Patents by Inventor Chi-An Wu

Chi-An Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991472
    Abstract: A method for image processing is provided. The method includes: capturing and receiving a first set of photo frames; storing the first set of photo frames into a storage unit; performing image processing on the first set of photo frames; and capturing and receiving a second set of photo frames. The performing image processing on the first set of photo frames and the capturing and receiving the second set of photo frames are performed simultaneously. The performing image processing on the first set of photo frames includes: reading the first set of photo frames from the storage unit; storing the first set of photo frames into a temporary storage unit; performing image processing on the first set of photo frames by using an image processing algorithm; and outputting a first output picture.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: May 21, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hui-Chi Chuang, Jo-Fan Wu
  • Patent number: 11990708
    Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 21, 2024
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Sheng-Pin Gao, Yong-Chun Xu, Hung-Chi Yu, Chih-Ching Hsu, Jie Zhang, Chin-Jung Wu
  • Patent number: 11990292
    Abstract: A computing device can include a housing defining an opening, a base layer, and a button mechanism positioned in the opening. The button mechanism can include a keycap movable relative to the base layer between an undepressed state and a depressed state, and a dome contacting the keycap, the dome including a first surface and a second surface, opposite the first surface. In the undepressed state, the first surface can be concave and the second surface can be convex. In a partially depressed state, a first portion of the first surface can be convex and a second portion of the first surface can be concave. In the depressed state, the first surface can be convex and the second surface can be concave.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: May 21, 2024
    Assignee: APPLE INC.
    Inventors: Yu-Po Chang, Chia Chi Wu
  • Patent number: 11990493
    Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a front surface, a back surface opposite to the front surface, and a light-sensing region close to the front surface. The image sensor device includes an insulating layer covering the back surface and extending into the semiconductor substrate. The protection layer has a first refractive index, and the first refractive index is less than a second refractive index of the semiconductor substrate and greater than a third refractive index of the insulating layer, and the protection layer conformally and continuously covers the back surface and extends into the semiconductor substrate. The image sensor device includes a reflective structure surrounded by insulating layer in the semiconductor substrate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Chieh Fang, Ming-Chi Wu, Ji-Heng Jiang, Chi-Yuan Wen, Chien-Nan Tu, Yu-Lung Yeh, Shih-Shiung Chen, Kun-Yu Lin
  • Patent number: 11990545
    Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsu-Hsiu Perng, Yun-Chi Wu, Chia-Chen Chang, Cheng-Bo Shu, Jyun-Guan Jhou, Pei-Lun Wang
  • Patent number: 11986230
    Abstract: The disclosure provides a flexible cryoablation needle device resistant to a low temperature and a high pressure, a threaded part is arranged on the outer wall of a liner pipe to enhance a connection strength between the liner pipe and a flexible pipe structure. Since an annular protrusion portion is arranged on the outer wall of the liner pipe, further leakage of a gas coming from a pressure relief process is prevented and the connection strength is enhanced as well. Air tightness and connection strength are further guaranteed by radial extrusion of extruding pipes. And an inner cavity in a cutter head is directly subjected to pressure relief through a cutter head vent, a pressure relief intermediate cavity, a liner vent, a flexible pipe vent and a pressure relief gap.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: May 21, 2024
    Assignee: ACCU TARGET MEDIPHARM (SHANGHAI) CO., LTD.
    Inventors: Chi Yang, Binkai Xu, Yinlong Wu, Rui Zhang
  • Patent number: 11988831
    Abstract: A method of displaying a rear-view image and a mobile device using the method are provided. The method includes: receiving the rear-view image; displaying a virtual dashboard through a display; and displaying the rear-view image on a default area of the virtual dashboard in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: May 21, 2024
    Assignee: Kinpo Electronics, Inc.
    Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
  • Publication number: 20240163147
    Abstract: A method for determining a reference signal sequence, a terminal device, and a network device, the including receiving, by a terminal device, first indication information sent by a network device, determining, by the terminal device, a target resource based on the first indication information, determining, by the terminal device, a reference signal sequence based on parameters of a first bandwidth and parameters of a second bandwidth, and sending or receiving, by the terminal device, the reference signal sequence on the target resource.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 16, 2024
    Inventors: Ming Wu, Hao Tang, Chi Zhang, Mengying Ding
  • Publication number: 20240158309
    Abstract: The invention provides a material surface treatment equipment, which is applied to a material substrate. The material surface treatment equipment includes a surface treatment device and at least one waveguide device. The surface treatment device is used to carry the material substrate to perform a surface treatment process. Each waveguide device is used for introducing electromagnetic waves to the material substrate to assist in performing the surface treatment process. Through the introduction of electromagnetic waves, the surface treatment process of the material substrate is easy to perform and can achieve the strengthening effect.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 16, 2024
    Inventors: TIEN-HSI LEE, JUN-HUANG WU, YU-SHENG CHIOU, SHU-CHENG LI, WEI-CHI HUANG, HSIN CHEN
  • Publication number: 20240162602
    Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 16, 2024
    Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
  • Patent number: 11982019
    Abstract: A crystal growth doping apparatus and a crystal growth doping method are provided. The crystal growth doping apparatus includes a crystal growth furnace and a doping device that includes a feeding tube inserted to the furnace body along an oblique insertion direction, and a storage cover and a gate tube that are disposed in the feeding tube. The feeding tube extends from an outer surface thereof to form a placement opening, and the placement opening is recessed from an edge thereof to form an upper recessed portion and a lower recessed portion along the oblique insertion direction. The storage cover includes a storage tank and a handle. When the storage cover is disposed in the gate tube body, the gate tube body is configured to isolate an inner space of the feeding tube from the placement opening.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: May 14, 2024
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Yu-Chih Chu, Tang-Chi Lin, Han-Sheng Wu, Hsien-Ta Tseng
  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11984465
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20240151642
    Abstract: A terahertz wave detection chip includes a substrate and at least one detection structure. The detection structure is disposed on a surface of the substrate. The detection structure includes a metamaterial layer and a hydrophilic layer, and the hydrophilic layer is disposed on the metamaterial layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai LI, Kao-Chi LIN, Cho-Fan HSIEH, Teng-Chun WU
  • Publication number: 20240154972
    Abstract: A method for permission management includes: generating a plurality of job roles with different permissions according to organization permission table; generating first permission structure directed graph according to the job roles; selecting one of the job roles in first permission structure directed graph as target job role; generating minimum directed spanning graph in first permission structure directed graph according to target job role; determining whether permission of each of the job roles in first permission structure directed graph matches job of each of the job roles in first permission structure directed graph; and adjusting permission and job of each of the job roles to generate second permission structure directed graph if it is determined that permission of each of the job roles in first permission structure directed graph does not match job of each of the job roles in first permission structure directed graph.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 9, 2024
    Inventors: Wei-Chao CHEN, Ming-Chi CHANG, Chih-Pin WEI, Chuo-Jui WU
  • Publication number: 20240151200
    Abstract: A remote controller is provided. The remote controller includes a motion sensing circuit and a wireless communication circuit electrically connected to the motion sensing circuit. The motion sensing circuit determines whether or not a motion of the remote controller complies with one of multiple reference motions. When the motion of the remote controller complies with one of the reference motions, the wireless communication circuit is switched from a sleep state to a working state. The wireless communication circuit that is in the working state determines whether or not a received signal strength indication between the remote controller and a controlled device is greater than or equal to a strength threshold. When the received signal strength indication is less than the strength threshold, the wireless communication circuit is switched from the working state to the sleep state.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Inventors: CHIA-HSIN WU, CHUI-SUNG PENG, CHU-CHI SUN, FU-MING KANG
  • Publication number: 20240152679
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Patent number: 11978410
    Abstract: A method of backlight control for a display panel is provided. The display panel is configured to display with a variable refresh rate in a plurality of frame periods each having a fixed period and a variable period. The method includes steps of: generating a first backlight control signal in the fixed period of a frame period; determining whether a liquid crystal (LC) transition time corresponding to the frame period ends before an end time of the variable period of the frame period; generating a second backlight control signal in the variable period of the frame period when the LC transition time ends before the end time of the variable period of the frame period; and generating a compensation backlight control signal in a next frame period according to a backlight duty cycle of the frame period.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: May 7, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Po-Hsiang Huang, Chung-Wen Wu, Jiun-Yi Lin, Wen-Chi Lin
  • Patent number: D1027716
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: May 21, 2024
    Assignee: Fourstar Group Inc.
    Inventor: Yu-Chi Wu