Patents by Inventor Chi Chen

Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11887987
    Abstract: A circuit includes a base silicon layer, a base oxide layer, a first top silicon layer, a second top silicon layer, a first semiconductor device, and a second semiconductor device. The base oxide layer is formed over the base silicon layer. The first top silicon layer is formed over a first region of the base oxide layer and has a first thickness. The second top silicon layer is formed over a second region of the base oxide layer and has a second thickness less than the first thickness. The first semiconductor device is formed over the first top silicon layer and the second semiconductor device is formed over the second top silicon layer. The ability to fabricate a top silicon layers with differing thicknesses can provide a single substrate having devices with different characteristics, such as having both fully depleted and partially depleted devices on a single substrate.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: January 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Gulbagh Singh, Kuan-Liang Liu, Wang Po-Jen, Kun-Tsang Chuang, Hsin-Chi Chen
  • Publication number: 20240028492
    Abstract: Techniques for storage testing involve: acquiring a first state of a storage system including first input/output (IO) load information; taking a first action based on the first state, the first action causing the first IO load information to be changed to second IO load information; updating the first action to be a reserved action for the first state if it is obtained based on the second IO load information that the storage system reaches a preset condition; and obtaining an action combination of a plurality of IO load information changes based on a plurality of reserved actions corresponding to a plurality of states, wherein the plurality of states include the first state. Accordingly, the most effective load combination change mode for the storage system can be found automatically and more accurately, so as to find more vulnerabilities of the storage system, thereby improving the efficiency of storage system testing.
    Type: Application
    Filed: February 1, 2023
    Publication date: January 25, 2024
    Inventors: Chi Chen, Changyue Dai, En Shi, Hailan Dong
  • Patent number: 11880606
    Abstract: An apparatus comprises a processing device configured to obtain information characterizing historical boot times for virtual machines associated with virtual volumes hosted on a storage cluster comprising a plurality of storage nodes, and to determine, based at least in part on the obtained information, whether any of the storage nodes has at least a threshold likelihood of experiencing a designated virtual machine boot condition during a given time period. The processing device is further configured, responsive to determining that a first one of the storage nodes has at least the threshold likelihood of experiencing the designated virtual machine boot condition during the given time period, to identify a subset of the virtual machines associated with a subset of the virtual volumes hosted on the first storage node and to move at least one of the subset of the virtual volumes to a second one of the storage nodes.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: January 23, 2024
    Assignee: Dell Products L.P.
    Inventors: Huijuan Fan, Chi Chen
  • Publication number: 20240015333
    Abstract: A device for decoding video data comprises one or more processors configured to: obtain a syntax element from a bitstream that includes an encoded representation of the video data; determine, based on the syntax element, that a template-matching tool is enabled; based on the template-matching tool being enabled, applying the template-matching tool to generate a prediction block for a current coding unit (CU) of the video data; and reconstruct the current CU based on the prediction block for the current CU.
    Type: Application
    Filed: June 21, 2023
    Publication date: January 11, 2024
    Inventors: Chun-Chi Chen, Han Huang, Vadim Seregin, Marta Karczewicz
  • Publication number: 20240013406
    Abstract: A trajectory predicting method and a computing system for trajectory prediction are provided. In the method, feature extraction is respectively performed on past trajectories of multiple target objects through an encoder to generate first trajectory information of the target objects. A pooling process is performed on the first trajectory information of the target objects to generate second trajectory information of the target objects. The second trajectory information of each target object includes location relationships relative to other target objects. Third trajectory information is obtained from the past trajectories of the target objects. The third trajectory information includes a moving direction, scene information, and/or a moving mode. The predicted trajectories of the target objects are generated according to the second trajectory information and the third trajectory information through a decoder. Accordingly, the accuracy of prediction can be improved.
    Type: Application
    Filed: October 27, 2022
    Publication date: January 11, 2024
    Applicant: Wistron Corporation
    Inventors: Xiu Zhi Chen, Jyun Hong He, Yen Lin Chen, Yung Jen Chen, Yi Kai Chiu, You Shiuan Lin, Kuo-Lun Huang, Ke Kang Chen, Shao-Chi Chen
  • Patent number: 11869828
    Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: January 9, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi-Chi Chen, Ming-Han Wang
  • Publication number: 20240006133
    Abstract: A key structure of keyboard including a base, at least one force sensing membrane disposed on the base, a scissors mechanism, a key cap, a bracket sets assembled to the key cap, a first sleeve, a second sleeve, a spring, and a pressing member disposed at a bottom of the second sleeve is provided. A side of the scissors mechanism is movably leaned against the base and located on the force sensing membrane, and another side of the scissors mechanism is pivoted to the bracket sets. A portion of the first sleeve is assembled between the key cap and the bracket sets, and another portion of the first sleeve passes through the bracket sets. The second sleeve is movably socketed in the first sleeve. The spring is leaned against the second sleeve and the key cap. A keyboard is also provided.
    Type: Application
    Filed: November 29, 2022
    Publication date: January 4, 2024
    Applicant: Acer Incorporated
    Inventor: Hung-Chi Chen
  • Publication number: 20240006458
    Abstract: An image sensor device is disclosed which includes a semiconductor layer having a first surface and a second surface, where the second surface is opposite to the first surface. The device includes a conductive structure disposed over the first surface, with a dielectric layer disposed between the conductive structure and the first surface. The device includes a first dielectric layer disposed over the second surface of the semiconductor substrate. The device includes a second dielectric layer disposed over the first dielectric layer. The device includes a color filter layer disposed over the second dielectric layer. In some embodiments, the thickness, refractive index, or both of the first dielectric layer and the thickness, refractive index, or both of the second dielectric layer may be collectively determined to cause incident radiation passing through the first dielectric layer and the second dielectric layer and to the plurality of pixels to have destructive interference.
    Type: Application
    Filed: August 4, 2023
    Publication date: January 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Feng-Chien Hsieh, Chia-Yen Hsu, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee, Hsin-Chi Chen
  • Publication number: 20240005475
    Abstract: The present invention provides a photomask inspection method, including steps of defining an anchor ratio, providing a photomask and measuring the photomask to obtain a measured ratio, wherein the measured ratio is equal to a value of an image intensity extremum divided by an image intensity threshold or is equal to a value of the image intensity threshold divided by the image intensity extremum when the photomask is measured in an image measurement system tool for a specific critical dimension, and if the measured ratio is larger than the anchor ratio, the photomask is regarded as passing the inspection, and if the measured ratio is smaller than the anchor ratio, the photomask is regarded as failing the inspection.
    Type: Application
    Filed: August 1, 2022
    Publication date: January 4, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Pai-Chi Chen, Chian-Ting Huang, Yung-Feng Cheng
  • Patent number: 11862410
    Abstract: A key structure including a base, a light sensing module, a carrier, a magnetic member, a cap, and a scissor structure are provided. The light sensing module is disposed at the base. The carrier is located above the base. The magnetic member is disposed on the carrier. The cap is adapted to be assembled to the carrier via a magnetic attracting force of the magnetic member or adapted to be detached from the carrier via overcoming the magnetic attracting force of the magnetic member. The scissor structure is connected between the base and the carrier. The carrier and the cap disposed thereon move up and down relative to the base via the scissor structure. An orthogonal projection of the magnetic member on the base is not overlapped with an orthogonal projection of the light sensing module on the base. A keyboard is also provided.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: January 2, 2024
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Shun-Bin Chen, Huei-Ting Chuang, Wen-Chieh Tai, Yi-Hsin Pan
  • Publication number: 20230420126
    Abstract: A bloodstream infection predicting system and a method thereof are proposed. The memory unit stores a plurality of historical medical data, the real-time data to be tested and a machine learning algorithm. The processor is configured to implement a bloodstream infection predicting method. The bloodstream infection predicting method includes reading the historical medical data from the memory unit, training the historical medical data to generate a bloodstream infection prediction model, reading the real-time data to be tested of the patient from the memory unit, and inputting the real-time data to be tested into the bloodstream infection prediction model to generate the bloodstream infection risk probability. The real-time data to be tested includes an intensive care unit detecting data and a blood inspection data of the patient. The intensive care unit detecting data and the blood inspection data are detected during a feature window time interval.
    Type: Application
    Filed: June 23, 2022
    Publication date: December 28, 2023
    Inventors: Chieh-Liang WU, Po-Yu LIU, Kai-Chih PAI, Lai-Shiun LAI, Min-Shian WANG, Ruey-Kai SHEU, Lun-Chi CHEN
  • Publication number: 20230418489
    Abstract: An apparatus comprises a processing device configured to identify storage workloads to be run on a storage system, and to determine a mix of input/output (TO) patterns associated with the identified storage workloads, the mix of IO patterns comprising a first set of IO patterns characterizing types of IO operations performed by a first storage workload and at least a second set of IO patterns characterizing types of IO operations performed by a second storage workload. The processing device is also configured to calculate an affinity metric for the mix of IO patterns, the calculated affinity metric characterizing a difference between (i) performance metrics for the mix of IO patterns running concurrently and (ii) the first and second sets of IO patterns running individually. The processing device is further configured to allocate the identified storage workloads to storage devices of the storage system based on the calculated affinity metric.
    Type: Application
    Filed: July 8, 2022
    Publication date: December 28, 2023
    Inventors: Chi Chen, Hailan Dong, Huijuan Fan
  • Patent number: 11855118
    Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a device layer, and a color filter layer. The semiconductor substrate has a photosensitive region and an isolation region surrounding the photosensitive region. The radiation sensing member is embedded in the photosensitive region of the semiconductor substrate. The radiation sensing member has a material different from a material of the semiconductor substrate, and an interface between the radiation sensing member and the isolation region of the semiconductor substrate includes a direct band gap material. The device layer is under the semiconductor substrate and the radiation sensing member. The color filter layer is over the radiation sensing member and the semiconductor substrate.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsun-Ying Huang, Hsin-Chi Chen
  • Patent number: 11855022
    Abstract: Semiconductor device packages and method are provided. A semiconductor device package according to the present disclosure includes a substrate including a first region, a passive device disposed over the first region of the substrate, a contact pad disposed over the passive device, a passivation layer disposed over the contact pad, a recess through the passivation layer, and an under-bump metallization (UBM) layer. The recess exposes the contact pad and the UBM layer includes an upper portion disposed over the passivation layer and a lower portion disposed over a sidewall of the recess. A projection of the upper portion of the UBM layer along a direction perpendicular to the substrate falls within an area of the contact pad.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen, Yen-Ming Chen
  • Publication number: 20230411220
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a first semiconductor stack and a second semiconductor stack over a substrate, wherein each of the first and second semiconductor stacks includes semiconductor layers stacked up and separated from each other; a dummy spacer between the first and second semiconductor stacks, wherein the dummy spacer contacts a first sidewall of each semiconductor layer of the first and second semiconductor stacks; and a gate structure wrapping a second sidewall, a top surface, and a bottom surface of each semiconductor layer of the first and second semiconductor stacks.
    Type: Application
    Filed: July 24, 2023
    Publication date: December 21, 2023
    Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Cheng Hong Yang, Shih-Hao Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
  • Publication number: 20230409895
    Abstract: A computing system including one or more processing devices configured to generate a training data set. Generating the training data set may include generating training molecular structures, respective training Hamiltonians, and training energy terms. Computing the training energy terms may include, for each of the training Hamiltonians, computing a kinetic energy term, a nuclear potential energy term, an electron repulsion energy term, and an exchange energy term using Hartree-Fock (HF) estimation. Computing the training energy terms may further include, for a first subset of the training Hamiltonians, computing dynamical correlation energy terms using coupled cluster estimation. Computing the training energy terms may further include, for a second subset of the first subset, generating truncated Hamiltonians and computing static correlation energy terms using complete active space (CAS) estimation.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 21, 2023
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Hongbin LIU, Guang Hao LOW, Matthias TROYER, Chi CHEN
  • Patent number: 11846987
    Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: December 19, 2023
    Assignee: Acer Incorporated
    Inventors: Chia-Bo Chen, Yi-Hsuan Yang, Hung-Chi Chen, Wu-Chen Lee
  • Patent number: 11846739
    Abstract: A circuit for sensing an X-ray including a switching element, a storage element, a sensing element and a branching element. The storage element electrically coupled to the switching element. The sensing element electrically coupled to the switching element. The branching element electrically coupled between the storage element and the sensing element.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: December 19, 2023
    Assignee: InnoCare Optoelectronics Corporation
    Inventors: Hsin-Hung Lin, Chin-Chi Chen, Chih-Hao Wu
  • Patent number: 11845896
    Abstract: A structural stabilizer for a fiber and proppant complex to enhance proppant migration and placement in a fractured well during propping and a preparation method thereof are provided. The structural stabilizer consists of: water, inorganic salt, kaolinite, nitrogen-doped modified graphene oxide, anionic surfactant, non-ionic alkyl polyglucoside, and polyacrylamide. The structural stabilizer improves bonding between a proppant and a fiber when slick water is used in stimulated reservoir volume (SRV) fracturing, prevents separation of the fiber and the proppant during migration, thereby reducing escape rate of the fiber from the fiber and proppant complex.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: December 19, 2023
    Assignees: Chengdu LEPS Technology Co., Ltd, Southwest Petroleum University
    Inventors: Jianchun Guo, Shan Ren, Hao Yang, Yingxian Ma, Kun Wang, Jiyu Wang, Cong Lu, Jiapeng Zhang, Zhihong Zhao, Shaobin Zhang, Qianli Lu, Qingsong Guo, Su Diao, Chi Chen, Xin Lei, Mingyuan Zhou, Chaojun Tang
  • Patent number: D1010242
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: January 2, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chia-Ying Tu, I-Chi Chen