Patents by Inventor Cheng-Wen Hsieh

Cheng-Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150124399
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Application
    Filed: February 26, 2014
    Publication date: May 7, 2015
    Applicant: ACER INCORPORATED
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20150020997
    Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.
    Type: Application
    Filed: April 24, 2014
    Publication date: January 22, 2015
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20150020998
    Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat generating element and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with fluid and has a wall to divide the chamber into a first compartment and a second compartment connected to each other. The first compartment has a first outlet, and the second compartment has a first inlet. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat exchanging section by a pressure difference after absorbing the heat of the heat guiding part. After it is cooled, the fluid is flowed back to the chamber.
    Type: Application
    Filed: December 5, 2013
    Publication date: January 22, 2015
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20140138052
    Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 22, 2014
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20130081779
    Abstract: An electronic device and a temperature modulation method are disclosed herein. The electronic device includes a system body, a heat pipe module, a fan module, an orientation sensor, a temperature sensor and a control module. The system body includes an electronic component. The heat pipe module is connected to the electronic component. The fan module is installed in the system body. The orientation sensor can detect an orientation of the system body and output an orientation-sensing signal based on the orientation. The temperature sensor can detect a temperature of the heat pipe module and output a temperature-sensing signal based on the temperature. The control module can control rotation of the fan module according to at least one of the orientation-sensing signal and the temperature-sensing signal.
    Type: Application
    Filed: April 24, 2012
    Publication date: April 4, 2013
    Applicant: QUANTA COMPUTER INC.
    Inventors: Wei-Cheng Liao, Hsiao-Fan Chang, Hung-Ming Lin, Cheng-Wen Hsieh