Abstract: The present invention provides a real-time three-dimensional pattern recognition imaging system having a variable focal length, a wide depth of field, a high depth resolution, a fast acquisition time, a variable magnification, a variable optical axis for tracking, and capability of compensating various optical distortions and aberrations, which enables pattern recognition systems to be more accurate as well as more robust to environmental variation. The imaging system for pattern recognition comprises one or more camera system, each of which has at least one micromirror array lens(MMAL), a two-dimensional image senor, and an image processing unit. A MMAL has unique features including a variable focal length, a variable optical axis, and a variable magnification.

Abstract: A vibration correction device in an imaging device includes a micromirror array lens, configured to focus an object image onto an image sensor, and a vibration determination device, communicatively coupled to the micromirror array lens, configured to determine vibration of the imaging device and to generate a vibration correction signal. The micromirror array lens is adjusted to change its optical axis based at least in part on the vibration correction signal to correct for the vibration of the micromirror array lens. In one aspect, the micromirror array lens includes a plurality of micromirrors and the optical axis is changed by translation and/or rotation of the plurality of micromirrors. The advantages of the present invention include elimination of need for mechanical macromotions to adjust the optical axis, high sampling rate, simple structure, and flexibility to use any type of vibration determination device.

Abstract: The present invention provides a Micromirror Array Lens (MMAL) with fixed focal length to reproduce a designed surface having optical focusing power. The micro mechanical structures with surface profile shape memory are fabricated and released after fabrication. Each micromirror in the MMAL has its own motion by stiction force and/or electrostatic force while and/or after the releasing process. Once the designed surface is formed, the MMAL has an optical power as a lens.

Abstract: The present invention provides a three-dimensional camcorder comprising a three-dimensional imaging system acquiring the three-dimensional image information of an object and a three-dimensional viewfinder displaying three-dimensional image using at least one variable focal length micromirror array lens.

Abstract: A micromirror array lens includes a micromirror lying in a micromirror layer, an electrode configured to displace the micromirror by electrostatic force, and a control wire coupled to the electrode and configured to supply voltage to the electrode to generate electrostatic force. In one embodiment, the control wire lies in a gap between the micromirror and another micromirror in the micromirror layer. In another embodiment, the control wires lie beneath the micromirror layer, such that the fill-factor of the micromirror array lens is optimized. In another embodiment, the micromirror array lens includes a passivation layer configured to provide electrical isolation between the electrode and the control wire. The advantages of the present invention include improved optical efficiency and accuracy by minimizing the voltage variation of electrode and control wire by each other and electrostatic force between control wire and micromirror.

Abstract: A micromirror array lens includes a plurality of micromirrors, and reproduces a predetermined free surface by controlling rotation and/or translation of the micromirrors. The micromirror is controlled by control circuitry, upheld by a mechanical structure, and includes a reflective surface. The predetermined free surface of the lens is changed by controlling rotation and/or translation of the micromirrors. The micromirrors are arranged in one or more concentric circles to form the lens. The micromirror has a fan shape, a hexagonal shape, a rectangular shape, a square shape, or a triangle shape. The reflective surface of the micromirror is substantially flat. The control circuitry is constructed under the micromirrors by using semiconductor microelectronics technologies. The micromirrors are actuated by electrostatic and/or electromagnetic force. The reflective surface of the micromirror is made of materials with high reflectivity.

Abstract: A three-dimensional display device includes a two-dimensional display displaying a first image, and a variable focusing lens receiving light from the two-dimensional display and forming a second image. The variable focusing lens reflects light from the two-dimensional display. The first image includes a predetermined number of first depthwise images that are displayed within a unit time, and the second image includes corresponding second depthwise images. Each depthwise image represents the portion of the first image having the same image depth, and the two-dimensional display displays one depthwise image at a time. The focal length of the variable focusing lens changes according to the depth of the depthwise image being displayed. A micromirror array lens is used as the variable focusing lens. The micromirror array lens has enough speed and focusing depth range for realistic three-dimensional display.

Abstract: A multi-motion programmable micromirror control method is provided with the multiple supports in a stepper plate to upholding the micromirror structure. The control system has advantages such that multiple motion can be applied to a micromirror and that the micromirror can be controlled in a low driving voltage and that simple motion control is applied by digital controlling and that the degrees of freedom in motion of the micromirror can be chosen by the number of the stepper plate and that only single voltage is needed for driving the micromirror motion. With many advantages, the multi-motion programmable micromirror control system provides a solution to overcome the difficulties in controlling micromirror motion.

Abstract: A new three-dimensional imaging device has been needed to overcome the problems of the prior arts that the used variable focal length lenses that are still slow, have small focal length variation and low focusing efficiency, and requires a complex mechanism to control it. The invented three-dimensional imaging system uses the variable focal length micromirror array lens. Since the micromirror array lens has lots of advantages such as very fast response time, large focal length variation, high optical focusing efficiency, large size aperture, low cost, simple mechanism, and so on, the three-dimensional imaging device can get a real-time three-dimensional image with large depth range and high depth resolution.

Abstract: There is a need for a small and fast optical zoom device that can change magnification. Conventional zoom devices require coupled mechanical motions to adjust the axial separations between individual or groups of elements in order to change the optical magnification. The mechanical motions decrease the speed of zooming, increase space and weight for zoom system, may induce unwanted jitter, and require large power consumption. In addition, the mechanical zoom system is restricted to magnifying the area on-axis. To solve problems of conventional zoom system, the zoom system utilizing one or more variable focal length micromirror array lenses without macroscopic mechanical motion of lenses is invented.

Abstract: A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of semiconductor device yield. A method is provided for producing a silicon single crystal ingot by a Czochralski method, wherein when convection of a silicon melt is divided into a core cell and an outer cell, the silicon single crystal ingot is grown under the condition that the maximal horizontal direction width of the core cell is 30 to 60% of a surface radius of the silicon melt. In one embodiment the silicon single crystal ingot is grown under the condition that the maximal vertical direction depth of the core cell is equal to or more than 50% of the maximal depth of the silicon melt.