Abstract: Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 <Chemical Formula 1> Bi2TexSea-xInyMz where, in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5<x<3.0, 3.0?a<3.5, 0<y and 0?z.

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern.

Abstract: The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract: The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern on a variety of polymeric resin products or resin layers by a simplified process, while imparting excellent flame retardancy to the resin products or resin layers, and a resin structure having the conductive pattern obtained using the composition. The composition for forming a conductive pattern includes: a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.

Abstract: Disclosed is a thermoelectric material with excellent thermoelectric performance. The thermoelectric material is expressed by Chemical Formula 1 below: CuxSe1-yQy ??<Chemical Formula 1> where Q is at least one element selected from the group consisting of S and Te, 2<x?2.6 and 0<y<1.

Abstract: Methods and devices are disclosed for enabling improved performance on a multi-subscriber identification module (multi-SIM) wireless communication device. The wireless communication device may detect transmit activity on a modem stack associated with the first SIM, and detect a communication activity scheduled on a modem stack associated with the second SIM having a higher priority. If the transmit activity on the modem stack of the first SIM will impede the communication activity, the wireless device may identify subframes on the modem stack associated with the first SIM that overlap in time with the communication activity and for each identified subframe, blank symbols that conflict with the communication activity to develop a partially blanked subframe. The partially blanked subframe may be transmitted according to a blanking policy.

Abstract: Disclosed is a thermoelectric material with excellent thermoelectric conversion performance. The thermoelectric material is expressed by Chemical Formula 1 below: CuxSe1-yXy ??<Chemical Formula 1> where X is at least one element selected from the group consisting of F, Cl, Br and I, 2<x?2.6 and 0<y<1.

Abstract: Disclosed is a thermoelectric material with excellent thermoelectric conversion performance. The thermoelectric material includes a matrix having Cu and Se, a Cu-containing particle, and an Ag-containing structure.

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract: This disclosure relates to a composition for forming a conductive pattern that enables formation of fine conductive pattern on various polymer resin products or resin layers by a simplified process, and more effectively fulfills requirements of the art such as realization of various colors and the like, and a resin structure having a conductive pattern. The composition for forming a conductive pattern comprises a polymer resin; and a non-conductive metal compound including a first metal and a second metal, having a NASICON crystal structure represented by the following Chemical Formula 1, wherein a metal nucleus including the first metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.

Abstract: Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 Bi1-xMxCu1-wTwOa-yQ1yTebSez where, in Chemical Formula 1, M is at least one selected from the group consisting of Ba, Sr, Ca, Mg, Cs, K, Na, Cd, Hg, Sn, Pb, Mn, Ga, In, Tl, As and Sb, Q1 is at least one selected from the group consisting of S, Se, As and Sb, T is at least one selected from the group consisting of transition metal elements, 0?x<1, 0<w<1, 0.2<a<1.5, 0?y<1.5, 0?b<1.5 and 0?z<1.5.

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom.

Abstract: The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 ?m; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.

Abstract: Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 <Chemical Formula 1> Bi2TexSen?xInyMz where in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5<x<3.0, 3.0?a<3.5, 0<y and 0?z.

Abstract: Disclosed is a thermoelectric conversion material having excellent performance. The thermoelectric material according to the present disclosure includes a matrix including Cu and Se, and Cu-containing particles.

Abstract: Disclosed is a thermoelectric conversion material having excellent performance. The thermoelectric material according to the present disclosure includes Cu and Se, and has a plurality of different crystal structures together, in which Cu atoms and Se atoms are arranged in the crystal, at a predetermined temperature.

Abstract: Disclosed is a method for manufacturing a thermoelectric material having high thermoelectric conversion performance in a broad temperature range. The method for manufacturing a thermoelectric material according to the present disclosure includes forming a mixture by weighing Cu and Se based on the following chemical formula 1 and mixing the Cu and the Se, and forming a compound by thermally treating the mixture: <Chemical Formula 1>CuxSe where 2<x<2.6.

Abstract: Disclosed is a thermoelectric conversion material with high performance. The thermoelectric material according to the present disclosure may be represented by the following chemical formula 1: CuxSe??<Chemical Formula 1> where 2<x?2.6.

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern.