Patents by Inventor Cheng-Yi Hsu

Cheng-Yi Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Publication number: 20240069277
    Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
  • Publication number: 20230112479
    Abstract: The present invention provides a photodiode, which includes: a light absorption substrate, a first electrode portion, a second electrode portion, an antireflection layer, and a distributed Bragg reflection layer. The antireflection layer is arranged to receive light to get into the light absorption substrate. The antireflection layer is arranged to receive light to get into the light absorption substrate, and the distributed Bragg reflection layer is arranged to reflect light transmitting through the light absorption substrate to exit from the light absorption substrate back to the light absorption substrate, in order to enhance the photocurrent and the spectrum sensitivity of the photodiode.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 13, 2023
    Inventors: SHIH-KANG CHEN, CHIH-YANG CHANG, CHENG-YI HSU
  • Publication number: 20220162884
    Abstract: An electric lock including a main base, a lock bolt, an elastic rod, a driving assembly, and a remote receiver is provided. The lock bolt is pivotally rotatably disposed on a top surface of the main base. The elastic rod is movably arranged in the main base and connected to a free end of the lock bolt. The driving assembly is disposed on a side of the main base and connected to the elastic rod. The remote receiver is coupled to the driving assembly. In a remote mode, the remote receiver is adapted to receive a signal to turn on the driving assembly, and the driving assembly drives the lock bolt through the elastic rod to rotate relative to the main base to switch to a locked state or an unlocked state.
    Type: Application
    Filed: September 24, 2021
    Publication date: May 26, 2022
    Applicant: Eltronix Co. Ltd
    Inventors: Jen-Tsang Chen, Cheng-Yi Hsu
  • Patent number: 11296821
    Abstract: Aspects of the disclosure provide an apparatus that includes transmitting circuit and processing circuit. The transmitting circuitry is configured to transmit wireless signals. The processing circuitry is configured to encode a set of information bits with a code that is configured for incremental redundancy to generate a code word that includes the information bits and parity bits, buffer the code word in a circular buffer, determine a start position in the circular buffer based on a redundancy version that is selected from a plurality of redundancy versions based on a scenario evaluation of a previous transmission associated with the set of information bits, and transmit, via the transmitting circuitry, a selected portion of the code word from the start position.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: April 5, 2022
    Assignee: MEDIATEK INC.
    Inventors: Chong-You Lee, Cheng-Yi Hsu, Maoching Chiu, Timothy Perrin Fisher-Jeffes, Ju-Ya Chen, Yen Shuo Chang, Wei Jen Chen
  • Patent number: 10958290
    Abstract: Concepts and schemes pertaining to location of interleaver with low-density parity-check (LDPC) code are described. A processor of an apparatus encodes data to provide a stream of encoded data. The processor also rate matches the encoded data to provide a rate-matched stream of encoded data. The processor further interleaving the rate-matched stream of encoded data. In rate matching the encoded data, the processor buffers the stream of encoded data in a circular buffer, with the circular buffer functioning as a rate matching block that rate matches the stream of encoded data. In interleaving the rate-matched stream of encoded data, the processor performs bit-level interleaving on the rate-matched stream of encoded data to provide a stream of interleaved data.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 23, 2021
    Inventors: Wei-Jen Chen, Ju-Ya Chen, Yen-Shuo Chang, Timothy Perrin Fisher-Jeffes, Mao-Ching Chiu, Cheng-Yi Hsu, Chong-You Lee
  • Patent number: 10832377
    Abstract: A calibration method for linking spherical coordinates to texture coordinates is provided. The method comprises: installing a plurality of lamps forming a horizontal semicircle arc and a rotation equipment located at its circle center; mounting a N-lens camera on the rotation equipment; causing the N-lens camera to spin about a spin axis passing through two ends of the horizontal semicircle arc and capture a plurality of lens images for different spin angles by the rotation equipment; and, determining longitude and latitude coordinates of a plurality of calibration points according to the different spin angles and the texture coordinates of the calibration points in the lens images to create a link between the spherical coordinates and the texture coordinates. Different positions of the lamps respectively represent different latitudes and different spin angles respectively represent different longitudes. Heights of the camera and the lamps are the same.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: November 10, 2020
    Assignee: ASPEED TECHNOLOGY INC.
    Inventors: Chung-Yen Lu, Cheng-Yi Hsu, Hsin-Yu Chen
  • Patent number: 10790853
    Abstract: Concepts and schemes pertaining to quasi-cyclic-low-density parity-check (QC-LDPC) coding are described. A processor of an apparatus may generate a QC-LDPC code having a plurality of codebooks embedded therein. The processor may select a codebook from the plurality of codebooks. The processor may also encode data using the selected codebook. Alternatively or additionally, the processor may generate the QC-LDPC code including at least one quasi-row orthogonal layer. Alternatively or additionally, the processor may generate the QC-LDPC code including a base matrix a portion of which forming a kernel matrix that corresponds to a code rate of at least a threshold value.
    Type: Grant
    Filed: November 25, 2018
    Date of Patent: September 29, 2020
    Assignee: MEDIATEK INC.
    Inventors: Mao-Ching Chiu, Chong-You Lee, Cheng-Yi Hsu, Timothy Perrin Fisher-Jeffes, Yen-Shuo Chang, Wei-Jen Chen, Ju-Ya Chen
  • Publication number: 20200219230
    Abstract: A calibration method for linking spherical coordinates to texture coordinates is provided. The method comprises: installing a plurality of lamps forming a horizontal semicircle arc and a rotation equipment located at its circle center; mounting a N-lens camera on the rotation equipment; causing the N-lens camera to spin about a spin axis passing through two ends of the horizontal semicircle arc and capture a plurality of lens images for different spin angles by the rotation equipment; and, determining longitude and latitude coordinates of a plurality of calibration points according to the different spin angles and the texture coordinates of the calibration points in the lens images to create a link between the spherical coordinates and the texture coordinates. Different positions of the lamps respectively represent different latitudes and different spin angles respectively represent different longitudes. Heights of the camera and the lamps are the same.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 9, 2020
    Inventors: Chung-Yen LU, Cheng-Yi HSU, Hsin-Yu CHEN
  • Publication number: 20200204295
    Abstract: Aspects of the disclosure provide an apparatus that includes transmitting circuit and processing circuit. The transmitting circuitry is configured to transmit wireless signals. The processing circuitry is configured to encode a set of information bits with a code that is configured for incremental redundancy to generate a code word that includes the information bits and parity bits, buffer the code word in a circular buffer, determine a start position in the circular buffer based on a redundancy version that is selected from a plurality of redundancy versions based on a scenario evaluation of a previous transmission associated with the set of information bits, and transmit, via the transmitting circuitry, a selected portion of the code word from the start position.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 25, 2020
    Applicant: MEDIATEK INC.
    Inventors: Chong-You LEE, Cheng-Yi Hsu, Maoching Chiu, Timothy Perrin Fisher-Jeffes, Ju-Ya Chen, Yen Shuo Chang, Wei Jen Chen
  • Patent number: 10659079
    Abstract: An apparatus determines a code block size (CBS) of information bits contained in a codeword of low-density parity check (LDPC) coding. The apparatus compares the CBS with at least one threshold, determines, based on a result of the comparison, a Kb number and determines a Kp number based on a code rate and the Kb number. The apparatus generates a parity check matrix. An information portion of the parity check matrix is a first matrix formed by M number of second square matrices. M is equal to Kp multiplied by Kb. A total number of columns in the Kb number of second square matrices is equal to a total number of bits of the CBS. One or more matrices of the M number of second square matrices are circular permutation matrices. The apparatus operates an LDPC encoder or an LDPC decoder based on the parity check matrix.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: May 19, 2020
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Yi Hsu, Chong-You Lee, Wei Jen Chen, Maoching Chiu, Timothy Perrin Fisher-Jeffes, Ju-Ya Chen, Yen Shuo Chang
  • Patent number: 10630319
    Abstract: Concepts and schemes pertaining to structure of interleaver with low-density parity-check (LDPC) code are described. A processor of an apparatus encodes data to provide encoded data. A transceiver of the apparatus transmits the encoded data to at least one network node of a wireless network. In encoding the data to provide the encoded data, the processor encodes the data to result in each code block in the encoded data comprising a respective bit-level interleaver.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 21, 2020
    Assignee: MEDIATEK INC.
    Inventors: Ju-Ya Chen, Cheng-Yi Hsu, Yen-Shuo Chang, Wei-Jen Chen, Mao-Ching Chiu, Timothy Perrin Fisher-Jeffes, Chong-You Lee
  • Patent number: 10608665
    Abstract: Aspects of the disclosure provide an apparatus and a method for error correction based on a matrix. The apparatus includes memory and processing circuitry. The memory is configured to store the matrix associated with a set of parity bits. The matrix having rows and columns includes elements having values corresponding to either a first state or a second state. The matrix also includes a row having two elements with values corresponding to the first state. One of the two elements is a parity element corresponding to a parity bit associated with the row. Further, other elements in a same column as the parity element have values corresponding to the second state. The processing circuitry is configured to implement error correction based on the matrix. In another embodiment, the processing circuitry is configured to encode a data unit by generating the set of parity bits from the data unit based on the matrix and to form a codeword that includes the data unit and the set of parity bits.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 31, 2020
    Assignee: MEDIATEK INC.
    Inventors: Chong-You Lee, Timothy Perrin Fisher-Jeffes, Maoching Chiu, Wei Jen Chen, Cheng-Yi Hsu, Ju-Ya Chen, Yen Shuo Chang
  • Patent number: 10601544
    Abstract: Aspects of the disclosure provide an apparatus that includes transmitting circuit and processing circuit. The transmitting circuitry is configured to transmit wireless signals. The processing circuitry is configured to encode a set of information bits with a code that is configured for incremental redundancy to generate a code word that includes the information bits and parity bits, buffer the code word in a circular buffer, determine a start position in the circular buffer based on a redundancy version that is selected from a plurality of redundancy versions based on a scenario evaluation of a previous transmission associated with the set of information bits, and transmit, via the transmitting circuitry, a selected portion of the code word from the start position.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: March 24, 2020
    Assignee: MEDIATEK INC.
    Inventors: Chong-You Lee, Cheng-Yi Hsu, Maoching Chiu, Timothy Perrin Fisher-Jeffes, Ju-Ya Chen, Yen Shuo Chang, Wei Jen Chen
  • Patent number: 10581457
    Abstract: Concepts and schemes pertaining to shift coefficient and lifting factor design for NR LDPC code are described. A processor of an apparatus may generate a quasi-cyclic-low-density parity-check (QC-LDPC) code and encode data using the selected codebook. In generating the QC-LDPC code, the processor may define a plurality of sets of lifting factors, generate a respective table of shift values for each lifting factor of the plurality of sets of lifting factors, and generate the QC-LDPC code using a base matrix and the shift coefficient table.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: March 3, 2020
    Assignee: MEDIATEK INC.
    Inventors: Mao-Ching Chiu, Timothy Perrin Fisher-Jeffes, Chong-You Lee, Cheng-Yi Hsu, Yen-Shuo Chang, Wei-Jen Chen, Ju-Ya Chen
  • Patent number: 10567116
    Abstract: A processor of an apparatus selects a codebook from a plurality of codebooks embedded in a quasi-cyclic-low-density parity-check (QC-LDPC) code. The processor stores the selected codebook in a memory associated with the processor. The processor also encodes data using the selected codebook to generate a plurality of modulation symbols of the data. The processor further controls a transmitter of the apparatus to multiplex, convert, filter, amplify and radiate the modulation symbols as electromagnetic waves through one or more antennas of the apparatus. In selecting the codebook from the plurality of codebooks embedded in the QC-LDPC code, the processor selects the codebook according to one or more rules such that a small codebook requiring a shorter amount of processing latency for the encoding is selected for the encoding unless a larger codebook corresponding to a larger amount of processing latency for the encoding is necessary for the encoding.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 18, 2020
    Assignee: MEDIATEK INC.
    Inventors: Mao-Ching Chiu, Chong-You Lee, Timothy Perrin Fisher-Jeffes, Cheng-Yi Hsu, Yen-Shuo Chang, Wei-Jen Chen, Ju-Ya Chen
  • Publication number: 20190372600
    Abstract: Concepts and schemes pertaining to location of interleaver with low-density parity-check (LDPC) code are described. A processor of an apparatus encodes data to provide a stream of encoded data. The processor also rate matches the encoded data to provide a rate-matched stream of encoded data. The processor further interleaving the rate-matched stream of encoded data. In rate matching the encoded data, the processor buffers the stream of encoded data in a circular buffer, with the circular buffer functioning as a rate matching block that rate matches the stream of encoded data. In interleaving the rate-matched stream of encoded data, the processor performs bit-level interleaving on the rate-matched stream of encoded data to provide a stream of interleaved data.
    Type: Application
    Filed: August 19, 2019
    Publication date: December 5, 2019
    Inventors: Wei-Jen Chen, Ju-Ya Chen, Yen-Shuo Chang, Timothy Perrin Fisher-Jeffes, Mao-Ching Chiu, Cheng-Yi Hsu, Chong-You Lee
  • Patent number: 10432227
    Abstract: Concepts and schemes pertaining to location of interleaver with low-density parity-check (LDPC) code are described. A processor of an apparatus encodes data to provide a stream of encoded data. The processor also rate matches the encoded data to provide a rate-matched stream of encoded data. The processor further interleaving the rate-matched stream of encoded data. In rate matching the encoded data, the processor buffers the stream of encoded data in a circular buffer, with the circular buffer functioning as a rate matching block that rate matches the stream of encoded data. In interleaving the rate-matched stream of encoded data, the processor performs bit-level interleaving on the rate-matched stream of encoded data to provide a stream of interleaved data.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: October 1, 2019
    Assignee: MEDIATEK INC.
    Inventors: Wei-Jen Chen, Ju-Ya Chen, Yen-Shuo Chang, Timothy Perrin Fisher-Jeffes, Mao-Ching Chiu, Cheng-Yi Hsu, Chong-You Lee