Patents by Inventor Chi-Feng Tung

Chi-Feng Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942342
    Abstract: A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Fu-Hsien Li, Chi-Feng Tung, Hsiang Yin Shen
  • Publication number: 20240087934
    Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: YONG-JYU LIN, FU-HSIEN LI, CHEN-WEI LU, CHI-FENG TUNG, HSIANG YIN SHEN
  • Publication number: 20240071799
    Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: CHUAN WEI LIN, FU-HSIEN LI, YONG-JYU LIN, RONG-SHEN CHEN, CHI-FENG TUNG, HSIANG YIN SHEN
  • Publication number: 20240071797
    Abstract: An apparatus in an overhead transport system is provided. The apparatus includes a hanger feature configured to be hung from a ceiling, a plate-like structure having a top surface and a bottom surface, the bottom surface being rotatably coupled to the hanger feature, and at least one pair of rail members mechanically coupled to the bottom surface of the plate-like structure by way of a plurality of yoke members.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Guancyun Li, Ching-Jung Chang, Chi-Feng Tung
  • Publication number: 20240021456
    Abstract: System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.
    Type: Application
    Filed: March 31, 2023
    Publication date: January 18, 2024
    Inventors: Chieh Hsu, Guancyun Li, Ching-Jung Chang, Chi-Feng Tung
  • Patent number: 11854849
    Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yong-Jyu Lin, Fu-Hsien Li, Chen-Wei Lu, Chi-Feng Tung, Hsiang Yin Shen
  • Patent number: 11854846
    Abstract: A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Fu-Hsien Li, Sheng-Kang Yu, Chi-Feng Tung, Hsiang Yin Shen, Guancyun Li
  • Patent number: 11848222
    Abstract: A system for a semiconductor fabrication facility (FAB) includes an orientation tool and a transporting tool configured to transport at least one customized part. The orientation tool includes a port configured to receive the workpiece, a sensor configured to detect an orientation of the workpiece received in the port and a rotation mechanism configured to turn the workpiece received in the port.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: December 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuan Wei Lin, Fu-Hsien Li, Yong-Jyu Lin, Rong-Shen Chen, Chi-Feng Tung, Hsiang Yin Shen
  • Publication number: 20230395415
    Abstract: System and method for cross-fab wafer transportation are provided. An exemplary system includes a first control unit coupled to an associated first automatic material handling system (AMHS), the first AMHS includes a first overhead transport (OHT) track comprising a first portion and a first vehicle movable along the first OHT track and carrying a container, the container is operable to carry semiconductor wafers therein. The system includes a second control unit coupled to an associated second AMHS, the second AMHS includes a second OHT track comprising a second portion adjacent to the first portion and a second vehicle movable along the second OHT track. When the first vehicle is within the first portion of the first OHT track and the second vehicle is within the second portion of the second OHT track, the first and second vehicles are operable to transfer the container directly from the first vehicle to the second vehicle.
    Type: Application
    Filed: June 4, 2022
    Publication date: December 7, 2023
    Inventors: Chieh Hsu, Guancyun Li, Ching-Jung Chang, Chi-Feng Tung
  • Publication number: 20230343621
    Abstract: The present disclosure is directed to a stocker utilizing one or more storage carriers to optimize the utilization of a storage compartment within the stocker. The stocker includes one or more storage towers each including one or more shelves that may be moved from a closed position to an opened position by being pulled outward by a hook of a forking structure. This forking structure is configured to lift up a corresponding storage carrier off the shelf to be transported to a storage carrier load port to position one or more workpieces or toolpieces within the storage carrier, which is then transported back to the corresponding shelf for storage. The utilization of the forking structure along with the pull out shelves allows for a large number of storage carriers to be stored within the storage compartment of the stocker.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Rong Syuan FAN, Ching-Jung CHANG, Chi-Feng TUNG, Hsiang Yin SHEN
  • Publication number: 20230341787
    Abstract: A method includes: storing a carrier containing material in a storage; recording environmental data of the storage to a database while the material is in the storage; generating a forecast for the material in the carrier based on the environmental data; receiving a request for the material from a semiconductor fabrication tool; and providing the carrier to the semiconductor fabrication tool based on the forecast.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Rong-Syuan FAN, Chi-Feng TUNG, Ching-Jung CHANG, Hsiang-Yin SHEN
  • Publication number: 20230335422
    Abstract: A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.
    Type: Application
    Filed: June 26, 2023
    Publication date: October 19, 2023
    Inventors: Guancyun LI, Ching-Jung CHANG, Chi-Feng TUNG, Hsiang Yin SHEN
  • Patent number: 11749548
    Abstract: A transport system, including: a sensor, a controller and a power panel. The sensor determines a zone and sends a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to output a current in accordance with the output signal for driving vehicles in the zone, wherein the current is outputted to a cable extending through the zone.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Fu-Hsien Li, Chi-Feng Tung, Hsiang Yin Shen
  • Publication number: 20230268212
    Abstract: Some implementations described herein provide a method that includes loading, from a load port and into a first buffer of a multiple-buffer overhead hoist transport (OHT) vehicle, a first transport carrier storing one or more processed wafers. The method includes unloading to the load port, while the first buffer retains the first transport carrier, and from a second buffer of the multiple-buffer OHT vehicle, a second transport carrier storing one or more wafers for processing. In other implementations, the method includes loading, into a first buffer of the multiple-buffer OHT vehicle, a first transport carrier storing one or more wafers for processing, while a semiconductor processing tool, associated with a load port, is processing one or more wafers associated with a second transport carrier. The method includes positioning the multiple-buffer OHT vehicle above the load port while the multiple-buffer OHT vehicle retains the first transport carrier in the first buffer.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 24, 2023
    Inventors: Chuan Wei LIN, Fu-Hsien LI, Chi-Feng TUNG, Hsiang Yin SHEN
  • Patent number: 11735451
    Abstract: A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: August 22, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Guancyun Li, Ching-Jung Chang, Chi-Feng Tung, Hsiang Yin Shen
  • Patent number: 11720033
    Abstract: A method includes: storing a carrier containing material in a storage; recording environmental data of the storage to a database while the material is in the storage; generating a forecast for the material in the carrier based on the environmental data; receiving a request for the material from a semiconductor fabrication tool; and providing the carrier to the semiconductor fabrication tool based on the forecast.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: August 8, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Rong-Syuan Fan, Ching-Jung Chang, Chi-Feng Tung, Hsiang-Yin Shen
  • Patent number: 11676841
    Abstract: Some implementations described herein provide a method that includes loading, from a load port and into a first buffer of a multiple-buffer overhead hoist transport (OHT) vehicle, a first transport carrier storing one or more processed wafers. The method includes unloading to the load port, while the first buffer retains the first transport carrier, and from a second buffer of the multiple-buffer OHT vehicle, a second transport carrier storing one or more wafers for processing. In other implementations, the method includes loading, into a first buffer of the multiple-buffer OHT vehicle, a first transport carrier storing one or more wafers for processing, while a semiconductor processing tool, associated with a load port, is processing one or more wafers associated with a second transport carrier. The method includes positioning the multiple-buffer OHT vehicle above the load port while the multiple-buffer OHT vehicle retains the first transport carrier in the first buffer.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: June 13, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuan Wei Lin, Fu-Hsien Li, Chi-Feng Tung, Hsiang Yin Shen
  • Patent number: 11605553
    Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: March 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
  • Publication number: 20230066297
    Abstract: An EUV stocker and an EUV pod device is disclosed. The EUV stocker includes an AI driven dynamic control circuitry, an AI controlled safety interlock, and an independent air return control device. The EUV stocker includes a Mass Flow Control (MFC) that operates in conjunction with one or more valves. The EUV stocker further includes a hydrocarbon detecting assembly, oxygen detecting assembly, pressure detecting assembly, and temperature detecting assembly and more to maintain the required condition within the EUV stocker. The EUV stocker also includes automated transportation devices such as AMHS, OHT, MR, AGV, RGV, or the like to provide a safe EUV mask storage environment for operators.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Guancyun LI, Ching-Jung CHANG, Chi-Feng TUNG, Hsiang-Yin SHEN
  • Publication number: 20220406638
    Abstract: An automated material handling system (AMHS) and a method of operating the AMHS are disclosed. In one aspect, the AMHS includes a network of rails and a vehicle configured to hold a sample carrier that stores one or more samples, wherein the vehicle is configured to move within the FAB via the network of rails. The AMHS also includes a turn table connected to the network of rails and configured to rotate about an axis substantially perpendicular to a surface of the turn table. The AMHS further includes a hash rail connected to and overlapping the turn table. The hash rail is configured to rotate about the axis with the turn table.
    Type: Application
    Filed: January 27, 2022
    Publication date: December 22, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Guancyun Li, Ching-Jung Chang, Chi-Feng Tung, Hsiang Yin Shen