Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

Abstract: A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The substrate unit includes a carrier plate, a glass substrate and an interlayer disposed between the carrier plate and the glass substrate. The thickness of the glass substrate is less than that of the carrier plate, and the thickness of the interlayer is less than that of the glass substrate. The display device includes a first glass substrate, a second glass substrate, a device layer and a sealing layer. The device layer and the sealing layer are disposed between the first glass substrate and the second glass substrate, wherein the sealing layer, the first glass substrate and the second glass substrate form an enclosed space, and the device layer is disposed in the enclosed space. The thickness of the first glass substrate is between 0.05 mm and 0.3 mm.

Abstract: A method for manufacturing an electronic device is disclosed, which includes the following steps: providing a first substrate and modifying a surface of the first substrate to obtain a modified surface; applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer; heat-treating the adhesion precursor layer to form an adhesion layer; forming an inorganic layer on the adhesion layer; and forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.

Abstract: A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The method for manufacturing the display device includes the steps of: providing a first carrier plate and forming a first interlayer on the first carrier plate; disposing a first glass substrate on the first interlayer to form a first substrate unit; forming a first device layer on the first glass substrate to obtain a first device substrate; providing a second carrier plate and forming a second interlayer on the second carrier plate; disposing a second glass substrate on the second interlayer to form a second substrate unit; combining the first device substrate with the second substrate unit; separating the first glass substrate from the first interlayer; and separating the second glass substrate from the second interlayer to obtain the display device.

Abstract: An etching solution and a manufacturing method of a display are provided. The etching solution includes hydrogen peroxide (H2O2), succinic acid, malonic acid, acetic acid, sulfuric acid, 1-amino-2-propanol, 5-amino-1H-tetrazole, N,N,N?N?-tetrakis(2-hydroxypropyl) ethylenediamine (EDTP) and glycine homogenously mixed in deionized water. Hydrogen peroxide is in an amount of 5-10 wt % of the etching solution, succinic acid is in an amount of 0.5-10 wt % of the etching solution, malonic acid is in an amount of 0.5-10 wt % of the etching solution, acetic acid is in an amount of 1-10 wt % of the etching solution, sulfuric acid is in an amount of 0.5-5 wt % of the etching solution, 1-amino-2-propanol is in an amount of 1-20 wt % of the etching solution, 5-amino-1H-tetrazole is in an amount of 0.01-0.5 wt % of the etching solution, EDTP is in an amount of 1-15 wt % of the etching solution, and glycine is in an amount of 1-5 wt % of the etching solution.

Abstract: An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product of silane or derivatives thereof; an inorganic layer disposed on the adhesion layer; and an active unit disposed on the inorganic layer. In addition, the present disclosure also provides a method for manufacturing the aforementioned electronic device.

Abstract: A display device includes a first substrate, a second substrate disposed opposite to the first substrate, a display unit disposed between the first substrate and the second substrate, a spacing body disposed between the first substrate and the second substrate and surrounding the display unit, and an adhesive member including silane compound, a first portion of the adhesive member disposed between the spacing body and the first substrate.

Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

Abstract: An etching solution and a manufacturing method of a display are provided. The etching solution includes hydrogen peroxide (H2O2), succinic acid, malonic acid, acetic acid, sulfuric acid, 1-amino-2-propanol, 5-amino-1H-tetrazole, N,N,N?N?-tetrakis(2-hydroxypropyl) ethylenediamine (EDTP) and glycine homogenously mixed in deionized water. Hydrogen peroxide is in an amount of 5-10 wt % of the etching solution, succinic acid is in an amount of 0.5-10 wt % of the etching solution, malonic acid is in an amount of 0.5-10 wt % of the etching solution, acetic acid is in an amount of 1-10 wt % of the etching solution, sulfuric acid is in an amount of 0.5-5 wt % of the etching solution, 1-amino-2-propanol is in an amount of 1-20 wt % of the etching solution, 5-amino-1H-tetrazole is in an amount of 0.01-0.5 wt % of the etching solution, EDTP is in an amount of 1-15 wt % of the etching solution, and glycine is in an amount of 1-5 wt % of the etching solution.

Abstract: An electronic apparatus and a method for manufacturing the same are disclosed. The electronic device of the present invention comprises: a substrate with a first surface and a second surface; an electronic unit layer disposed on the first surface of the substrate; a residue layer disposed on the second surface of the substrate, wherein a material of the residue layer comprises: a compound containing at least one functional group selected from the group consisting of aryl, nitro and ketone.

Abstract: A display device is provided. The display device includes a first substrate, a first barrier layer disposed on the first substrate, a second substrate, a second barrier layer disposed on the second substrate, an display medium disposed between the first barrier layer and the second barrier layer, and a metal enclosing wall connecting the first substrate to the second substrate and surrounding the display medium. The metal enclosing wall includes a first metal layer having a first opening and connected to the first substrate, a second metal layer connected to the second substrate, and a third metal layer formed between the first metal layer and the second metal layer.

Abstract: An electronic device and a method for manufacturing the same are disclosed. The electronic device of the present disclosure comprises: a target unit comprising an electronic unit layer; and small molecule residues adhered on a side of the target unit, wherein the small molecule residues are at least one selected from the group consisting of and R1, R1?, R2, R2?, R3, R3?, R4, R5, R6, R7, R8 are defined in the specification.

Abstract: An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product of silane or derivatives thereof; an inorganic layer disposed on the adhesion layer; and an active unit disposed on the inorganic layer. In addition, the present disclosure also provides a method for manufacturing the aforementioned electronic device.

Abstract: A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The method for manufacturing the display device includes the steps of: providing a first carrier plate and forming a first interlayer on the first carrier plate; disposing a first glass substrate on the first interlayer to form a first substrate unit; forming a first device layer on the first glass substrate to obtain a first device substrate; providing a second carrier plate and forming a second interlayer on the second carrier plate; disposing a second glass substrate on the second interlayer to form a second substrate unit; combining the first device substrate with the second substrate unit; separating the first glass substrate from the first interlayer; and separating the second glass substrate from the second interlayer to obtain the display device.

Abstract: A method for manufacturing a display is provided. A display including a supporting layer, a flexible layer and a display structure is provided. The display structure has a top side and a bottom side which are opposite to each other. One of the supporting layer and the flexible layer is disposed at the bottom side of the display structure, and the other one of the supporting layer and the flexible layer is disposed at the top side or the bottom side of the display structure. When the supporting layer and the flexible layer are both disposed at the bottom side of the display structure, the flexible layer is located between the supporting layer and the display structure.

Abstract: A display device is provided. The display device includes a first substrate, a first barrier layer disposed on the first substrate, a second substrate, a second barrier layer disposed on the second substrate, an display medium disposed between the first barrier layer and the second barrier layer, and a metal enclosing wall connecting the first substrate to the second substrate and surrounding the display medium. The metal enclosing wall includes a first metal layer having a first opening and connected to the first substrate, a second metal layer connected to the second substrate, and a third metal layer formed between the first metal layer and the second metal layer.

Abstract: An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.

Abstract: An organic light emitting diode display device and a manufacturing method thereof are provided. The organic light emitting diode display device includes a first flexible substrate, a second flexible substrate, a first barrier layer, a second barrier layer, an organic light emitting diode element, and a metal enclosing wall. The first barrier layer is disposed on the first flexible substrate, and the second barrier layer is disposed on the second flexible substrate. The organic light emitting diode element is disposed between the first barrier layer and the second barrier layer. The metal enclosing wall connects the first flexible substrate to the second flexible substrate and surrounds the organic light emitting diode element.