Patents by Inventor Chenglin Liu
Chenglin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8809118Abstract: Described herein are microelectronic packages including a plurality of bonding fingers and multiple integrated circuit chips, at least one integrated circuit chip being mounted onto the bonding fingers. According to various embodiments of the present invention, mounting the integrated circuit chip onto the bonding fingers may reduce the pin-out count by allowing multiple integrated circuit chips to be interconnected within the same microelectronic package. Other embodiments may be described and claimed.Type: GrantFiled: October 22, 2012Date of Patent: August 19, 2014Assignee: Marvell World Trade Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Publication number: 20140171139Abstract: The present application discloses methods and devices for intercommunication between mobile terminals based on digital networks. A first mobile terminal may connect to a uniquely identified server based on a first terminal identifier corresponding to the first mobile terminal. In addition, the first mobile terminal may connect to the server through a default connection setup embedded in the first terminal identifier. By acquiring terminal identifiers corresponding to interacting mobile terminals, the first mobile terminal may establish communication channels with the interacting mobile terminals. After adding the terminal identifiers of the interacting mobile terminals to the contact lists of the first mobile terminal, different regions of the first mobile terminal may be designated to the interacting mobile terminals so that the regions may display the status of communication and serve as interfaces to control receiving, playing, recording, and transmitting digital contents encoding voice messages.Type: ApplicationFiled: December 12, 2013Publication date: June 19, 2014Applicant: Tencent Technology (Shenzhen) Company LimitedInventors: Yuejun LIU, Kai LIU, Liangliang FAN, Chenglin LIU, Yi DAN
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Patent number: 8741694Abstract: Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.Type: GrantFiled: November 8, 2013Date of Patent: June 3, 2014Assignee: Marvell International Ltd.Inventors: Chender Chen, Chenglin Liu, Shiann-Ming Liou
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Patent number: 8673687Abstract: An embodiment includes a method that includes encapsulating a die and at least a portion of a lead-frame in a mold to form a package body. At least one primary lead attached to the lead-frame extends from the package body. The method includes etching a feature to within a threshold in an exposed die pad. The exposed die pad comprises a first surface that is prepared for etching and a second surface opposite to the first surface and attached to the die. The method includes positioning the die within a footprint of the exposed die pad, connecting the die to at least one primary lead, and connecting the feature to the die.Type: GrantFiled: May 3, 2010Date of Patent: March 18, 2014Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Publication number: 20140069703Abstract: Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.Type: ApplicationFiled: September 10, 2013Publication date: March 13, 2014Applicant: Marvell World Trade Ltd.Inventors: Chenglin Liu, Sheng C. Liao, Shiann-Ming Liou
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Patent number: 8581374Abstract: Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.Type: GrantFiled: September 28, 2011Date of Patent: November 12, 2013Assignee: Marvell International Ltd.Inventors: Chender Chen, Chenglin Liu, Shiann-Ming Liou
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Patent number: 8518742Abstract: A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.Type: GrantFiled: March 14, 2011Date of Patent: August 27, 2013Assignee: Marvell World Trade Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou, Albert Wu
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Patent number: 8482112Abstract: A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a second die pad; each die pad is supported by one or more supports and isolated from another; at least first and second dice, a first die being disposed on the first die pad and a second die being disposed on the second die pad; wire bonds in communication with the first and second dice; and an encapsulant adapted to encapsulate the die pads, the dice, the lead frame and the wire bonds.Type: GrantFiled: September 16, 2011Date of Patent: July 9, 2013Assignee: Marvell International Ltd.Inventors: Shiann-Ming Liou, Chenglin Liu
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Patent number: 8357568Abstract: A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.Type: GrantFiled: July 1, 2009Date of Patent: January 22, 2013Assignee: Marvell International Technology Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 8355221Abstract: A drive system including: a printed circuit board; a first integrated circuit mounted onto the printed circuit board; a drive assembly case that is connected to the printed circuit board; and a first thermal interface material thermally coupled between i) the printed circuit board and ii) the drive assembly case. Thermal energy generated by the first integrated circuit is dissipatable by the drive assembly case through the first interface material.Type: GrantFiled: July 2, 2012Date of Patent: January 15, 2013Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann Liou
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Publication number: 20130011964Abstract: A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Applicant: MARVEL WORLD TRADE LTD.Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 8294248Abstract: Described herein are microelectronic packages including a plurality of bonding fingers and multiple integrated circuit chips, at least one integrated circuit chip being mounted onto the bonding fingers. According to various embodiments of the present invention, mounting the integrated circuit chip onto the bonding fingers may reduce the pin-out count by allowing multiple integrated circuit chips to be interconnected within the same microelectronic package. Other embodiments may be described and claimed.Type: GrantFiled: November 21, 2007Date of Patent: October 23, 2012Assignee: Marvell World Trade Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 8218261Abstract: A drive system including: a printed circuit board; a first integrated circuit mounted onto the printed circuit board; a drive assembly case that is connected to the printed circuit board; and a first thermal interface material thermally coupled between i) the printed circuit board and ii) the drive assembly case. Thermal energy generated by the first integrated circuit is dissipatable by the drive assembly case through the first interface material.Type: GrantFiled: June 6, 2011Date of Patent: July 10, 2012Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann Liou
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Patent number: 8022522Abstract: A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a second die pad; each die pad is supported by one or more supports and isolated from another; at least first and second dice, a first die being disposed on the first die pad and a second die being disposed on the second die pad; wire bonds in communication with the first and second dice; and an encapsulant adapted to encapsulate the die pads, the dice, the lead frame and the wire bonds.Type: GrantFiled: March 23, 2006Date of Patent: September 20, 2011Assignee: Marvell International Ltd.Inventors: Shiann-Ming Liou, Chenglin Liu
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Patent number: 7969022Abstract: Methods for die-to-die wire-bonding, and devices and systems formed thereby, are described herein. A die to die wire-bonding method may comprise bonding a first conductive bump having a first bump size to a first die pad; bonding a first wire to a second die pad, the first wire bonded to the second die pad by a second conductive bump having a second bump size, the second bump size being smaller than the first bump size; and bonding the first wire to the first conductive bump.Type: GrantFiled: March 21, 2008Date of Patent: June 28, 2011Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 7957094Abstract: A drive system includes a printed circuit board. A first integrated circuit is associated with the printed circuit board. A drive assembly case is connected to the printed circuit board. A first thermal interface material, wherein (i) the thermal interface material is in thermal contact with the first integrated circuit and (ii) the drive assembly case is in thermal contact with the thermal interface material. The drive assembly case dissipates thermal energy generated by the first integrated circuit.Type: GrantFiled: July 23, 2010Date of Patent: June 7, 2011Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 7911053Abstract: A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.Type: GrantFiled: April 17, 2008Date of Patent: March 22, 2011Assignee: Marvell World Trade Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou, Albert Wu
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Publication number: 20110012240Abstract: This disclosure describes a multi-connect lead providing multiple connections using one external pin. In one embodiment, a lead frame for a lead-frame-based chip package includes a multi-connect lead that uses one external pin and enables multiple electrical connections to an integrated circuit die.Type: ApplicationFiled: July 6, 2010Publication date: January 20, 2011Inventors: Chenglin Liu, Thomas Ngo, Xiaoting Chang
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Publication number: 20100283143Abstract: This disclosure describes a chip package. In one embodiment, a semiconductor chip package includes a thermal dissipater placed on top of an integrated-circuit die, the thermal dissipater having a same or similar coefficient of thermal expansion as that of the integrated-circuit die.Type: ApplicationFiled: May 3, 2010Publication date: November 11, 2010Inventors: Chenglin Liu, Shiann-Ming Liou
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Patent number: 7764462Abstract: A drive system comprises a printed circuit board (PCB). A first integrated circuit (IC) associated with the PCB. A drive assembly case is connected to the PCB. At least part of the first IC is in thermal contact with the drive assembly case. The drive assembly case dissipates thermal energy generated by the first IC.Type: GrantFiled: July 28, 2006Date of Patent: July 27, 2010Assignee: Marvell International Ltd.Inventors: Chenglin Liu, Shiann-Ming Liou