Abstract: A coupled antenna module includes an antenna carrying substrate, a first antenna structure and a second antenna structure. The first antenna structure has a first radiation layer disposed on the upper surface of the antenna carrying substrate, a first extension layer disposed on the first side surface of the antenna carrying substrate, and a first conductive layer disposed on the lower surface of the antenna carrying substrate. The second antenna structure has a second radiation layer disposed on the upper surface of the antenna carrying substrate, a second extension layer disposed on the second side surface of the antenna carrying substrate, and a second conductive layer disposed on the lower surface of the antenna carrying substrate. The first antenna structure and the second antenna structure can be configured to be applied to a first antenna operating frequency range and a second antenna operating frequency range, respectively.

Abstract: A high-gain millimeter wave antenna structure and a millimeter wave antenna module. The high-gain millimeter wave antenna structure includes a first reflective plate, a second reflective plate and a millimeter wave antenna module disposed between the first and the second reflective plates. When the millimeter wave antenna module is configured to provide an original millimeter wave signal, the original millimeter wave signal provided by the millimeter wave antenna module is reflected by the first and the second reflective plates in sequence to form an operating millimeter wave signal transmitted in a same predetermined direction. Therefore, an operating antenna gain of the operating millimeter wave signal provided by the cooperation of the millimeter wave antenna module, the first reflective plate and the second reflective plate is greater than an original antenna gain of the original millimeter wave signal provided by the millimeter wave antenna module.

Abstract: A dynamic relay selection method for wireless communication system is provided, to a wireless communication group including multiple devices, comprising: a first device in the group receives beacon signals from multiple devices in the group, wherein each beacon signal includes an identity (ID) of a device transmitting the beacon signal and at least one of a device coverage of the device and an extending coverage of the device; the first device selects device(s) from the multiple devices in the group based on device coverages or extending coverages of the multiple devices in the group; and the first device broadcasts a first voice message, wherein the first voice message includes a voice packet and assignment information and the assignment information indicates the selected device(s) for relaying or forwarding the voice packet.

Abstract: A TDMB method for wireless communication system with multiple devices is provided, wherein each period of time is divided into multiple voice frames, each voice frame includes multiple voice slots, and each voice slot is divided into multiple subslots for transmitting or relaying voice packets, including: a first device receives a first voice message from a second device in a first subslot of a first voice slot in a voice frame; and the first device broadcasts a second voice message, including the voice packet, in a second subslot of a second voice slot in the voice frame if the first voice slot is not the last voice slot in the voice frame, wherein the second voice slot is a voice slot following the first voice slot, and the second subslot in the second voice slot is located at the same place as the first subslot in the first voice slot.

Abstract: An acoustic metasurface structure is configured to absorb sounds. The acoustic metasurface structure comprises a main body, an externally-connecting configuration and an inner configuration. The externally-connecting configuration and the inner configuration are respectively formed inside the main body. An externally-connecting tube of the externally-connecting configuration is in fluid communication with an external environment and an externally-connecting cavity of the externally-connecting configuration. An inner tube of the inner configuration is in fluid communication with the externally-connecting cavity and an inner cavity of the inner configuration. With the externally-connecting configuration and the inner configuration forming a series-type structure in the main body, the acoustic metasurface structure increases an acoustic impedance.

Abstract: An acoustic metasurface structure is configured to absorb sounds. The acoustic metasurface structure comprises a main body, an externally-connecting configuration and an inner configuration. The externally-connecting configuration and the inner configuration are respectively formed inside the main body. An externally-connecting tube of the externally-connecting configuration is in fluid communication with an external environment and an externally-connecting cavity of the externally-connecting configuration. An inner tube of the inner configuration is in fluid communication with the externally-connecting cavity and an inner cavity of the inner configuration. With the externally-connecting configuration and the inner configuration forming a series-type structure in the main body, the acoustic metasurface structure increases an acoustic impedance.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.

Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.

Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.

Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.

Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.