Abstract: An interconnect and a method of forming an interconnect for a semiconductor device is provided. The interconnect is formed by treating an upper surface of a dielectric layer to create a high density layer. The treatment may include, for example, creating a high density monolayer using hexamethyldisilazane (HMDS), trimethylsilydiethylamine (TMSDEA) or trimethylsilylacetate (OTMSA). After treating, the dielectric layer may be patterned to create openings, which are subsequently filled with a conductive material. Excess conductive material may be removed using, for example, a chemical mechanical polishing.

Abstract: A lottery ticket machine including a chute for guiding a series of lottery tickets, two rollers for conveying the series of lottery tickets, a handle operable for moving the rollers from each other, and a security unit movable between a locking position for avoiding movement of the rollers from each other and a releasing position for allowing the rollers to move from each other. The handle is operable to move the security unit between the locking position and the releasing position.

Abstract: A semiconductor substructure with improved performance and a method of forming the same is described. The method includes providing a semiconductor dielectric layer having a recess formed therein; forming an interconnect structure with a metal liner and a conductive fill within the recess; and applying an electron beam treatment to the substructure.

Abstract: In a semiconductor wafer manufacturing apparatus, a rotation module is provided to hold the semiconductor wafer at a plane. The semiconductor wafer is revolved by the rotation module around a first axis. The first axis is substantially perpendicular to the plane. A cleaning module is configured to revolve around a second axis when the cleaning module contacts the surface of the semiconductor wafer. A mechanism is further provided to enable the rotation module and/or the cleaning module to move along a direction substantially perpendicular to the first axis. Consequently, the relative velocities at the contact points between the semiconductor wafer and the cleaning module are changed. Moreover, no relative velocity at any contact point between the semiconductor wafer and the cleaning module is zero or close to zero.

Abstract: A boxing game machine includes a punch bag, a frame, a rocker, a catch, a latch and a spring. The rocker is pivotally connected to the frame between an idle position and an active position. The punch bag is secured to an end of the rocker. The catch is secured to another end of the cocker and formed with a radial edge. The latch is movably supported on the frame and formed with an edge for sliding into contact with radial edge of the catch so that the latch engages with the catch. The spring biases the latch into engagement with the catch to keep the rocker in the idle position.

Abstract: A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.

Abstract: Embodiments of mechanisms for performing a chemical mechanical polishing (CMP) process are provided. A method for performing a CMP process includes polishing a wafer by using a polishing pad. The method also includes applying a cleaning liquid jet on the polishing pad to condition the polishing pad. A CMP system is also provided.

Abstract: A boxing game machine includes a punch bag, a frame, a rocker, a catch, a latch and a spring. The rocker is pivotally connected to the frame between an idle position and an active position. The punch bag is secured to an end of the rocker. The catch is secured to another end of the cocker and formed with a radial edge. The latch is movably supported on the frame and formed with an edge for sliding into contact with radial edge of the catch so that the latch engages with the catch. The spring biases the latch into engagement with the catch to keep the rocker in the idle position.

Abstract: A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.

Abstract: A game machine includes a cabinet, a supporting rod disposed in the cabinet, a retaining base secured on top of the rod, a lighting device disposed on the retaining device, and a drive mechanism disposed in the cabinet. The rod defines a bore therein. The retaining base defines an aperture in communication with the bore in the rod. The lighting device has its electric wire extending through both of the aperture in the retaining base and the bore in the rod. The target is made of a light-transmissive material. The retaining base and the lighting device are housed in a receptacle of the target. The drive mechanism is configured to drive the rod to move up to have the target pop out of a hole in a table of the cabinet.

Abstract: A game machine includes a cabinet, a supporting rod disposed in the cabinet, a retaining base secured on top of the rod, a lighting device disposed on the retaining device, and a drive mechanism disposed in the cabinet. The rod defines a bore therein. The retaining base defines an aperture in communication with the bore in the rod. The lighting device has its electric wire extending through both of the aperture in the retaining base and the bore in the rod. The target is made of a light-transmissive material. The retaining base and the lighting device are housed in a receptacle of the target. The drive mechanism is configured to drive the rod to move up to have the target pop out of a hole in a table of the cabinet.

Abstract: A lifting device for hammer game machine includes frame, a motor laterally mounted to a lower portion of the frame, a seat longitudinally mounted to an upper portion of the frame, a lifting unit partially received in and extending through the seat, a first bracket is secured on a lower end of the lifting device, a linkage assembly connected to the motor and a second bracket laterally mounted onto the linkage assembly through the frame. The first bracket and the second bracket are slidably relative to the frame and selectively connected to each other before being operated.

Abstract: A basketball game assembly includes a backboard, a hoop mounted on a front side of the backboard and a ball blocking device. The ball blocking device includes a shaft, a blocking member and a driving arrangement. The shaft at its rear end is rotatably mounted to the backboard. The blocking member is connected to a front end of the shaft and disposed adjacent to a front edge of the hoop. The driving arrangement is configured to rotate the shaft so as to have the blocking member move to a blocking position higher than the hoop or depart from the blocking position.

Abstract: A lifting device for hammer game machine includes frame, a motor laterally mounted to a lower portion of the frame, a seat longitudinally mounted to an upper portion of the frame, a lifting unit partially received in and extending through the seat, a first bracket is secured on a lower end of the lifting device, a linkage assembly connected to the motor and a second bracket laterally mounted onto the linkage assembly through the frame. The first bracket and the second bracket are slidably relative to the frame and selectively connected to each other before being operated.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate and an interconnect structure disposed over the substrate. The interconnect structure includes a plurality of interconnect layers. One of the interconnect layers contains: a plurality of metal via slots and a bulk metal component disposed over the plurality of metal via slots. The present disclosure also provides a method. The method includes providing a wafer, and forming a first layer over the wafer. The method includes forming an interconnect structure over the first layer. The forming the interconnect structure includes forming a second interconnect layer over the first layer, and forming a third interconnect layer over the second interconnect layer. The second interconnect layer is formed to contain a plurality of metal via slots and a bulk metal component formed over the plurality of metal via slots. The third interconnect layer contains one or more metal trenches.

Abstract: A plate with a static charge on a surface is used to clean a brush. The plate uses both static charge and mechanical force to remove particles from the surface of the brush to increase the useful life of the brush.

Abstract: This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.

Abstract: A game machine includes a main frame, a partition front slantingly mounted on a middle portion of the main frame. A collecting device is mounted onto an underside of the partition and multiple falling ball sensing units are mounted onto an upside of the partition. Multiple prize dispensing devices are mounted onto an internal panel of the main frame and electrically connected to a corresponding one of the falling ball sensing units. A control unit is secured on the main frame and an operational unit is disposed to an upper portion of the main frame, wherein the operational unit is electrically connected to the control unit. When starting a game, the operational unit firstly catches a ball and targets a selected falling ball sense unit, and then releasing the ball to the targeted falling ball sensing units for driving the prize the dispensing device.

Abstract: A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.

Abstract: This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.