number: 11268525Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.Type: GrantFiled: December 17, 2019Date of Patent: March 8, 2022Assignee: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Hung-Chi Chen, Yu-Shih Wang, Ming-Fei Tsai
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Patent number: 11262818Abstract: A portable electronic device including a body, a door, a carrier and at least one electronic module is provided. The door is movably mounted on the body. The carrier includes a first side and a second side opposite to each other, the first side is pivoted to the body, and the second side is movably pivoted to the door. The electronic module is disposed on the carrier. At least one opening is formed between the door and the body when the door moves away from the body, and the door drives the carrier to rotate relative to the body, such that the electronic module is tilted with respect to the body along with the movement of the door, and the electronic module is exposed to an external environment via the opening for heat dissipation.Type: GrantFiled: July 6, 2020Date of Patent: March 1, 2022Assignee: Acer IncorporatedInventors: Yi-Ta Huang, Chun-Chieh Wang, Wu-Chen Lee, Cheng-Nan Ling, Cheng-Wen Hsieh
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Patent number: 11208897Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.Type: GrantFiled: August 1, 2019Date of Patent: December 28, 2021Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 11209014Abstract: An axial flow fan includes a hub and a plurality of fan sets disposed around the hub. The hub rotates around a center axis and has a positive pressure side and a negative pressure side opposite to each other. Each of the fan sets includes at least two blades, and each blade has a wind inlet end, a wind outlet end opposite to the wind inlet end, a negative pressure surface, and a positive pressure surface opposite to the negative pressure surface. The wind outlet end of one of the adjacent two blades corresponds to the wind inlet end of the other one of the adjacent two blades. A gap is provided between the negative pressure surface of one of the adjacent two blades and the positive pressure surface of the other one of the adjacent two blades.Type: GrantFiled: February 20, 2020Date of Patent: December 28, 2021Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Tsung-Ting Chen, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 11187248Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.Type: GrantFiled: April 24, 2019Date of Patent: November 30, 2021Assignee: ACER INCORPORATEDInventors: Cheng-Wen Hsieh, Wen-Neng Liao, Chun-Chieh Wang, Yu-Ming Lin
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Publication number: 20210364238Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.Type: ApplicationFiled: May 20, 2021Publication date: November 25, 2021Applicant: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Jau-Han Ke
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Patent number: D962879Type: GrantFiled: July 14, 2020Date of Patent: September 6, 2022Assignee: Acer IncorporatedInventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh