Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.

Abstract: A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.

Abstract: A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of devices. A method for forming a device die from a device wafer includes forming a trench in a top surface of the device wafer between two adjacent devices of the device wafer. The trench has a bottom surface located (a) at a first depth beneath the top surface and (b) at a first height above a wafer bottom surface. The method also includes, after forming the trench, decreasing a thickness of the device wafer, between the two adjacent devices, to a thickness less than the first height.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.

Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.

Abstract: An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.

Abstract: A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.

Abstract: A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of devices. A method for forming a device die from a device wafer includes forming a trench in a top surface of the device wafer between two adjacent devices of the device wafer. The trench has a bottom surface located (a) at a first depth beneath the top surface and (b) at a first height above a wafer bottom surface. The method also includes, after forming the trench, decreasing a thickness of the device wafer, between the two adjacent devices, to a thickness less than the first height.

Abstract: An image sensor package with a folded cover-glass sealing interface includes (a) an image sensor with a light-receiving surface, (b) a substrate having (i) a recessed surface to which the image sensor is bonded, (ii) a second surface facing in a direction parallel to optical axis of the image sensor, surrounding the recessed surface, and being further than the light-receiving surface from the recessed surface, and (iii) a third surface facing the optical axis, and adjoining and surrounding the second surface, and (c) a cover glass bonded to the substrate with a folded sealing-interface at the second surface and the third surface.

Abstract: A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract: A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract: A space-efficient PCB-mountable image sensor includes a semiconductor substrate having a top surface and a side surface, a bond pad on the top surface, and a conductive layer formed on the side surface and electrically connected to the bond pad. A camera module includes a PCB and a space-efficient PCB-mountable image sensor. A conductive layer of the PCB-mountable image sensor is electrically connected between the bond pad and a contact pad of the PCB. A method for fabricating a space-efficient PCB-mountable image sensor includes forming a trench next to an image sensor on a first side of an image sensor wafer, the image sensor including a bond pad. The method also includes forming a conductive layer spanning the bond pad and at least part of a side wall of the trench, and singulating the image sensor wafer along the trench.

Abstract: A method for manufacturing one or more curved image sensor systems includes (a) at elevated pressure relative to atmospheric pressure, bonding a light-transmitting substrate to an image sensor wafer having at least one pixel array, to form a composite wafer with a respective hermetically sealed cavity between the light-transmitting substrate and each pixel array, and (b) thinning the image sensor wafer of the composite wafer to induce deformation of the image sensor wafer to form a concavely curved pixel array from each pixel array. A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface and a pixel array located along the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract: A device-embedded image sensor includes an image sensor formed in a first semiconductor substrate; a top conductive pad formed on a top surface of the first semiconductor substrate; and a semiconductor device formed in a second semiconductor substrate bonded to a bottom surface of the first semiconductor substrate, the semiconductor device electrically connected to the top conductive pad. A method for fabricating a device-embedded image sensor from a CMOS image sensor wafer assembly that includes an image sensor and a conductive pad. The method includes exposing the conductive pad; forming an isolation layer; exposing a surface of each conductive pad; forming a patterned redistribution layer (RDL) having a plurality of RDL elements on the isolation layer; electrically isolating adjacent RDL elements; and laminating the CMOS image sensor wafer assembly and a semiconductor device wafer to form undiced device-embedded image sensors.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The solution tank may include an inlet and an outlet. The cleaning device may include at least one discharge line filter in fluid communication with the solution tank and a pump having a pump intake and a pump discharge. The pump may be configured to direct cleaning solution from the solution tank outlet through the at least one discharge line filter. The cleaning device may include a cleaning head in fluid communication with the pump discharge and a bypass line in fluid communication with the pump discharge and the inlet. The bypass line may be configured to divert cleaning solution received from the pump discharge away from the cleaning head and toward the solution tank.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The solution tank may include an inlet and an outlet. The cleaning device may include at least one discharge line filter in fluid communication with the solution tank and a pump having a pump intake and a pump discharge. The pump may be configured to direct cleaning solution from the solution tank outlet through the at least one discharge line filter. The cleaning device may include a cleaning head in fluid communication with the pump discharge and a bypass line in fluid communication with the pump discharge and the inlet. The bypass line may be configured to divert cleaning solution received from the pump discharge away from the cleaning head and toward the solution tank.

Abstract: An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.