Patents by Inventor Chi-Chih Pu

Chi-Chih Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9368483
    Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: June 14, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
  • Publication number: 20160043063
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Application
    Filed: October 19, 2015
    Publication date: February 11, 2016
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Publication number: 20160043292
    Abstract: A light emitting device includes a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection portion includes at least an opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the LED structures. The connection port is adapted to be coupled to other device through the opening. A light emitting module and an illuminating apparatus are also provided.
    Type: Application
    Filed: June 5, 2015
    Publication date: February 11, 2016
    Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
  • Patent number: 9166116
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 20, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Patent number: 9123868
    Abstract: A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: September 1, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Shyi-Ming Pan, Wei-Kang Cheng, Chih-Shu Huang, Chen-Hong Lee, Shih-Yu Yeh, Chi-Chih Pu, Cheng-Kuang Yang, Shih-Chieh Tang, Siang-Fu Hong, Tzu-Hsiang Wang
  • Patent number: 9065022
    Abstract: The present invention relates to a light emitting apparatus comprising at least one light emitting device and a support mechanism. The light emitting device includes a transparent substrate which light can pass through; at least one LED chip emitting light omni-directionally is disposed on one surface of the substrate, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. The support mechanism is coupled to the light emitting device; a first angle is formed between the substrate and the support mechanism. According to the present invention, the light emitting apparatus using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 23, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Patent number: 9029898
    Abstract: The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: May 12, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
  • Publication number: 20140153239
    Abstract: The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
    Type: Application
    Filed: February 6, 2014
    Publication date: June 5, 2014
    Applicant: FORMOSA EPITAXY INCORPORATION
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, TZU-HSIANG WANG, SHENG-HUNG HSU, WEI-KANG CHENG, SHYI-MING PAN
  • Publication number: 20140103369
    Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.
    Type: Application
    Filed: November 25, 2013
    Publication date: April 17, 2014
    Applicant: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Sheng-Hung Hsu, Wei-Kang Cheng, Shyi-Ming Pan
  • Publication number: 20130322081
    Abstract: A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 5, 2013
    Inventors: Shyi-Ming Pan, Wei-Kang Cheng, Chih-Shu Huang, Chen-Hong Lee, Shih-Yu Yeh, Chi-Chih Pu, Cheng-Kuang Yang, Shih-Chieh Tang, Siang-Fu Hong, Tzu-Hsiang Wang
  • Patent number: D731087
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: June 2, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Li-Kai Lu, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: D731088
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: June 2, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Wei-Kang Cheng, Chen-Hong Lee, Chi-Chih Pu, Shih-Chieh Tang, Shyi-Ming Pan
  • Patent number: D731089
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: June 2, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Wei-Kang Cheng, Chen-Hong Lee, Chi-Chih Pu, Shih-Chieh Tang, Shyi-Ming Pan
  • Patent number: D731090
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: June 2, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chen-Hong Lee, Chi-Chih Pu, Lung-Kuan Lai, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: D731091
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: June 2, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Wei-Kang Cheng, Chen-Hong Lee, Chi-Chih Pu, Shih-Chieh Tang, Shyi-Ming Pan
  • Patent number: D731680
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: June 9, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Li-Kai Lu, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: D731681
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: June 9, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Tzu-Hsiang Wang, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: D745194
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: December 8, 2015
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Chen-Hong Lee, Chi-Chih Pu, Lung-Kuan Lai, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: D753321
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: April 5, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee
  • Patent number: D759854
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: June 21, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Tzu-Hsiang Wang, Chi-Chih Pu, Chen-Hong Lee