Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.

Abstract: A method includes encapsulating a device die in an encapsulating material, forming a first dielectric layer over the device die and the encapsulating material, forming first redistribution lines extending into the first dielectric layer to electrically couple to the device die, forming an alignment mark over the first dielectric layer, wherein the alignment mark includes a plurality of elongated strips, forming a second dielectric layer over the first redistribution lines and the alignment mark, and forming second redistribution lines extending into the second dielectric layer to electrically couple to the first redistribution lines. The second redistribution lines are formed using the alignment mark for alignment.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.

Abstract: An optical detection device includes a first linear light source, a second linear light source, an optical sensor array and a processor. The first linear light source is adapted to project a first long strip illumination beam onto the target container. The second linear light source is adapted to project a second long strip illumination beam onto the target container, and the second long strip illumination beam is crossed with the first long strip illumination beam. The optical sensor array is adapted to receive a first long strip detection beam and a second long strip detection beam reflected from the target container. The processor is electrically connected to the optical sensor array. The processor is adapted to analyze intensity distribution of the first long strip detection beam and the second long strip detection beam to acquire a relative distance between the optical sensor array and the target container.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.

Abstract: Exemplary methods of semiconductor processing may include forming a layer of silicon-containing material on a semiconductor substrate. The methods may include performing a post-formation treatment on the layer of silicon-containing material to yield a treated layer of silicon-containing material. The methods may include contacting the treated layer of silicon-containing material with an adhesion agent. The methods may include forming a layer of a resist material on the treated layer of silicon-containing material.

Abstract: A system and method for image-guided microscopic illumination are provided. A processing module controls an imaging assembly such that a camera acquires an image or images of a sample in multiple fields of view, and the image or images are automatically transmitted to a processing module and processed by the first processing module automatically in real-time based on a predefined criterion so as to determine coordinate information of an interested region in each field of view. The processing module also controls an illuminating assembly to illuminate the interested region of the sample according to the received coordinate information regarding to the interested region, with the illumination patterns changing among the fields of view.

Abstract: A system and method for image-guided microscopic illumination are provided. A processing module controls an imaging assembly such that a camera acquires an image or images of a sample in multiple fields of view, and the image or images are automatically transmitted to a processing module and processed by the first processing module automatically in real-time based on a predefined criterion so as to determine coordinate information of an interested region in each field of view. The processing module also controls an illuminating assembly to illuminate the interested region of the sample according to the received coordinate information regarding to the interested region, with the illumination patterns changing among the fields of view.

Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.

Abstract: Compositions including photoreactive and cleavable probes and methods of using the probes. The probes may include a tag conjugatable to a label, a cleavable linker linkable to a bait molecule, and a light activated warhead. The compositions and methods may be useful for analyzing biomolecules.

Abstract: The present invention provides a drum snare including a fixed seat, an actuation column, an actuation handle, a pull-down seat, an adjustment bolt, and a packing assembly. The actuation handle passes through a lateral hole to connect and fix to the actuation column. The lateral hole includes two snap-in slots pressing against the actuation handle. The pull-down seat includes a clamping seat and a non-circular rod body passing through the fixed seat in a non-rotation manner. The non-circular rod body includes an internal thread hole. The adjustment bolt is rotatably fixed on the actuation column. The adjustment bolt includes a thread section penetrating in the internal thread hole. The packing assembly is provided between the adjustment bolt and the actuation column. Therefore, a friction force between the adjustment bolt and the actuation column is increased through the packing assembly, and looseness of the adjustment bolt can be avoided.

Abstract: A clamping seat includes a pipe seat, a movable clamp and a fixed clamp. The pipe seat includes an inner pipe space and an outer pipe space to insert the inner pipe and the outer pipe. The pipe seat includes a side opening beside the inner pipe space and a side space beside the outer pipe space. The movable clamp includes an arc block beside the side opening, and a screwing member pressing the arc block into the inner pipe space then to press and fix the inner pipe. The fixed clamp includes a clamping plate in the side space, and a tightening bolt pressing the pipe seat against the clamping plate, allowing the clamping plate to press the outer pipe.

Abstract: The present invention provides a drum snare including a fixed seat, an actuation column, an actuation handle, a pull-down seat, an adjustment bolt, and a packing assembly. The actuation handle passes through a lateral hole to connect and fix to the actuation column. The lateral hole includes two snap-in slots pressing against the actuation handle. The pull-down seat includes a clamping seat and a non-circular rod body passing through the fixed seat in a non-rotation manner. The non-circular rod body includes an internal thread hole. The adjustment bolt is rotatably fixed on the actuation column. The adjustment bolt includes a thread section penetrating in the internal thread hole. The packing assembly is provided between the adjustment bolt and the actuation column. Therefore, a friction force between the adjustment bolt and the actuation column is increased through the packing assembly, and looseness of the adjustment bolt can be avoided.

Abstract: An assembling structure for a rod to be fixed or detached with a stand is provided, which includes an upper clamp element, a lower clamp element, and a bushing. The upper clamp element and the lower clamp element include an upper clamping space and a lower clamping space respectively. The shapes thereof correspond to the rod to tightly clamp the rod onto the stand. The lower clamp element includes a positioning structure that holds up the stand. The bushing is located between the upper clamp element and the stand body, so that the rod can be quickly pulled out from the upper and lower clamping space with less friction after the upper clamp element and the lower clamp element are loosened. When re-inserted, the rod is positioned through being held up by the positioning structure to meet the usage needs of fast withdrawal or positioning the rod.

Abstract: The present invention relates to compositions and methods for selectively etching silicon nitride in the presence of silicon oxide, polysilicon and/or metal silicides at a high etch rate and with high selectivity. Additives are described that can be used at various dissolved silica loading windows to provide and maintain the high selective etch rate and selectivity.

Abstract: An assembling structure for a rod to be fixed or detached with a stand is provided, which includes an upper clamp element, a lower clamp element, and a bushing. The upper clamp element and the lower clamp element include an upper clamping space and a lower clamping space respectively. The shapes thereof correspond to the rod to tightly clamp the rod onto the stand. The lower clamp element includes a positioning structure that holds up the stand. The bushing is located between the upper clamp element and the stand body, so that the rod can be quickly pulled out from the upper and lower clamping space with less friction after the upper clamp element and the lower clamp element are loosened. When re-inserted, the rod is positioned through being held up by the positioning structure to meet the usage needs of fast withdrawal or positioning the rod.

Abstract: Provided herein are methods for treating or ameliorating malignant diseases, such as cancers. Also provided herein are methods of increasing the immunity of an immune cell toward malignant cells.

Abstract: A positioning structure for tripod stand for quickly releasing a clamping state, comprising a main tube, upper, middle and lower binding sleeves and three support rods. The binding sleeves are sleeved on the main tube to rotate freely. The middle binding sleeve comprises a sliding slot provided with an upper clamping column, a lower clamping column and a spring. The upper and lower clamping columns are connected with upper and lower pressing keys protruding out of the middle binding sleeve. When the pressing keys are pressed, the spring is compressed and the clamping columns no longer protrude from the upper and lower sides of the middle binding sleeve. The clamping state can be released and the support rods of the binding sleeves can be freely rotated by pressing the binding keys, so that the three support rods can be rotated to a storage position or an unfolding position.