Patents by Inventor Chi-An JEN

Chi-An JEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Driver circuit having light source driver at primary side
    Patent number: 10091473
    Abstract: A driver circuit includes a first voltage converter, a light source driver, a second voltage converter and a control circuit. The first voltage converter converts a first voltage to a second voltage. The light source driver is coupled to the first voltage converter, converts the second voltage to a third voltage and outputs the third voltage to a light source for providing light. The second voltage converter is coupled to the first voltage converter, converts the second voltage to a fourth voltage and outputs the fourth voltage. The control circuit is coupled to the second voltage converter to receive the fourth voltage and outputs a first control signal to control the light source driver for controlling the light source. The first voltage is lower than the second voltage, the second voltage is higher than the third voltage, and the second voltage is higher than the fourth voltage.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: October 2, 2018
    Assignee: Qisda Corporation
    Inventors: Chi-Jen Chen, Chun-Hsiao Lin, Fang-Chieh Lu, Chuan-Chu Chen
  • CUTTING MAT
    Publication number: 20180257251
    Abstract: A cutting mat includes two baseboards, at least one foldable sheet connecting the two baseboards and multiple back antiskid units. Each baseboard has a cutting surface formed on a front thereof and a back, wherein the two baseboards are adjacent to each other and the foldable sheet is attached to the back of each of the two baseboards for connecting the two adjacent baseboards. The foldable sheet has a pre-folding line formed thereon along an abutment between the two adjacent baseboards such that the foldable sheet is folded along the pre-folding line to make the two baseboards completely abutting each other. The multiple back antiskid units are formed by printed antiskid layers that are distributed on the back of each of the two baseboards and a back of the foldable sheet.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 13, 2018
    Inventor: Chi-Jen CHEN
  • UNLOADING MECHANISM ASSEMBLY
    Publication number: 20180261259
    Abstract: An unloading mechanism assembly adapted to unload an optical disk drive from a housing of an electronic device includes a guiding component, a push rod and a driving module. The guiding component is disposed at a side of the optical disk drive along a first direction and has a first position limiting slot extending along a second direction, perpendicular to the first direction. The push rod is disposed in parallel with the guiding component along the first direction. The driving module is coupled between the guiding component and the push rod and includes a driving rod movably disposed through the first position limiting slot along a third direction, respectively perpendicular to the first and the second directions. The push rod is adapted to drive the driving module to pivotally rotate with respect to the guiding component.
    Type: Application
    Filed: August 10, 2017
    Publication date: September 13, 2018
    Applicant: Wistron Corporation
    Inventors: Meng-Chian Shiu, Chi-Jen Lo, Jhih-Ming Chen, Chia-Hsiung Hsueh
  • OPTICAL DISK DRIVE AND LOCKING MODULE
    Publication number: 20180261258
    Abstract: An optical disk drive (ODD) including a shell and a locking module is provided. The shell includes a main body portion and a side portion, and the side portion is connected to the main body portion. A concave space is formed between a side surface of the main body portion and a top surface of the side portion. The locking module is disposed inside the concave space. The ODD is detachably held in a support frame of an electronic device through the locking module. In addition, a locking module is also provided.
    Type: Application
    Filed: July 10, 2017
    Publication date: September 13, 2018
    Applicant: Wistron Corporation
    Inventors: Jhih-Ming Chen, Meng-Chian Shiu, Chi-Jen Lo
  • Power supply
    Patent number: 10021803
    Abstract: A power supply includes a metal case, a power conversion module and an insulation connecting plate. The power conversion module is arranged in the metal case and at interval with the metal case. The power conversion module includes a circuit board. The insulation connecting plate is respectively connected with the circuit board and the metal case. The insulation connecting plate is isolated between at least a portion of the circuit board and at least a portion of the metal case. A creepage distance between the metal case and a high voltage area of the circuit board are extended by the insulation connecting plate so as to fulfill the safety requirements.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 10, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Yu-Chi Jen
  • METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING POLISHING PROCESS
    Publication number: 20180166331
    Abstract: Methods for forming semiconductor structures are provided. The method for forming a semiconductor structure includes forming a conductive material in the trench and over a top surface of the material layer and polishing the conductive material with a slurry to expose the top surface of the material layer and to form a conductive structure in the trench. The method for forming a semiconductor structure further includes forming a material layer over a substrate and forming a trench in the material layer. The method for forming a semiconductor structure further includes removing the slurry with a reducing solution. In addition, the reducing solution includes a reducing agent, and a standard electrode voltage of the conductive material is greater than a standard electrode voltage of the reducing agent.
    Type: Application
    Filed: January 9, 2017
    Publication date: June 14, 2018
    Inventors: Chun-Wei HSU, Chi-Jen LIU, Cheng-Chun CHANG, Yi-Sheng LIN, Pinlei Edmund CHU, Liang-Guang CHEN
  • AROUND-VIEW CAMERA DEVICE
    Publication number: 20180157151
    Abstract: An around-view camera device includes a camera body, two around-view lenses, and a counterweight piece. The camera body includes two openings, a casing, and a circuit board, where the two openings are respectively provided on two opposite sides of the casing, and the circuit board is disposed within the casing. The two around-view lenses are respectively accommodated within the two openings of the camera body and are separately electrically connected to the circuit board. The counterweight piece is disposed on a side, different from sides of the two around-view lenses, of the casing or the circuit board far away from a center of gravity of the camera body.
    Type: Application
    Filed: November 17, 2017
    Publication date: June 7, 2018
    Inventors: Wen-Pin Lee, Chi-Jen Chen
  • POWER DISTRIBUTION UNIT WITH HOT-SWAPPABLE MODULE AND POWER MANAGEMENT SYSTEM
    Publication number: 20180131163
    Abstract: A power distribution unit includes a power input terminal, a main body, plural power-providing units, a coupling module and a hot-swappable module. The plural power-providing units are installed on the main body and electrically connected with plural electronic devices to provide electric power to the plural electronic devices. The coupling module is embedded within the main body. The hot-swappable module is detachably connected with the coupling module. When the hot-swappable module is connected with and disposed within the coupling module, the power distribution unit is in communication with a remote power management unit and/or an adjacent power distribution unit.
    Type: Application
    Filed: June 2, 2017
    Publication date: May 10, 2018
    Inventors: Yu-Chi Jen, Chih-Chiang Chan, Chin Lien
  • ORGANIC ELECTROLUMINESCENT DEVICES
    Publication number: 20180076391
    Abstract: An organic electroluminescent device includes a cathode, an anode, and a light emitting layer interposed between the anode and cathode, wherein the light emitting layer includes a host emitter and a guest emitter represented by formula (I): wherein X and Y independently represent hydrogen, or an aryl group or a heteroaryl group having 5 to 10 carbon atoms, X and Y are the same or different, and Ar1 and Ar2 independently represent hydrogen, or an unsubstituted or substituted aryl group having 5 to 12 carbon atoms, or Ar1 and Ar2 form a fused aromatic ring system together with an attached carbon atom.
    Type: Application
    Filed: March 28, 2017
    Publication date: March 15, 2018
    Inventors: Heh-Lung Huang, Po-Wei Hsu, Chi-Jen Lin
  • Oxidation and etching post metal gate CMP
    Patent number: 9917173
    Abstract: A method includes forming a dummy gate of a transistor at a surface of a wafer, removing the dummy gate, and filling a metallic material into a trench left by the removed dummy gate. A Chemical Mechanical Polish (CMP) is then performed on the metallic material, wherein a remaining portion of the metallic material forms a metal gate of the transistor. After the CMP, a treatment is performed on an exposed top surface of the metal gate using an oxidation-and-etching agent comprising chlorine and oxygen.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: March 13, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Jen Liu, Li-Chieh Wu, Liang-Guang Chen, Shich-Chang Suen
  • CURING APPARATUS AND METHOD USING THE SAME
    Publication number: 20180061685
    Abstract: A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber and the UV light source for allowing a UV light from the UV light source passing through and entering the processing chamber, a sealing ring disposed between the processing chamber and the window for sealing the processing chamber, and a light shading kit disposed between the UV light source and the sealing ring for preventing the sealing ring from being exposed of the UV light. Therefore the sealing ring is not exposed of UV light directly, and the bonding of the rubber sealing ring would not be destroyed.
    Type: Application
    Filed: November 3, 2017
    Publication date: March 1, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Kuang NI, Chi-Jen CHEN, Peng-Cheng HONG
  • Single fire-wire phase-front dynamic AC power fetching module
    Patent number: 9837928
    Abstract: A single fire-wire phase-front dynamic AC power fetching module, comprising: two series-connected type synchronous power fetching circuits connected in parallel, and an electronic switch connected thereto, one series-connected type synchronous power fetching circuit is used to perform positive phase AC power fetching, while the other series-connected type synchronous power fetching circuit is used to perform negative phase AC power fetching. The electronic switch is formed by a relay or a silicon control crystal (TRIAC) controlled by an MCU microprocessor. As such, through adopting bi-directional dynamic full-bridge type power fetching, for a single fire wire, it is able to perform power fetching twice in a cycle. The duration of power fetching can be regulated automatically depending on the load, to compensate for the power, and supply it to an outside circuit as the basic power supply.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: December 5, 2017
    Assignee: LOONG YEE INDUSTRIAL CORP., LTD.
    Inventor: Chi-Jen Wang
  • RETAINER RING FOR SEMICONDUCTOR MANUFACTURING PROCESSES
    Publication number: 20170341201
    Abstract: An embodiment retainer ring includes an outer ring encircling an opening and an inner ring attached to the outer ring. The inner ring is disposed between the opening and the outer ring. The inner ring includes a softer material than the outer ring and a plurality of voids within the softer material.
    Type: Application
    Filed: May 26, 2016
    Publication date: November 30, 2017
    Inventors: Chun-Wei Hsu, Chi-Jen Liu, Liang-Guang Chen, Chih-Chung Chang, Cheng-Chun Chang, Hsin-Kai Chen, Yi-Sheng Lin, Shi-Ya Hsu, Tsung-Ju Lin, Yi-Sheng Ma
  • Electronic module ejecting mechanism and portable electronic device thereof
    Patent number: 9830953
    Abstract: An electronic module ejecting mechanism includes a frame, a door pivoted to the frame, a rod, a sliding sheet slidably disposed on the door, a swing sheet, and a button connected to the sliding sheet. An electronic module is inserted into an opening of the frame. The rod is slidably disposed in the frame and has groove and bending ends. The swing sheet is pivoted to the sliding sheet and has a latch end for inserting into the groove end when the sliding sheet slides to a lock position. When the latch end is inserted into the groove end and the swing sheet swings to an expanding position with opening of the door, the latch end pulls the groove end to make the bending end push the electronic module to partially protrude from the opening. When the door continues opening outwardly, the latch end is separate from the groove end.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: November 28, 2017
    Assignee: Wistron Corporation
    Inventors: Jhih-Ming Chen, Meng-Chian Shiu, Chi-Jen Lo
  • Curing apparatus and method using the same
    Patent number: 9818628
    Abstract: A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber and the UV light source for allowing a UV light from the UV light source passing through and entering the processing chamber, a sealing ring disposed between the processing chamber and the window for sealing the processing chamber, and a light shading kit disposed between the UV light source and the sealing ring for preventing the sealing ring from being exposed of the UV light. Therefore the sealing ring is not exposed of UV light directly, and the bonding of the rubber sealing ring would not be destroyed.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: November 14, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Kuang Ni, Chi-Jen Chen, Peng-Cheng Hong
  • COMPOUNDS FOR ORGANIC ELECTROLUMINESCENT COMPONENTS AND ORGANIC ELECTROLUMINESCENT DEVICES USING THE SAME
    Publication number: 20170279054
    Abstract: The present disclosure provides a novel compound of formula (I) and organic electroluminescent devices using the same: wherein, X1 and A1 each independently represent a substituted or unsubstituted (C6-C30) aryl, a substituted or unsubstituted 5- to 30-membered heteroaryl; and n is an integer of 1 or 2, and when n is 1, X1 is the substituted or unsubstituted (C6-C30) aryl.
    Type: Application
    Filed: June 10, 2016
    Publication date: September 28, 2017
    Inventors: Heh-Lung Huang, Yi-Huan Fu, Huang-Ying Lin, Chi-Jen Lin
  • Formation method of semiconductor device structure
    Patent number: 9768064
    Abstract: Formation methods of a semiconductor device structure are provided. The method includes providing a substrate having a low topography region and a high low topography region. The method also includes forming a first dielectric layer over the substrate. The method further includes forming a second dielectric layer over the stop layer. In addition, the method includes forming an opening in the first dielectric layer, the stop layer and the second dielectric layer. The method also includes forming a conductive material layer over the second dielectric layer. The conductive material layer fills the opening. The method further includes performing a polishing process over the conductive material layer until a top surface of the stop layer is exposed.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: September 19, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Wei Hsu, Chi-Jen Liu, Cheng-Chun Chang, Yi-Sheng Lin, Liang-Guang Chen
  • POWER SUPPLY
    Publication number: 20170250010
    Abstract: A power supply includes a metal case, a power conversion module and an insulation connecting plate. The power conversion module is arranged in the metal case and at interval with the metal case. The power conversion module includes a circuit board. The insulation connecting plate is respectively connected with the circuit board and the metal case. The insulation connecting plate is isolated between at least a portion of the circuit board and at least a portion of the metal case. A creepage distance between the metal case and a high voltage area of the circuit board are extended by the insulation connecting plate so as to fulfill the safety requirements.
    Type: Application
    Filed: February 26, 2016
    Publication date: August 31, 2017
    Inventor: Yu-Chi JEN
  • Wearable device
    Patent number: D800109
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: October 17, 2017
    Assignee: HTC Corporation
    Inventors: Nichole Suzanne Rouillac, Luane Rowe, Maxime David Eric Dubreucq, Lawrence Herman Fong, Chi Jen Lu, Christina L. Ng, Jenny Yoon Joo Lee
  • Wristband
    Patent number: D829712
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: October 2, 2018
    Assignee: HTC Corporation
    Inventors: Jonah Avram Becker, Nichole Suzanne Rouillac, Lawrence Herman Fong, Min-Jung Kim, Chi-Jen Lu, Christina L. Ng