Patents by Inventor Chi-Ming Huang

Chi-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170186525
    Abstract: An inductor, a magnetic material composition used for the inductor, and a manufacturing method of an electronic component. The magnetic material composition used for the inductor includes 100 weight parts of a magnetic metal powder and 0.05-1 weight part of an inorganic ceramic powder. The magnetic metal powder includes 94.5 wt % or higher of iron, and the inorganic ceramic powder includes aluminum oxide.
    Type: Application
    Filed: July 10, 2016
    Publication date: June 29, 2017
    Applicants: DARFON ELECTRONICS (SUZHOU) CO., LTD., Darfon Electronics Corp.
    Inventors: Yung-Ping Wu, Ran-Rong Lee, Chi-Ming Huang, Chao-Kuang Hsiao, Bai-Yang Wang
  • Patent number: 9455705
    Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: September 27, 2016
    Assignee: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
  • Patent number: 9373505
    Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: June 21, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: En-Chiuan Liou, Yu-Ying Huang, Jen-Hsiu Li, Mei-Chen Chen, Ya-Ling Chen, Yi-Jing Wang, Chi-Ming Huang
  • Patent number: 9231158
    Abstract: A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: January 5, 2016
    Assignee: Epistar Corporation
    Inventors: Cheng-Ta Kuo, Kuo-Hui Yu, Chao-Hsing Chen, Tsun-Kai Ko, Chi-Ming Huang, Shih-Wei Yen, Chien-Kai Chung
  • Publication number: 20150294058
    Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.
    Type: Application
    Filed: May 15, 2014
    Publication date: October 15, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: En-Chiuan Liou, Yu-Ying Huang, Jen-Hsiu Li, Mei-Chen Chen, Ya-Ling Chen, Yi-Jing Wang, Chi-Ming Huang
  • Publication number: 20140332361
    Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 13, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
  • Publication number: 20140327635
    Abstract: A touch electronic device is provided. The touch electronic device includes a main touch region, a decoration region, an assistant touch region, and a sensing module. The decoration region is disposed at or on at least one side of the main touch region. The assistant touch region is in the decoration region, and has at least one hot key, and the at least one hot key is configured to execute a preset function. The sensing module is configured to activate or deactivate the preset function of the at least one hot key.
    Type: Application
    Filed: May 2, 2014
    Publication date: November 6, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Ming-Chuan Lin, Hsueh-Chih Wu
  • Patent number: 8691629
    Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: April 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Tsung-Ding Wang
  • Publication number: 20120302008
    Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.
    Type: Application
    Filed: May 27, 2011
    Publication date: November 29, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Tsung-Ding Wang
  • Patent number: 8290213
    Abstract: While locating a license plate of a moving vehicle on consecutive images, motion detection is first performed on the consecutive images to detect a moving vehicle image, which is segmented using edge detection, and the segmented moving vehicle image is analyzed to retrieve characteristics for locating a license plate image and determining characters on the located license plate image. As a result, a precise location of the license plate is thus precisely located for further recognition no matter what weathers in which the consecutive images are recorded. The above-mentioned technique requires merely few calculations, is easily implemented, and may be applied on an intelligent digital video recording (DVR) system including many computer-vision functions.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: October 16, 2012
    Assignee: Huper Laboratories Co., Ltd.
    Inventors: Chao-Ho Chen, Chi-Ming Huang, Hui-Pin Huang
  • Publication number: 20110312113
    Abstract: A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
    Type: Application
    Filed: August 31, 2011
    Publication date: December 22, 2011
    Applicant: EPISTAR CORPORATION
    Inventors: Cheng-Ta Kuo, Kuo-Hui Yu, Chao-Hsing Chen, Tsun-Kai Ko, Chi-Ming Huang, Shih-Wei Yen, Chien-Kai Chung
  • Publication number: 20110135156
    Abstract: While locating a license plate of a moving vehicle on consecutive images, motion detection is first performed on the consecutive images to detect a moving vehicle image, which is segmented using edge detection, and the segmented moving vehicle image is analyzed to retrieve characteristics for locating a license plate image and determining characters on the located license plate image. As a result, a precise location of the license plate is thus precisely located for further recognition no matter what weathers in which the consecutive images are recorded. The above-mentioned technique requires merely few calculations, is easily implemented, and may be applied on an intelligent digital video recording (DVR) system including many computer-vision functions.
    Type: Application
    Filed: June 4, 2010
    Publication date: June 9, 2011
    Inventors: Chao-Ho Chen, Chi-Ming Huang, Hui-Pin Huang
  • Patent number: 7931356
    Abstract: A nozzle plate suited for a droplet generator is provided. The nozzle plate includes a nozzle layer and at least one filler. The nozzle layer has a nozzle and at least one trench. The nozzle passes through the nozzle layer. The trenches apart from the nozzle are formed on a surface of the nozzle layer around the nozzle. The filler is filled in the trench. The wetting angle of the surface of the filler is different from the wetting angle of the surface of the nozzle layer. The nozzle plate has higher surface wear resistance and lower probability of jamming at the nozzle.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: April 26, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Fu Lu, Chun-Jung Chen, Jinn-Cherng Yang, Chi-Ming Huang, Hung-Liang Chiang
  • Patent number: 7914123
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: March 29, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Patent number: 7882889
    Abstract: A loop type heat dissipating apparatus with a sprayer for transferring heat between a heat source and a heat sink includes an evaporator, a condenser, and a working fluid. The evaporator contacts the heat source and includes a first chamber, a second chamber, and a sprayer disposed between therebetween. The condenser contacts the heat sink and includes a third chamber communicating with the second chamber and a wick structure disposed on one side of the third chamber. The working fluid fills the loop type heat dissipating apparatus and is turned into microdroplets via a sprayer. The sprayer impinges the microdroplets into the second chamber where the microdroplets are then evaporated by the heat source before proceeding to the third chamber for condensation, liquefaction and adhering to the wick structure. Eventually, the working fluid flows back to the first chamber under a pumping force actuated by the sprayer and completes the cycle.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: February 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Kuo Wu, Kuo-Hsiang Chien, Jinn-Cherng Yang, Chi-Ming Huang
  • Patent number: 7735747
    Abstract: A micro-spray system resonance frequency modulation method and device designed to minimize resonance frequency drift during atomization involves using a resonance frequency modulation unit for modulating resonance frequency and nodes, controlling and calibrating resonance frequency, and performing real-time measurement and correction to prevent operating frequency from drifting beyond a preferred operating frequency range, with a view to increasing spray flow and spray area, minimizing effects of ambient factors, and overcoming drawbacks of prior art.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: June 15, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Fu Chou, Chi-Ming Huang, En-Wei Chang, Hung-Liang Chiang
  • Patent number: 7635094
    Abstract: A micro-spray system resonance frequency modulation method and device designed to minimize resonance frequency drift during atomization involves using a resonance frequency modulation unit for modulating resonance frequency and nodes, controlling and calibrating resonance frequency, and performing real-time measurement and correction to prevent operating frequency from drifting beyond a preferred operating frequency range, with a view to increasing spray flow and spray area, minimizing effects of ambient factors, and overcoming drawbacks of prior art.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 22, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Fu Chou, Chi-Ming Huang, En-Wei Chang, Hung-Liang Chiang
  • Publication number: 20090273648
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Application
    Filed: July 9, 2009
    Publication date: November 5, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Patent number: 7600859
    Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: October 13, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ming Huang, Je-Ping Hu, Jian-Chiun Liou, Chia-Tai Chen, Fa-Yuan Hsu
  • Publication number: 20090206172
    Abstract: A micro-spray system resonance frequency modulation method and device designed to minimize resonance frequency drift during atomization involves using a resonance frequency modulation unit for modulating resonance frequency and nodes, controlling and calibrating resonance frequency, and performing real-time measurement and correction to prevent operating frequency from drifting beyond a preferred operating frequency range, with a view to increasing spray flow and spray area, minimizing effects of ambient factors, and overcoming drawbacks of prior art.
    Type: Application
    Filed: April 17, 2009
    Publication date: August 20, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Fu Chou, Chi-Ming Huang, En-Wei Chang, Hung-Liang Chiang