Patents by Inventor Chenglin Liu

Chenglin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9299589
    Abstract: A packaged IC having laser vias and methods for making the same. The packaged IC includes a die having bond pads thereon, wire bonds contacting the bond pads, and a substrate configured to electrically connect the wire bonds and external package connectors. The substrate includes mechanical vias through the substrate layers and laser vias in an uppermost substrate layer. Each laser via is closer to the die than the mechanical vias that do not overlap or are not covered by the die. The method includes routing traces on uppermost and lowermost layers, the traces electrically connecting a wire bonds and external package connectors, forming mechanical vias through all layers of the substrate, forming laser vias in the uppermost substrate layer, and electrically connecting each wire bond to one trace on the uppermost substrate layer.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: March 29, 2016
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Chender Chen, Xiaoting Chang
  • Patent number: 9288909
    Abstract: In accordance with an embodiment, there is provided a substrate of a ball grid array package that includes a first layer including reinforcement fibers. The reinforcement fibers reinforce the first layer such that the first layer has a higher tensile strength relative to a layer in the ball grid array package that is free of reinforcement fibers. In an embodiment, the substrate comprises a second layer disposed adjacent to the first layer with the second layer being free of reinforcement fibers. In an embodiment, the substrate also includes a through hole penetrating each of the first layer and the second layer. The through hole penetrates each of the first layer and the second layer based on each of the first layer and the second layer having been drilled in accordance with a mechanical drilling process.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: March 15, 2016
    Assignee: Marvell World Trade Ltd.
    Inventors: Shiann-Ming Liou, Chenglin Liu
  • Patent number: 9265077
    Abstract: A method and system for connecting a peripheral device to a user device via a Bluetooth protocol, comprising: at the user device: initiating a device scan process, comprising: detecting a device discovery message from the peripheral device; and determining whether the device discovery message includes a predetermined identifier designated for a social networking service associated with a social networking application executing on the user device; upon determining that the device discovery message includes the predetermined identifier designated for the social networking service associated with a social networking application executing on the user device, sending, to the peripheral device, a connection request corresponding to the device discovery message; and establishing a Bluetooth connection to the peripheral device.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: February 16, 2016
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Shihai Cheng, Liangliang Fan, Kai Liu, Xiangyao Lin, Chenglin Liu, Jinhai Liu, Yaobo Hua, Anqi Ren, Rungui Ye, Zhijie Zhou, Can Liu
  • Patent number: 9224677
    Abstract: Semiconductor packages and associated techniques are described. A described semiconductor package includes a lead frame; a first wire bond; a second wire bond; a first voltage source to provide a first voltage; a second voltage source to provide a second voltage; a first die pad coupled with the first voltage source via the first wire bond; a second die pad coupled with the second voltage source via the second wire bond; a first die disposed on the first die pad; a second die disposed on the second die pad; and an encapsulant. The first die pad and the second die pad can be electrically isolated from each other such that the first die pad is maintainable at a first potential associated with the first voltage source and the second die pad is maintainable at a second potential associated with the second voltage source.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 29, 2015
    Assignee: Marvell International Ltd.
    Inventors: Shiann-Ming Liou, Chenglin Liu
  • Patent number: 9179270
    Abstract: The present application discloses methods and devices for intercommunication between mobile terminals based on digital networks. A first mobile terminal may connect to a uniquely identified server based on a first terminal identifier corresponding to the first mobile terminal. In addition, the first mobile terminal may connect to the server through a default connection setup embedded in the first terminal identifier. By acquiring terminal identifiers corresponding to interacting mobile terminals, the first mobile terminal may establish communication channels with the interacting mobile terminals. After adding the terminal identifiers of the interacting mobile terminals to the contact lists of the first mobile terminal, different regions of the first mobile terminal may be designated to the interacting mobile terminals so that the regions may display the status of communication and serve as interfaces to control receiving, playing, recording, and transmitting digital contents encoding voice messages.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 3, 2015
    Assignee: TECENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yuejun Liu, Kai Liu, Liangliang Fan, Chenglin Liu, Yi Dan
  • Publication number: 20150264731
    Abstract: A method and device for transmitting data between a peripheral device and a user device via a Bluetooth Low Energy connection, comprising: at the peripheral device: transmitting data to the user device in a simulated data stream, the transmitting comprising: identifying a first Bluetooth characteristic for writing data, the first Bluetooth characteristic having been exposed by the peripheral device to the user device; dividing a data packet into a sequence of data frames plus zero or one remainder, each data frame having a respective size equal to a predetermined data size of the identified first Bluetooth characteristic; and for each of the sequence of data frames: writing the data frame to a respective value for the identified first Bluetooth characteristic; and pushing the identified first Bluetooth characteristic for reading by the user device.
    Type: Application
    Filed: October 1, 2014
    Publication date: September 17, 2015
    Inventors: Xiangyao LIN, Liangliang Fan, Jinhai Liu, Chenglin Liu, Yaobo Hua, Shihai Cheng, Kai Liu, Rungui Ye, Zhijie Zhou, Can Liu, Nongfei Pan, Zhan Shu, Danqing Sun, Anqi Ren
  • Publication number: 20150264091
    Abstract: A method and device for controlling peripheral devices via a social networking platform includes a method and device for registering a peripheral device on a social networking platform, which includes: at a user device having one or more processors and memory: executing a social networking client application of the social networking platform on the user device; through the social networking client application, receiving an input identifying a peripheral device; and in response to receiving the input identifying the peripheral device: sending a request to establish a social networking identity for the peripheral device; and upon successful establishment of the social networking identity for the peripheral device, presenting the peripheral device as a social network contact of the user account in a user interface of the social networking client application.
    Type: Application
    Filed: August 8, 2014
    Publication date: September 17, 2015
    Inventors: Xiangyao Lin, Jinhai Liu, Chenglin Liu, Liangliang Fan, Shihai Cheng, Kai Liu
  • Publication number: 20150264730
    Abstract: A method and device for transmitting data between a peripheral device and a user device via a Bluetooth Low Energy connection, comprising: at the peripheral device: transmitting data to the user device in a simulated data stream, the transmitting comprising: identifying a first Bluetooth characteristic for writing data, the first Bluetooth characteristic having been exposed by the peripheral device to the user device; dividing a data packet into a sequence of data frames plus zero or one remainder, each data frame having a respective size equal to a predetermined data size of the identified first Bluetooth characteristic; and for each of the sequence of data frames: writing the data frame to a respective value for the identified first Bluetooth characteristic; and pushing the identified first Bluetooth characteristic for reading by the user device.
    Type: Application
    Filed: October 1, 2014
    Publication date: September 17, 2015
    Inventors: Xiangyao LIN, Liangliang FAN, Jinhai LIU, Chenglin LIU, Yaobo HUA, Shihai CHENG, Kai LIU, Rungui YE, Zhijie ZHOU, Can LIU, Nongfei PAN, Zhan SHU, Danqing SUN, Anqi REN
  • Publication number: 20150264722
    Abstract: A method and system for connecting a peripheral device to a user device via a Bluetooth protocol, comprising: at the peripheral device: initiating an broadcasting process, comprising: broadcasting a device discovery message, the device discovery message comprising a predetermined identifier designated for a social networking service associated with a social networking application executing on the user device; receiving, from the user device, a connection request corresponding to the device discovery message; and in response to receiving the connection request from the user device, establishing a Bluetooth connection to the user device.
    Type: Application
    Filed: August 19, 2014
    Publication date: September 17, 2015
    Inventors: Shihai CHENG, Liangliang FAN, Kai LIU, Xiangyao LIN, Chenglin LIU, Jinhai LIU, Yaobo HUA, Anqi REN, Rungui YE, Zhijie ZHOU, Can LIU
  • Publication number: 20150264147
    Abstract: A method and device for transmitting data between a peripheral device and a user device via a Bluetooth Low Energy connection, comprising: at the peripheral device: transmitting data to the user device in a simulated data stream, the transmitting comprising: identifying a first Bluetooth characteristic for writing data, the first Bluetooth characteristic having been exposed by the peripheral device to the user device; dividing a data packet into a sequence of data frames plus zero or one remainder, each data frame having a respective size equal to a predetermined data size of the identified first Bluetooth characteristic; and for each of the sequence of data frames: writing the data frame to a respective value for the identified first Bluetooth characteristic; and pushing the identified first Bluetooth characteristic for reading by the user device.
    Type: Application
    Filed: October 1, 2014
    Publication date: September 17, 2015
    Inventors: Xiangyao Lin, Liangliang Fan, Jinhai Liu, Chenglin Liu, Yaobo Hua, Shihai Cheng, Kai Liu, Rungui Ye, Zhijie Zhou, Can Liu, Nongfei Pan, Zhan Shu, Danqing Sun, Anqi Ren
  • Publication number: 20150264723
    Abstract: A method and system for connecting a peripheral device to a user device via a Bluetooth protocol, comprising: at the user device: initiating a device scan process, comprising: detecting a device discovery message from the peripheral device; and determining whether the device discovery message includes a predetermined identifier designated for a social networking service associated with a social networking application executing on the user device; upon determining that the device discovery message includes the predetermined identifier designated for the social networking service associated with a social networking application executing on the user device, sending, to the peripheral device, a connection request corresponding to the device discovery message; and establishing a Bluetooth connection to the peripheral device.
    Type: Application
    Filed: August 22, 2014
    Publication date: September 17, 2015
    Inventors: Shihai CHENG, Liangliang Fan, Kai Liu, Xiangyao Lin, Chenglin Liu, Jinhai Liu, Yaobo Hua, Anqi Ren, Rungui Ye, Zhijie Zhou, Can Liu
  • Patent number: 9123699
    Abstract: Embodiments provide a method of fabricating a semiconductor package, the method comprising forming a leadframe, wherein the leadframe includes an inner lead, and wherein a bottom surface of the inner lead comprises a first section and a second section; depositing an oxidation resistant material on the first section of the bottom surface of the inner lead; and forming an oxidation layer on the second section of the bottom surface of the inner lead, wherein the oxidation resistant material deposited on the first section of the bottom surface of the inner lead prevents the oxidation layer from forming on the first section of the bottom surface of the inner lead.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: September 1, 2015
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Huahung Kao, Shiann-Ming Liou
  • Publication number: 20150188855
    Abstract: Systems and methods are provided for instant messaging. For example, a first association relationship with at least one first apparatus client for instant messaging is established; and a first control instruction is transmitted to the at least one first apparatus client to trigger the at least one first apparatus client to control, according to the first control instruction, an intelligent apparatus connected to the at least one first apparatus client to execute one or more predetermined operations.
    Type: Application
    Filed: February 12, 2015
    Publication date: July 2, 2015
    Inventors: Kai Liu, Liangliang Fan, Chenglin Liu, Anqi Ren, Lejun Liu
  • Patent number: 9064784
    Abstract: A packaged IC having laser vias and methods for making the same. The packaged IC includes a die having bond pads thereon, wire bonds contacting the bond pads, and a substrate configured to electrically connect the wire bonds and external package connectors. The substrate includes mechanical vias through the substrate layers and laser vias in an uppermost substrate layer. Each laser via is closer to the die than the mechanical vias that do not overlap or are not covered by the die. The method includes routing traces on uppermost and lowermost layers, the traces electrically connecting wire bonds and external package connectors, forming mechanical vias through all layers of the substrate, forming laser vias in the uppermost substrate layer, and electrically connecting each wire bond to one trace on the uppermost substrate layer.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: June 23, 2015
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Chender Chen, Xiaoting Chang
  • Patent number: 9065788
    Abstract: A method is performed at a computer server for enabling voice communication between two terminals through IM service. Upon receiving a message from a remote computer, the message including an IM identifier of a callee terminal user and a mobile device identifier of the terminal, the computer system updates an entry for the callee terminal user in a database. Upon receiving a request from a caller terminal user at a caller terminal to start voice communication with the callee terminal user, the computer server identifies the entry that includes the IM identifier of the callee terminal user and sends a voice communication request to a service control point (SCP) in a switched telephone network. The SCP then returns an IP address and a port number of the callee terminal and launches a call request against the callee terminal. The computer server establishes a voice communication channel between the two terminals.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: June 23, 2015
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Bin Zhang, Yuejun Liu, Kai Liu, Jinhai Liu, Liangliang Fan, Chenglin Liu, Yueteng Weng, Yaxuan Zhu, Qing He, Yuexin Zhang, Jin Lin, Yuewei Chen, Qianya Lin, Kai Li, Yi Dan
  • Patent number: 8999755
    Abstract: Systems, methods, and other embodiments associated with an etched hybrid die package are described. According to one embodiment, a method includes electrically connecting a semiconductor die to at least one of a plurality of primary leads and at least one feature. The method includes applying an encapsulant material to a lead-frame that includes the plurality of primary leads to form a package body. Portions of the primary leads protrude from the package body and portions of the at least one feature are exposed within the package body. The method includes chemically etching a die pad exposed within the package body to form and electrically isolate the at least one feature from the die pad. Chemically etching includes fully etching the at least one feature from the die pad.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: April 7, 2015
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Shiann-Ming Liou
  • Publication number: 20140363014
    Abstract: An earphone wire control device, an earphone, a voice recording system and a voice recording system and method. When a switching unit turns on a first path, a microphone path is short-circuited, a first signal generating unit generates a recording start signal and cuts off the first path after generating the recording start signal so that the microphone path is turned on. When the switching unit turns on a second path, the microphone path is short-circuited, a second signal generating unit generates a recording stop signal and cuts off the second path after generating the recording stop signal.
    Type: Application
    Filed: August 13, 2014
    Publication date: December 11, 2014
    Inventors: Yuejun LIU, Chenglin LIU
  • Patent number: 8900932
    Abstract: A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 2, 2014
    Assignee: Marvell World Trade Ltd.
    Inventors: Chenglin Liu, Shiann-Ming Liou
  • Publication number: 20140323166
    Abstract: A method is performed at a computer server for enabling voice communication between two terminals through IM service. Upon receiving a message from a remote computer, the message including an IM identifier of a callee terminal user and a mobile device identifier of the terminal, the computer system updates an entry for the callee terminal user in a database. Upon receiving a request from a caller terminal user at a caller terminal to start voice communication with the callee terminal user, the computer server identifies the entry that includes the IM identifier of the callee terminal user and sends a voice communication request to a service control point (SCP) in a switched telephone network. The SCP then returns an IP address and a port number of the callee terminal and launches a call request against the callee terminal. The computer server establishes a voice communication channel between the two terminals.
    Type: Application
    Filed: January 21, 2014
    Publication date: October 30, 2014
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: BIN ZHANG, YUEJUN LIU, KAI LIU, JINHAI LIU, LIANGLIANG FAN, CHENGLIN LIU, YUETENG WENG, YAXUAN ZHU, QING HE, YUEXIN ZHANG, JIN LIN, YUEWEI CHEN, QIANYA LIN, KAI LI, YI DAN
  • Patent number: 8848313
    Abstract: A system including a printed circuit board having a plurality of vias, a first integrated circuit mounted on a first surface of the printed circuit board, and a casing mounted on a second surface of the printed circuit board. The first surface of the printed circuit board is opposite to the second surface of the printed circuit board. Each of the plurality of vias has (i) a first end extending to the first surface of the printed circuit board and (ii) a second end extending to the second surface of the printed circuit board. The first integrated circuit is in thermal contact with the first ends of the plurality of vias. The casing is in thermal contact with the second ends of the plurality of vias.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: September 30, 2014
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Shiann Liou