Abstract: A crucible lifting device includes a vacuum chamber, a vacuum chamber lower seat and a crucible lifting assembly. The vacuum chamber lower seat is arranged orthogonally at the bottom of the vacuum chamber, the vacuum chamber lower seat including a plurality of coupling parts arranged orthogonally at the vacuum chamber lower seat and on a side away from the vacuum chamber. The crucible lifting assembly is arranged on the vacuum chamber lower seat and on the side away from the vacuum chamber. The crucible lifting assembly includes a plurality of multi-rotation angle guides, one end of each multi-rotation angle guide connected to each coupling part; a plurality of guide rods, one end of each guide rod connected to the other end of each multi-rotation angle guide; and a plurality of guide rod accommodating parts, each guide rod accommodating part configured to correspond to each guide rod.

Abstract: A wafer processing system (1) is provided. The system (1) includes a processing tool (10) comprising at least one grinding member (16) used to remove material from a wafer substrate (80). The system (1) also includes an electrolyte supply line (361) used to supply an electrolyte to the wafer substrate (80). The system (1) further includes a holding module (20) for holding the wafer substrate (80). The holding module (20) includes a conductive base (21) and a conductive porous member (22) positioned on the top surface of the conductive base (21). A vacuum source (53) fluidly communicated with fluid channel (214) formed in the conductive base (21) to create a vacuum to hold the wafer substrate (80) on the conductive porous member (22).

Abstract: A work piece processing system includes a grinding wheel (12) configured to remove material from a work piece in a grinding process. The grinding wheel (12) includes a conductive layer (122) surrounding a rotation axis of the grinding wheel (12) and a number of grinding members (123) positioned at an outer surface of the conductive layer (122). The system also includes a holding module (20) and an electrolyte supply line (365). In addition, the system includes an actuator assembly (30) for driving a rotation of the grinding wheel (12) and a rotation of the holding module (20), and a power supply module (45) to apply current to the conductive layer (122) and the holding module (20). The work piece processing system uses electrochemical removal to reduce grinding damage and improve machining efficiency. A work piece processing method is also provided.

Abstract: A display apparatus and a display holding device thereof are provided. The display holding device includes a front frame and a rear plate. The front frame includes an edge portion, a top portion, a containing portion, an extending portion, and a holding portion. The top portion is connected to the edge portion. An end of the containing portion is connected to the edge portion, and the containing portion is adapted to contain an optical transceiver module. The extending portion adapted to contain a panel module is connected to an another end of the containing portion and extends toward a direction away from the edge portion. The holding portion adapted to contain a light-transmissive element is between the containing portion and the extending portion. The rear plate adapted to contain an optical film module is connected to the front frame. Therefore, a width of the front frame can be further reduced.

Abstract: Provided are semiconductor devices and methods for fabricating such devices. An exemplary method includes forming a fin structure over a semiconductor material; forming a sacrificial layer over the semiconductor material; removing a portion of the fin structure and an overlying portion of the sacrificial layer located over the portion of the fin structure to form a trench; forming an insulation structure in the trench, wherein an adjacent portion of the sacrificial layer is adjacent an end wall of the insulation structure; removing the adjacent portion to form a cavity partially defined by the end wall; lining the cavity with a liner, wherein an end portion of the liner is located on the end wall of the insulation structure; filling the cavity with a fill material; removing the end portion of the liner to form an opening; and forming an end isolation structure in the opening.

Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

Abstract: An image displacement device includes a first grating and a second grating. The first grating has a first surface and a second surface opposite the first surface, the first surface receives image beams, and the image beams leave the first grating by the second surface. The second grating is disposed downstream from the first grating in a light path and has a third surface and a fourth surface opposite the third surface. The third surface receives the image beams, and the image beams leave the second grating by the fourth surface. The image beams are projected to form a plane image comprised of pixels, each pixel is displaced in a direction by the image displacement device, and a displacement of each pixel is smaller than five times a width of one pixel.

Abstract: A method includes forming a first conductive feature over a first semiconductor structure; forming a first dielectric layer over the first conductive feature and the first semiconductor structure; removing a portion of the first dielectric layer to expose a top surface of the first conductive feature; forming a second conductive feature over a second semiconductor structure, wherein the first and second conductive features comprise nanotwinned copper; forming a second dielectric layer over the second conductive feature and the second semiconductor structure, wherein the second dielectric layer comprises a same material as the first dielectric layer; removing a portion of the second dielectric layer to expose a top surface of the second conductive feature; and performing a hybrid bonding process to bond the first dielectric layer to the second dielectric layer and bond the first conductive feature to the second conductive feature.

Abstract: A redistribution structure is made using filler-free insulating materials with a high shrinkage rate. As a result, good planarity may be achieved without the need to perform a planarization of each insulating layer of the redistribution structure, thereby simplifying the formation of the redistribution structure.

Abstract: A circulating current suppression method of a power system having a plurality of power modules is provided. Each power module includes a high-voltage bus, a low-voltage bus and a balance circuit having a neutral voltage. The circulating current suppression method includes: in each balance circuit, disposing a first capacitor electrically coupled between the high-voltage bus and the neutral voltage, and disposing a second capacitor electrically coupled between the neutral voltage and the low-voltage bus; acquiring a current effective value of an input of each power module; if detecting that the current effective value of at least one power module doesn't remain at a current reference value, determining that a circulating current occurs in the at least one power module; and operating the balance circuit of the at least one power module to charge the first capacitor or the second capacitor to regulate the neutral voltage for suppressing the circulating current.

Abstract: A technique for performing ray tracing operations is provided. The technique includes traversing a bounding volume hierarchy for a ray to arrive at a bounding box without use of a neural network; perform a feature vector lookup using modified polar coordinates characterizing the ray relative to the bounding box to obtain a set of feature vectors; and obtaining output with the neural network using the set of feature vectors.

Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.

Abstract: A wavelength conversion element includes a rotatable disc, a first spoiler structure and a second spoiler structure. The rotatable disc has a supporting surface and a back surface opposite to the supporting surface. The first spoiler structure is disposed on the supporting surface and arranged along a first track surrounding a center of the rotatable disc. The second spoiler structure is disposed on the back surface and arranged along a second track surrounding the center. A centroid of at least one of the first spoiler structure and the second spoiler structure is deviated from the center. A projection device adopting the aforementioned wavelength conversion element is also provided. The wavelength conversion element of the invention can reduce the initial unbalance and the projection device of the invention can improve the durability.

Abstract: A refrigerant system including a compressor, an oil separator, an oil solenoid valve, a condenser, an evaporator, a bypass pipe, and a bypass solenoid valve is disclosed. The oil separator is connected to an output end of the compressor. The oil solenoid valve is disposed between the oil cooler and the compressor. The condenser is connected to the oil separator. The evaporator is connected to the condenser. The bypass pipe has a first end and a second end opposite to the first end. The first end is connected between the oil separator and the condenser, and the second end is connected between the evaporator and an input end of the compressor. The bypass solenoid valve is disposed on the bypass pipe. A controlling method for the refrigerant system is also disclosed.

Abstract: A clock control method for a High Definition Multimedia Interface (HDMI) receiver operating in a power-saving mode in a sink device is provided. The HDMI receiver has a first module, a second module, and a third module. The clock control method includes the following stages. A clock signal is enabled to be sent to the first module and the third module during a first region of received data. The clock signal is disabled to be sent to the second module during the first region of the received data. The clock signal is enabled to be sent to the third module and the clock signal is disabled to be sent to the first module and the second module during a second region of the received data.

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive portion, and a second adhesive portion. The first semiconductor device and the second semiconductor device are separately arranged on the carrier. The first adhesive portion and the second adhesive portion are separately arranged on the carrier, the first adhesive portion is located between the first semiconductor device and the carrier, and the second adhesive portion is located between the second semiconductor device and the carrier. In the cross-sectional view, the first adhesive portion includes an inclined sidewall, and the inclined sidewall is adjacent to the carrier and forms an interior angle greater than 90 degrees to the carrier.

Abstract: A pixel structure includes a first light-emitting diode for emitting a first light, wherein the first light-emitting diode has a first semiconductor layer, a first light-emitting surface, and a first electrode under the first semiconductor layer away from the first light-emitting surface; a second light-emitting diode for emitting a second light, wherein the second light-emitting diode has a second semiconductor layer, a second light-emitting surface, and a second electrode under the second semiconductor layer away from the second light-emitting surface; a dielectric layer surrounding and contacting the first semiconductor layer and the second light-emitting diode and exposing the first light-emitting surface, the first electrode, the second light-emitting surface and the second electrode; a common conductive structure having a semiconductor layer and a metal layer; and a light-transmitting conductive layer covering and electrical connecting the first light-emitting diode, the second light-emitting diode and

Abstract: A semiconductor fabrication facility is provided. The semiconductor fabrication facility includes a processing tool and a transmission assembly. The transmission assembly is connected to the processing tool and comprises a number of transmission lines used to supply electric power or a fluid to the processing tool or remove the fluid or an exhaust gas from the processing tool. The transmission lines includes a first transmission line and a second transmission line. The first transmission line has a first temperature and the second transmission line has a second temperature. The second temperature is higher than the first temperature. The first transmission line and the second transmission line are arranged such that a thermal energy of the second transmission line is able to be transmitted to the first transmission line to change the first temperature of the first transmission line.

Abstract: An audio capture method includes: determining one or more regions of interest (ROIs) pertaining to an image sequence or a video stream; determining position information of the one or more ROIs; converting the position information of the one or more ROIs into direction information of the one or more ROIs; and performing a beamforming processing on a plurality of microphone signals to generate an audio capture signal based on direction information of the one or more ROIs and direction information of one or more sound sources that are captured in the plurality of microphone signals.

Abstract: A semiconductor structure includes a substrate, a through via penetrating the substrate, a trench capacitor, a first RDL, a second RDL, a contact feature, and a chip. The trench capacitor extends from a back surface toward a front surface of the substrate, wherein the trench capacitor is separated from an active area at the front surface of the substrate. The first RDL is disposed over the front surface and electrically connecting to the through via. The second RDL is disposed over the back surface of the substrate and electrically connecting to the through via and the trench capacitor. The contact feature is disposed over the second RDL and electrically connecting to the trench capacitor through the second RDL. The chip is bonded over the front surface of the substrate. A method of manufacturing the semiconductor structure is also provided.