Patents by Inventor Cheng-Yu Wu

Cheng-Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250098343
    Abstract: Various embodiments of the present application are directed towards an image sensor including a wavelength tunable narrow band filter, as well as methods for forming the image sensor. In some embodiments, the image sensor includes a substrate, a first photodetector, a second photodetector, and a filter. The first and second photodetectors neighbor in the substrate. The filter overlies the first and second photodetectors and includes a first distributed Bragg reflector (DBR), a second DBR, and a first interlayer between the first and second DBRs. A thickness of the first interlayer has a first thickness value overlying the first photodetector and a second thickness value overlying the second photodetector. In some embodiments, the filter is limited to a single interlayer. In other embodiments the filter further includes a second interlayer defining columnar structures embedded in the first interlayer and having a different refractive index than the first interlayer.
    Type: Application
    Filed: December 4, 2024
    Publication date: March 20, 2025
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei Chieh Chiang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20250096185
    Abstract: A semiconductor structure can include a first substrate having a frontside and a backside opposite the frontside. The semiconductor structure can include devices on the frontside. The semiconductor structure can include first interconnect structures on the frontside and coupled to the devices. The semiconductor structure can include a heat distribution layer on the frontside and electrically isolated from the first interconnect structures, where the heat distribution layer includes a thermally conductive material. The semiconductor structure can include a second substrate coupled to the first substrate on the frontside. The semiconductor structure can include second interconnect structures on the backside and coupled to the devices.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yu Chen, Cheng Hung Wu, Hui-Ling Lin, Yu Hsiang Chen
  • Publication number: 20250089364
    Abstract: A integrated circuit includes a first, a second, a third, and a fourth gate, a first input pin and a first conductor. The first and third gate are on a first level. The second and fourth gate are on a second level. The second gate is coupled to the first gate. The fourth gate is coupled to the third gate. The first input pin extends in a second direction, is on a first metal layer above a front-side of a substrate, is coupled to the first gate, and configured to receive a first input signal. The first input pin is electrically coupled to the third gate by the first, second or fourth gate. The first conductor extends in the first direction, is on a second metal layer below a back-side of the substrate, and is coupled to the second and fourth gate.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 13, 2025
    Inventors: Cheng-Ling WU, Chih-Liang CHEN, Chi-Yu LU, Yi-Yi CHEN, Ting-Yun WU
  • Publication number: 20250089393
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 12249649
    Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: March 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Publication number: 20250076369
    Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.
    Type: Application
    Filed: April 16, 2024
    Publication date: March 6, 2025
    Applicant: MEDIATEK INC.
    Inventors: Ronald Kuo-Hua Ho, Kun-Yu Wang, Yen-Chang Shih, Sung-Te Chen, Cheng-Han Wu, Yi-Ying Liao, Chun-Ming Huang, Yen-Feng Lu, Ching-Yu Tsai, Tai-Lai Tung, Kuan-Fu Lin, Bo-Kang Lai, Yao-Syuan Lee, Tsyr-Rou Lin, Ming-Chao Tsai, Li-Hsuan Chiu
  • Publication number: 20250072007
    Abstract: A MRAM layout structure with multiple unit cells, including a first word line, a second word line and a third word line extending through active areas, wherein two ends of a first MTJ are connected respectively to a second active area and one end of a second MTJ, and two ends of a third MTJ are connected respectively to a third active area and one end of a fourth MTJ, and a first bit line and a second bit line connected respectively to the other end of the second MTJ and the other end of the fourth MTJ.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Ting Wu, Cheng-Tung Huang, Jen-Yu Wang, Yung-Ching Hsieh, Po-Chun Yang, Jian-Jhong Chen, Bo-Chang Li
  • Publication number: 20250060879
    Abstract: A computing system having a memory component with an embedded media controller. The memory component is encapsulated within an integrated circuit (IC) package. The embedded controller within the IC package is configured to: receive incoming packets, via a serial communication interface of the controller, from a serial connection outside of the IC package; convert the incoming packets into commands and addresses according to a predetermined serial communication protocol; operate memory units encapsulated within the IC package according to the commands and the addresses; convert results of at least a portion of the commands into outgoing packets; and transmit the outgoing packets via the serial communication interface to the serial connection outside of the IC package.
    Type: Application
    Filed: November 1, 2024
    Publication date: February 20, 2025
    Inventors: Samir Mittal, Gurpreet Anand, Ying Yu Tai, Cheng Yuan Wu
  • Patent number: 12222654
    Abstract: A method includes illuminating radiation to a resist layer over a substrate to pattern the resist layer. The patterned resist layer is developed by using a positive tone developer. The patterned resist layer is rinsed using a basic aqueous rinse solution. A pH value of the basic aqueous rinse solution is lower than a pH value of the developer, and a rinse temperature of rinsing the patterned resist layer is in a range of about 20° C. to about 40° C.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: February 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hui Weng, Chen-Yu Liu, Cheng-Han Wu, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 12211698
    Abstract: Provided is a material composition and method that includes forming a patterned resist layer on a substrate, where the patterned resist layer has a first line width roughness. In various embodiments, the patterned resist layer is coated with a treatment material, where a first portion of the treatment material bonds to surfaces of the patterned resist layer. In some embodiments, a second portion of the treatment material (e.g., not bonded to surfaces of the patterned resist layer) is removed, thereby providing a treated patterned resist layer, where the treated patterned resist layer has a second line width roughness less than the first line width roughness.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Siao-Shan Wang, Cheng-Han Wu, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 12211871
    Abstract: The present disclosure relates to an integrated chip including a substrate and a pixel. The pixel includes a photodetector. The photodetector is in the substrate. The integrated chip further includes a first inner trench isolation structure and an outer trench isolation structure that extend into the substrate. The first inner trench isolation structure laterally surrounds the photodetector in a first closed loop. The outer trench isolation structure laterally surrounds the first inner trench isolation structure along a boundary of the pixel in a second closed loop and is laterally separated from the first inner trench isolation structure. Further, the integrated chip includes a scattering structure that is defined, at least in part, by the first inner trench isolation structure and that is configured to increase an angle at which radiation impinges on the outer trench isolation structure.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 12211789
    Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: January 28, 2025
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chenming Hu, Shu-Jui Chang, Chen-Han Chou, Yen-Teng Ho, Chia-Hsing Wu, Kai-Yu Peng, Cheng-Hung Shen
  • Publication number: 20250029205
    Abstract: An image interpolation method comprises applying a filter to an RGBIR image to generate a LUMA image; calculating two gradients according to the LUMA image; and interpolating a missing pixel between two pixels in the RGBIR image according to the two gradients. Wherein each gradient corresponding to two LUMA pixels in the LUMA image. An image fusion method comprises applying a filter to an RGBIR image to generate a LUMA image; obtaining an R-image, a G-image, a B-image and an IR image according to the RGBIR image; and generating a fusion image according to the R-image, G-image, B-image, the IR image and the LUMA image.
    Type: Application
    Filed: March 28, 2024
    Publication date: January 23, 2025
    Applicant: ICATCH TECHNOLOGY, INC.
    Inventors: Hsin-Pei Han, Chia-Ying Tsai, Cheng-Yu Wu
  • Publication number: 20250022668
    Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.
    Type: Application
    Filed: September 29, 2024
    Publication date: January 16, 2025
    Inventors: CHENG-YI YANG, I-CHU LIN, YUAN-YU LIN, CHIN-TSUN LIN, Qirui CHEN, HSIU-WEN WU
  • Patent number: 11884154
    Abstract: A detection system for a vehicle comprises a blind spot detection module and a glasses module. The blind spot detection module comprises a first video recording device recording a vehicle surrounding image; a first identification device generating a blind spot identification result; a first determination device determining whether to transmit the vehicle surrounding image and/or a blind spot warning message; and a transmitting device transmitting the vehicle surrounding image and/or the blind spot warning message.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 30, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventor: Cheng-Yu Wu
  • Patent number: 11656828
    Abstract: An electronic system is provided, which includes a host device and a display device. The host device includes a first signal conversion circuit and a first signal transmission circuit. The first signal conversion circuit is utilized for converting signals associated with the host device into a first universal serial bus signal. The display device includes a display panel, a second signal conversion circuit and a second signal transmission circuit. The second signal transmission circuit is utilized for receiving the first universal serial bus signal. The second signal conversion circuit is coupled to the second signal transmission circuit for converting the first universal serial bus signal into the signals associated with the host device. The first universal serial bus signal conforms to universal serial bus 4.0 or above version standard specification.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 23, 2023
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Cheng-Yu Wu, Ming-Yuan Liu
  • Publication number: 20220388394
    Abstract: A detection system for a vehicle comprises a blind spot detection module and a glasses module. The blind spot detection module comprises a first video recording device recording a vehicle surrounding image; a first identification device generating a blind spot identification result; a first determination device determining whether to transmit the vehicle surrounding image and/or a blind spot warning message; and a transmitting device transmitting the vehicle surrounding image and/or the blind spot warning message.
    Type: Application
    Filed: September 16, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventor: Cheng-Yu Wu
  • Publication number: 20220365439
    Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.
    Type: Application
    Filed: August 24, 2021
    Publication date: November 17, 2022
    Inventors: Yu-Ling Tseng, Kai-Lun Tseng, Yuan-Yen Lo, Pei-Kao Li, Cheng Yu Wu
  • Publication number: 20220300232
    Abstract: An electronic system is provided, which includes a host device and a display device. The host device includes a first signal conversion circuit and a first signal transmission circuit. The first signal conversion circuit is utilized for converting signals associated with the host device into a first universal serial bus signal. The display device includes a display panel, a second signal conversion circuit and a second signal transmission circuit. The second signal transmission circuit is utilized for receiving the first universal serial bus signal. The second signal conversion circuit is coupled to the second signal transmission circuit for converting the first universal serial bus signal into the signals associated with the host device. The first universal serial bus signal conforms to universal serial bus 4.
    Type: Application
    Filed: June 15, 2021
    Publication date: September 22, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Cheng-Yu Wu, Ming-Yuan Liu
  • Patent number: 11303640
    Abstract: A circuit used in a network device, which includes a memory and an analyzer. The memory stores an ACL look-up table, wherein the ACL look-up table includes multiple ACL rules, and each ACL rule contains at least a comparison field, a control field, and a logical operation field. The comparison field includes comparison information of a communication protocol, the control field indicates whether said each ACL rule needs to be combined with a next ACL rule, and the logic operation field indicates a logical operation used when said each ACL rule needs to be combined with the next ACL rule. The analyzer is configured to sequentially compare the packet according to multiple ACL rules recorded in the ACL look-up table, so as to generate at least one comparison result for determining the processing method of the packet.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: April 12, 2022
    Assignee: Realtek Semiconductor Corp.
    Inventor: Cheng-Yu Wu