Abstract: A three-dimensional AND flash memory device includes a gate stack structure and a silt. The silt extends along a first direction and divides the gate stack structure into a plurality of sub-blocks. Each sub-block includes a plurality of rows, and each row includes a plurality of channel pillars, a plurality of charge storage structures, and a plurality of pairs of conductive pillars. The plurality of pairs of conductive pillars are arranged in the plurality of channel pillars and penetrate the gate stack structure, and are respectively connected to the plurality of channel pillars. Each pair of conductive pillars includes a first conductive pillar and a second conductive pillar separated from each other along a second direction. There is an acute angle between the second direction and the first direction.

Abstract: Various embodiments of the present application are directed towards an image sensor including a wavelength tunable narrow band filter, as well as methods for forming the image sensor. In some embodiments, the image sensor includes a substrate, a first photodetector, a second photodetector, and a filter. The first and second photodetectors neighbor in the substrate. The filter overlies the first and second photodetectors and includes a first distributed Bragg reflector (DBR), a second DBR, and a first interlayer between the first and second DBRs. A thickness of the first interlayer has a first thickness value overlying the first photodetector and a second thickness value overlying the second photodetector. In some embodiments, the filter is limited to a single interlayer. In other embodiments the filter further includes a second interlayer defining columnar structures embedded in the first interlayer and having a different refractive index than the first interlayer.

Abstract: A semiconductor device according to the present disclosure includes a fin structure over a substrate, a vertical stack of silicon nanostructures disposed over the fin structure, an isolation structure disposed around the fin structure, a germanium-containing interfacial layer wrapping around each of the vertical stack of silicon nanostructures, a gate dielectric layer wrapping around the germanium-containing interfacial layer, and a gate electrode layer wrapping around the gate dielectric layer.

Abstract: The invention provides a display panel and a method for detecting the same, a display device and a storage medium. The display panel comprises a substrate having a display area; a plurality of pixel units disposed in the display area; a plurality of signal lines electrically connected to the plurality of pixel units to transmit driving signals to the plurality of pixel units; a charge coupling unit corresponding to at least a part of the plurality of signal lines for coupling the driving signals into potential signal; and a voltage detection unit electrically connected to the charge coupling unit for receiving the potential signal and determining the driving signals.

Abstract: The present invention discloses an image enlarging method having super resolution enlarging mechanism that includes the steps outlined below. An enlarging module of a neural network system receives an input image to generate an enlarged image. A front end convolutional path included in a neural network module of the neural network system receives the input image to perform convolution to generate a front end operation output result. Branching convolutional paths included in the neural network module respectively receive the front end operation output result to perform convolution to generate groups of output image residues. A mixing module of the neural network system weights the output image residues according to weighing settings related to image regions of the input image and mixes the weighted output image residues to generate a group of final output image residue such that an enhancement module enhances the enlarged image to generate an output enlarged image.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a pixel region arranged between one or more trenches formed by sidewalls of the substrate. One or more dielectric materials are arranged along the sidewalls of the substrate forming the one or more trenches. A conductive material is disposed within the one or more trenches. The conductive material is electrically coupled to an interconnect disposed within a dielectric arranged on the substrate.

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

Abstract: The present invention relates to a method for adjusting a working state of a memory device, and a related memory device, an electronic device and a memory controller. The method includes configuring the memory controller to perform the following steps: setting a waiting time before the memory device enters a power-down mode as a first time value, where the memory device enters the power-down mode after the waiting time from being driven by a power-down instruction; determining whether the host device is performing an access operation; and setting the waiting time as a second time value in response to the host device being performing the access operation, where the first time value is smaller than the second time value.

Abstract: An electronic device including a body and a female connector is disclosed. The Body has an opening and a positioning structure disposed corresponding to the opening. The female connector is disposed in the body corresponding to the opening and is pivotally connected to the positioning structure. A male connector is adapted to pass through the opening and plugged into the female connector, and the female connector is adapted to be driven by the male connector to rotate around a rotation axis passing through the positioning structure.

Abstract: A cell repair-promoting extracellular vesicle, formed by silicate-induced stem cell secretion, helps express anti-inflammatory, tissue regeneration, and cell repair indicator factors, accelerating cell growth in wound tissue and the wound repair process.

Abstract: A stand for a computer monitor includes two auxiliary devices at two sides respectively. One auxiliary device is configured to extend out from one side of the stand and unfold to serve as a cup holder. The other auxiliary device is configured to extend out from the other side of the stand and unfold to serve as a holder for a cellular phone and/or a tablet computer.

Abstract: A semiconductor device is provided. The semiconductor device includes a plurality of first semiconductor nanostructures formed over a substrate, and a first S/D structure formed on sidewall surfaces of the first semiconductor nanostructures. The semiconductor device includes a plurality of second semiconductor nanostructures formed over the substrate, and a second S/D structure formed on sidewall surfaces of the second semiconductor nanostructures. The semiconductor device includes an isolation structure formed between the first S/D structure and the second S/D structure, and the isolation structure has a first sidewall surface in direct contact with the first S/D structure and a second sidewall surface in direct contact with the second S/D structure.

Abstract: A liquid cooling vapor chamber heat dissipation module includes a liquid cooling cover, a metallic top cover, and a metallic bottom cover. The liquid cooling cover includes a top portion, a sidewall and an accommodating space. The sidewall includes a liquid inlet and a liquid outlet. The outer heat-dissipating surface of the top cover has a plurality of columnar heat-dissipating structures. The inner evaporation surface of the metallic bottom cover has parallel bottom grooves and protrusive supporting structures disposed between the bottom grooves. An integrated vapor chamber is formed by engaging the metallic top and bottom covers. The liquid cooling cover engages with the outer heat-dissipating surface of the metallic top cover with the columnar heat-dissipating structures accommodating within the accommodating space, which allows cooling liquid to enter the accommodating space from the liquid inlet and flow through the columnar heat-dissipating structures, and flow out from the liquid outlet.

Abstract: A method includes receiving a request from a user device accessing a webpage, the request including a webpage uniform resource locator (URL) and a user device identifier. The method includes retrieving a list of events associated with the user device based on the device identifier. The method further includes retrieving sets of rules. Each set of rules indicates events and URLs that satisfy the set of rules. Each set of rules is associated with a template that includes link rendering data for rendering a link on the user device. The method includes identifying a set of rules that is satisfied by the received URL and events, transmitting link rendering data associated with the identified set of rules to the user device, and transmitting link routing data to the user device. The link routing data is configured to route the user device to an application state corresponding to the webpage.

Abstract: A semiconductor structure includes an epitaxial region having a front side and a backside. The semiconductor structure includes an amorphous layer formed over the backside of the epitaxial region, wherein the amorphous layer includes silicon. The semiconductor structure includes a first silicide layer formed over the amorphous layer. The semiconductor structure includes a first metal contact formed over the first silicide layer.

Abstract: An image capturing system lens assembly includes eight lens elements, the eight lens elements being, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. Each of the eight lens elements has an object-side surface towards the object side and an image-side surface towards the image side. The fourth lens element has negative refractive power. The image-side surface of the eighth lens element is concave in a paraxial region thereof, and the image-side surface of the eighth lens element includes at least one inflection point.

Abstract: An optical photographing lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has positive refractive power. The fourth lens element has positive refractive power. The image-side surface of the fourth lens element is convex in a paraxial region thereof. The image-side surface of the fifth lens element is concave in a paraxial region thereof. The sixth lens element has negative refractive power. The object-side surface of the sixth lens element is convex in a paraxial region thereof.

Abstract: The present application provides an integrated antenna and an antenna apparatus. The integrated antenna includes an antenna substrate, a photodiode and an antenna radiating body. The photodiode is disposed on the antenna substrate and includes two electrodes. The antenna radiating body is disposed on the antenna substrate and connected with the two electrodes. The antenna radiating body is disposed on an upper surface of the photodiode.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.