Patents by Inventor Chi-Chih Pu

Chi-Chih Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200292157
    Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.
    Type: Application
    Filed: May 29, 2020
    Publication date: September 17, 2020
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Publication number: 20200243737
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200243478
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 27, 2019
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200197719
    Abstract: A light-emitting module includes a housing, a flexible film, and a protection portion. The housing includes a plurality of light-emitting units arranged in a matrix configuration and at least a switch electrically connected to at least one of the plurality of light-emitting units. The flexible film is detachably coupled to the housing. The protection portion covers the plurality of light-emitting units.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 25, 2020
    Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Chang-Hseih WU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 10670244
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 2, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Patent number: 10596388
    Abstract: A light-emitting module includes a carrier, a plurality of light-emitting units, and a protection layer. The carrier has a lighting portion and an extending portion. The plurality of light-emitting units is disposed on the lighting portion. The protection layer covers the plurality of light-emitting units and the lighting portion, and exposes the extending portion.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 24, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Jai-Tai Kuo, Chang-Hseih Wu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 10553563
    Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 4, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Jai-Tai Kuo, Chang-Hsieh Wu, Tzu-Hsiang Wang, Chi-Chih Pu, Ya-Wen Lin, Pei-Yu Li
  • Publication number: 20190371764
    Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Chang-Hsieh WU, Tzu-Hsiang WANG, Chi-Chih PU, Ya-Wen LIN, Pei-Yu LI
  • Publication number: 20190219252
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Patent number: 10340431
    Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: July 2, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
  • Patent number: 10247395
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 2, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Publication number: 20180130933
    Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
  • Publication number: 20180078782
    Abstract: A light-emitting module includes a carrier, a plurality of light-emitting units, and a protection layer. The carrier has a lighting portion and an extending portion. The plurality of light-emitting units is disposed on the lighting portion. The protection layer covers the plurality of light-emitting units and the lighting portion, and exposes the extending portion.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 22, 2018
    Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Chang-Hseih WU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 9876153
    Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: January 23, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
  • Publication number: 20170330868
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180° , and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Application
    Filed: July 28, 2017
    Publication date: November 16, 2017
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Patent number: 9741699
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: August 22, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Publication number: 20160190409
    Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.
    Type: Application
    Filed: December 23, 2015
    Publication date: June 30, 2016
    Inventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
  • Patent number: D770398
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: November 1, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
  • Patent number: D786458
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: May 9, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
  • Patent number: D894851
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: September 1, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Tzu-Hsiang Wang, Chi-Chih Pu, Ya-Wen Lin