Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.

Abstract: A system for embedding credentials on an electronic document includes a task assignment device, a document database, a signature server and a credential server. The task assignment device generates an assigned task. The signature server generates a first signature request and a second signature request according to the assigned task. A first electronic device generates first signature information according to the first signature request. A second electronic device generates second signature information according to the second signature request. The signature server generates a first credential request and a second credential request according to the first signature information and the second signature information. The credential server transmits a first credential object and a second credential object to the signature server in response to the first credential request and the second credential request.

Abstract: A polymer, which is a composition of a battery, includes a polyester. The polyester is polymerized by at least two monomers, wherein each of the at least two monomers is selected from a group consisting of a carbonate ester and a polyol. The polyester can further include an end-capped polycarbonate ester, and the end-capped polycarbonate ester includes an inert group on an end thereof.

Abstract: The present invention provides a control method of a flash memory controller, which includes the steps of: setting a waiting time in an interrupt coalescing mechanism, and setting a timer, wherein a timeout value of the timer is equal to the waiting time; receiving multiple commands from a submission queue in a host device, generating multiple command responses after processing the multiple commands, and writing the multiple command responses to a completion queue in the host device; receiving a submission queue tail and a completion queue head from the host device; and when the timer reaches the timeout value, subtracting the completion queue head from the submission queue tail to obtain a queue depth of a command queue of the host device.

Abstract: An imaging system includes a scattering assembly with a scattering medium positioned a first distance from an object to be imaged. The scattering medium includes a plurality of particles suspended in a suspension medium and at least one field source generating an electromagnetic field to manipulate an orientation, concentration, spatial distribution, and/or other properties of the plurality of particles. The imaging system further includes a detector including a plurality of detector elements positioned a second distance from the scattering medium and an image processing system configured to reconstruct an image of the object from an object image signal detected by the detector using object light scattered by the scattering medium and incident on the detector.

Abstract: A photographing lens assembly in order from an object side to an image side comprises a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing the object side and an image-side surface facing the image side. The first lens element has negative refractive power. The image-side surface of the fourth lens element is concave in a paraxial region thereof. An axial distance between the object-side surface of the first lens element and the image-side surface of the fourth lens element is TD, an axial distance between the image-side surface of the fourth lens element and an image surface at d-line reference wavelength is BLd, an Abbe number of the fourth lens element at d-line reference wavelength is V4d, and 1.0<TD/BLd<2.4 and 10.0<V4d<24.0 are satisfied.

Abstract: A combination padlock with an integrated bottle opener comprising: a body featuring a shackle and two spaced apart side surfaces; wherein a central segment of the body extends and protrudes a tooth in the direction of the shackle; wherein the cross-sectional thickness of a free edge of the tooth is narrower than that of the body cross-section; and wherein the tooth extends and protrudes from only one of the side surfaces of the body.

Abstract: A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.

Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit suspends performing at least one of a display driving operation and a touch sensing operation during a skip period under a driving mode, and the first driving circuit performs the at least one of the display driving operation and the touch sensing operation outside the skip period under the driving mode. The second driving circuit is coupled to the first driving circuit. The second driving circuit performs a fingerprint sensing operation during the skip period.

Abstract: A fuel cell interconnect includes an air side and an opposing fuel side, air ribs disposed on the air side and at least partially defining air channels, and fuel ribs disposed on the fuel side and a least partially defining fuel channels. The fuel channels include central fuel channels disposed in a central fuel field, the central fuel channels having a cross-sectional area A1, peripheral fuel channels disposed in peripheral fuel fields that are disposed on opposing sides of the central fuel field, the peripheral fuel channels having a cross-sectional area A3, and intermediate fuel channels disposed in intermediate fuel fields that are disposed between the central fuel field and the peripheral fuel fields, the intermediate fuel channels having a cross-sectional area A2, where area A1<area A2<area A3.

Abstract: An electrochemical cell stack includes electrochemical cells that each contain a fuel electrode, an air electrode and an electrolyte disposed therebetween, interconnects disposed between the electrochemical cells, and an interconnect end plate disposed over the fuel electrode of an outermost one of the electrochemical cells. The interconnect end plate includes a fuel side, an opposing air side, fuel ribs disposed on the fuel side and at least partially defining fuel channels, air ribs disposed on the air side and at least partially defining dummy air channels, fuel holes extending from the fuel side to the air side, and recessed ring seal regions disposed on the air side surrounding the fuel holes.

Abstract: An IC device includes first and second circuits adjacent each other and over a substrate. The first circuit includes a first IO pattern along a first track among a plurality of tracks in a first metal layer, the plurality of tracks elongated along a first axis and spaced from each other along a second axis. The second circuit includes a plurality of conductive patterns along corresponding different tracks among the plurality of tracks in the first metal layer, each of the plurality of conductive patterns being an IO pattern of the second circuit or a floating conductive pattern. The first metal layer further includes a first connecting pattern along the first track and connecting the first IO pattern and a second IO pattern of the second circuit. The second IO pattern is one of the plurality of conductive patterns of the second circuit and is along the first track.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a first side and a second side opposing the first side. The substrate has one or more sidewalls defining a trench extending along opposing sides of a pixel region having a first width. An isolation structure including one or more dielectric materials is disposed within the trench. The isolation structure has a second width. An image sensing element and a focal region are disposed within the pixel region. The focal region is configured to receive incident radiation along the second side of the substrate. A ratio of the second width to the first width is in a range of between approximately 0.1 and approximately 0.2, so that the focal region is completely confined between interior sidewall of the isolation structure facing the image sensing element.

Abstract: A method and system for supplying power at a voltage selected from a plurality of voltages. Power is initially received at a first voltage. Embodiments communicate with an AC adapter to get device identification and see if the AC adapter supports other voltages. If so, embodiments communicate with the AC adapter to get more information about the adapter and identify what voltages the adapter is capable of providing. If one of the voltages would allow an information handling system to operate more efficiently, embodiments negotiate a power supply contract to operate at a second voltage. When the information handling system powers down, the system resets to operation at the initial voltage.

Abstract: A semiconductor device includes a semiconductor layer, a deep trench isolation structure, a shallow trench isolation structure, a first resistance layer, a second resistance layer, a first heavily doped region, a second heavily doped region, and a conductive line. The deep trench isolation structure separates the semiconductor device into a plurality of units including the first and second units. The shallow trench isolation structure is disposed on a portion of the semiconductor layer in one of the plurality of units. The first and second resistance layers are disposed on the shallow trench isolation structure in the first and second units respectively. The first and second heavily doped regions are embedded in the shallow trench isolation structure and in physical contact with the semiconductor layer in the first and second units respectively. The conductive line electrically connects the first and second resistance layers and the second heavily doped region.

Abstract: A method for forming an image sensor package is provided. An image sensor chip is formed over a package substrate. A protection layer is formed overlying the image sensor chip. The protection layer has a planar top surface and a bottom surface lining and contacting structures under the protection layer. An opening is formed into the protection layer and spaced around a periphery of the image sensor chip. A light shielding material is filled in the opening to form an on-wafer shield structure having a sidewall directly contact the protection layer.

Abstract: A method for reading data from a flash memory is provided. The method comprises: determining whether a host device is requesting a sequential read access to the flash memory; prior to receiving a first host read command issued by the host device, performing a read-ahead operation to read data from the flash memory according to a read-ahead start logical block address (LBA) if the host device is requesting the sequential read access to the flash memory; and storing the data that is read through the read-ahead operation in a read-ahead buffer; and in response to receiving a first host read command issued by the host device, sending a portion or all of data that is read through the read-ahead operation to the host device if a start LBA of the first host read command corresponds to one of start LBAs of data that is stored in the read-ahead buffer.

Abstract: A display panel including a substrate, a light-emitting device, a light-shielding layer, and a light-guide pillar is provided. The light-emitting device is disposed on the substrate. The light-shielding layer is disposed on the substrate and has a sidewall surrounding an opening. The light-guide pillar is disposed between the substrate and the light-emitting device and located in the opening. A gap exists between the light-guide pillar and the sidewall of the light-shielding layer.

Abstract: An image sensor includes a semiconductor substrate, a first isolation structure, a visible light detection structure, and an infrared light detection structure. The semiconductor substrate has a first surface and a second surface opposite to the first surface in a vertical direction. The first isolation structure is disposed in the semiconductor substrate for defining pixel regions in the semiconductor substrate. The visible light detection structure and the infrared light detection structure are disposed within the same pixel region, and a first portion of the visible light detection structure is disposed between the second surface of the semiconductor substrate and the infrared light detection structure in the vertical direction. The infrared light detection structure includes an epitaxial structure disposed in the semiconductor substrate, and the visible light detection structure includes a doped region including a material identical to a material of the semiconductor substrate.