Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

Abstract: A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.

Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.

Abstract: A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.

Abstract: A heat dissipation apparatus suited for dissipating heat of a heat source. The heat dissipation apparatus includes a tank, a heat-insulation unit and a pipe. The tank has an outlet end, an inlet end and an accommodating space, wherein the tank receives heat of the heat source from above. The heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit includes a heat-insulation nozzle. The heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates with the inlet end, the second opening communicates with the accommodating space and the neck portion is near the second opening. The pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

Abstract: A fan module and an electronic device are provided. The fan module includes a fan housing, a fan and a heat dissipating member. The fan housing has an open side and an enclosing side which surrounds the open side, wherein the open side is provided with a first airflow guiding channel. The fan is disposed within the fan housing, the heat dissipating member is disposed at the open side, the heat dissipating member has a second airflow guiding channel which is communicated with the first airflow guiding channel, and the air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting. The electronic device includes a chassis and the fan module, and the fan module is mounted in the chassis.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: An electronic device is provided. The electronic device includes a casing, a resonance cover, and a plurality of electronic components. The resonance cover covers a part of the casing so as to define a resonance chamber with the casing. The resonance chamber includes a plurality of openings. The electronic components are disposed in the casing and adapted to generate a plurality of audio frequencies, wherein a diameter of each of the openings is related to the corresponding audio frequency generated by the corresponding electronic component.

Abstract: A heat dissipation module including an evaporator, a copper tube communicated with the evaporator to construct a loop, and a heat-transmitting medium flowing in the loop is provided. The evaporator includes an upper cover and a lower cover connected with each other and constructing a cavity. The lower cover has a heat-isolating wall protruded toward the cavity, so as to separate a heat-isolating region and a heating region at the lower cover. The upper cover has a slope inclining toward the cavity. A heat of an electronic element is transmitted to the heat-transmitting medium through the heating region, so that the heat-transmitting medium flows out of the evaporator towards a single direction along the slope after absorbing the heat, flows in the copper tube to transmit the heat outward through the copper tube, and then flows back to the evaporator through the copper tube after dissipating the heat.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.

Abstract: An electronic device is provided. The electronic device includes a casing, a resonance cover, and a plurality of electronic components. The resonance cover covers a part of the casing so as to define a resonance chamber with the casing. The resonance chamber includes a plurality of openings. The electronic components are disposed in the casing and adapted to generate a plurality of audio frequencies, wherein a diameter of each of the openings is related to the corresponding audio frequency generated by the corresponding electronic component.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.