Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first conductive structure over a substrate. A data storage structure overlies the first conductive structure. The data storage structure comprises a first dielectric layer on the first conductive structure and a second dielectric layer on the first dielectric layer. The first dielectric layer comprises a dielectric material and a first dopant having a concentration that changes from a top surface of the first dielectric layer in a direction towards the first conductive structure. A second conductive structure overlies the data storage structure.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: An IC structure includes a fin structure, a contact overlying the fin structure along a first direction, and an isolation layer between the contact and the fin structure. The isolation layer is adjacent to a portion of the contact along a second direction perpendicular to the first direction.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: A physiological detection device includes system including a first array PPG detector, a second array PPG detector, a display and a processing unit. The first array PPG detector is configured to generate a plurality of first PPG signals. The second array PPG detector is configured to generate a plurality of second PPG signals. The display is configured to show a detected result of the physiological detection system. The processing unit is configured to convert the plurality of first PPG signals and the plurality of second PPG signals to a first 3D energy distribution and a second 3D energy distribution, respectively, and control the display to show an alert message.

Abstract: A process kit is provided. The process kit includes: a substrate support; and one or more electrical connectors, each electrical connector attached to the substrate support, each electrical connector including: a tube; a shaft including a rim, the rim positioned inside the tube, the shaft including a first portion above the rim and a second portion below the rim, wherein at least part of the first portion is configured to move outside of the tube, and the second portion is inside the tube; and a seal, wherein the rim directly underlies at least a portion of the seal.

Abstract: A hand-held belt sander includes a head, an arm, a retaining unit, and a positioning unit. The head includes a mounting seat surrounding an axis. The arm has a sleeve segment mounted to the mounting seat. The retaining unit has an annular groove formed in the mounting seat, and multiple protrusions disposed on the sleeve segment and engaging the annular groove. The positioning unit includes multiple engaging grooves formed in the mounting seat, and an engaging member disposed on the sleeve segment. When the engaging member engages one of the engaging grooves, the arm is positioned relative to the head at an operating position. When the engaging member is disengaged from the one of the engaging grooves, the arm is rotatable about the axis relative to the head.

Abstract: A hand-held belt sander includes a head, an arm, a retaining unit, and a positioning unit. The head includes a mounting seat surrounding an axis. The arm has a sleeve segment mounted to the mounting seat. The retaining unit has an annular groove formed in the mounting seat, and multiple protrusions disposed on the sleeve segment and engaging the annular groove. The positioning unit includes multiple engaging grooves formed in the mounting seat, and an engaging member disposed on the sleeve segment. When the engaging member engages one of the engaging grooves, the arm is positioned relative to the head at an operating position. When the engaging member is disengaged from the one of the engaging grooves, the arm is rotatable about the axis relative to the head.

Abstract: The present invention provides compound extracted from Garcinia species and the use of said compound in preventing and treating cancer.

Abstract: The present invention provides compound extracted from Garcinia species and the use of said compound in preventing and treating cancer.

Abstract: According to an exemplary embodiment of a guided speaker adaptive speech synthesis system, a speaker adaptive training module generates adaptation information and a speaker-adapted model based on inputted recording text and recording speech. A text to speech engine receives the recording text and the speaker-adapted model and outputs synthesized speech information. A performance assessment module receives the adaptation information and the synthesized speech information to generate assessment information. An adaptation recommendation module selects at least one subsequent recording text from at least one text source as a recommendation of a next adaption process, according to the adaptation information and the assessment information.

Abstract: In one embodiment of a controllable prosody re-estimation system, a TTS/STS engine consists of a prosody prediction/estimation module, a prosody re-estimation module and a speech synthesis module. The prosody prediction/estimation module generates predicted or estimated prosody information. And then the prosody re-estimation module re-estimates the predicted or estimated prosody information and produces new prosody information, according to a set of controllable parameters provided by a controllable prosody parameter interface. The new prosody information is provided to the speech synthesis module to produce a synthesized speech.