Patents by Inventor Cheng XIE

Cheng XIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR CRYOGENIC COOLING OF A PROCESS STREAM WITH ENHANCED RECOVERY OF REFRIGERATION
    Publication number: 20140000310
    Abstract: A system and method for improved cryogenic cooling of process gases is provided. The disclosed system and method provides for the cryogenic cooling of a silane and hydrogen gas process stream during the manufacture of polysilicon with concurrent recovery of refrigeration capacity from the vaporized nitrogen as well as the recovery of refrigeration capacity from the cold hydrogen gas stream. The improved cryogenic cooling system and method reduces the overall consumption of liquid nitrogen without sacrificing cooling performance of the cryogenic cooling of the silane and hydrogen gas process stream.
    Type: Application
    Filed: November 8, 2011
    Publication date: January 2, 2014
    Inventors: Alan T. Cheng, De-Cheng Xie Xie, Zhijie Sun
  • Image sensor module for camera device
    Patent number: 7990470
    Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: August 2, 2011
    Assignees: Premier Image Technology(China) Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Hwa Lin, Chen-Kuang Yeh, Xiang Huang, Wan-Cheng Xie, Shao-Guang Mo
  • IMAGE SENSOR MODULE FOR CAMERA DEVICE
    Publication number: 20110134314
    Abstract: An image sensor module includes a circuit board, an image sensor, and a supporting board. The image sensor is electrically connected to the circuit board. The circuit board defines a through opening therein. The supporting board is arranged on one side of the circuit board and includes a protrusion. The protrusion extends outwardly from the supporting board and includes a square-shaped block no larger than the image sensor. The square-shaped block passes through the through opening. The image sensor is mounted on the block and spaced from the circuit board.
    Type: Application
    Filed: February 13, 2011
    Publication date: June 9, 2011
    Applicants: PREMIER IMAGE TECHNOLOGY(CHINA) LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-HWA LIN, CHEN-KUANG YEH, XIANG HUANG, WAN-CHENG XIE, SHAO-GUANG MO
  • IMAGE SENSOR MODULE FOR CAMERA DEVICE
    Publication number: 20090040368
    Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.
    Type: Application
    Filed: January 14, 2008
    Publication date: February 12, 2009
    Applicants: PREMIER IMAGE TECHNOLOGY(China) LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-HWA LIN, CHEN-KUANG YEH, XIANG HUANG, WAN-CHENG XIE, SHAO-GUANG MO