Patents by Inventor Chi-Sheng Chang

Chi-Sheng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190204368
    Abstract: A core power detection circuit and an associated input/output (I/O) control system are provided, where the core power detection circuit is utilized for performing power detection in the I/O control system to generate a core power detection signal to control the I/O control system, and the I/O control system operates according to a plurality of supply voltages with respect to a first reference voltage. The core power detection circuit includes: a reference power bias circuit arranged for generating a second reference voltage according to a first supply voltage of the plurality of supply voltages; and a comparison circuit, coupled to the reference power bias circuit, arranged for performing a comparison operation according to the second reference voltage and a second supply voltage of the plurality of supply voltages, to generate a third reference voltage.
    Type: Application
    Filed: April 9, 2018
    Publication date: July 4, 2019
    Inventors: Tang-Long Chang, Chi-Sheng Liao, Jeng-Huang Wu
  • Patent number: 10168006
    Abstract: A backlight module includes a light source and an optical film group. The light source is suitable for emitting a first light. The optical film group includes an optical wavelength conversion film, which is adapted to receive the first light and to convert the first light into a second light with different wavelength. The optical wavelength conversion film includes a first portion and a second portion, wherein a quantity of the first light received per unit area of the first portion of the optical wavelength conversion film is greater than a quantity of the first light received per unit area of the second portion of the optical wavelength conversion film. Furthermore, an optical wavelength conversion efficiency of the first portion of the optical wavelength conversion film with respect to the first light is smaller than an optical wavelength conversion efficiency of the second portion of the optical wavelength conversion film with respect to the first light.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 1, 2019
    Assignee: Au Optronics Corporation
    Inventors: Chi-Sheng Chang, Chi-Tang Ma, Su-Yi Lin
  • Publication number: 20170175956
    Abstract: A backlight module is provided, which includes a plurality of single color light-emitting diodes (LEDs), an optical control film and a plurality of wavelength converting layers. The display panel includes a substrate and circuit elements. The optical control film having a plurality of through holes and being located above the plurality of single color LEDs. The plurality of wavelength converting layers disposed between the optical control film and the plurality of single color LEDs, wherein each of the wavelength converting layers corresponds to one of the single color LEDs and converts a light emitted from the one of the single color LEDs to white light.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 22, 2017
    Inventors: Chi-Sheng CHANG, Su-Yi LIN
  • Publication number: 20160363272
    Abstract: A backlight module includes a light source and an optical film group. The light source is suitable for emitting a first light. The optical film group includes an optical wavelength conversion film, which is adapted to receive the first light and to convert the first light into a second light with different wavelength. The optical wavelength conversion film includes a first portion and a second portion, wherein a quantity of the first light received per unit area of the first portion of the optical wavelength conversion film is greater than a quantity of the first light received per unit area of the second portion of the optical wavelength conversion film. Furthermore, an optical wavelength conversion efficiency of the first portion of the optical wavelength conversion film with respect to the first light is smaller than an optical wavelength conversion efficiency of the second portion of the optical wavelength conversion film with respect to the first light.
    Type: Application
    Filed: October 28, 2015
    Publication date: December 15, 2016
    Inventors: Chi-Sheng Chang, Chi-Tang Ma, Su-Yi Lin
  • Publication number: 20160298828
    Abstract: A backlight module including a light source, an optical wavelength conversion film, a first group of optical films, and a second group of optical films is provided. The light source is adapted to emit a first light. The optical wavelength conversion film is adapted to convert the first light into a second light with a different wavelength. The first group of optical films is disposed between the light source and the optical wavelength conversion film. The optical wavelength conversion film is disposed between the first group of optical films and the second group of optical films, wherein a ratio of a transmittance of the second group of optical films for the second light to a transmittance of the first group of optical films for the first light is larger than or equal to 45%. Thus, the backlight module has a uniform light-emitting color.
    Type: Application
    Filed: July 27, 2015
    Publication date: October 13, 2016
    Inventors: Chi-Sheng Chang, Jian-Li Huang, Wei-Chun Chung, Su-Yi Lin
  • Patent number: 8334570
    Abstract: A CMOS FinFET semiconductor device provides an NMOS FinFET device that includes a compressive stress metal gate layer over semiconductor fins and a PMOS FinFET device that includes a tensile stress metal gate layer over semiconductor fins. A process for forming the same includes a selective annealing process that selectively converts a compressive metal gate film formed over the PMOS device to the tensile stress metal gate film.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: December 18, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jeff J. Xu, Clement H. Wann, Chi Cheh Yeh, Chi-Sheng Chang
  • Publication number: 20120069598
    Abstract: An edge-type backlight module includes a light guide plate and at least one linear light source. The light guide plate has at least one light-incident sidewall, and the linear light source is substantially parallel to the light-incident sidewall. The linear light source includes a carrier and a plurality of solid-state light-emitting devices. The carrier is equally divided into a first, a second, a third, a fourth, and a fifth device mounting regions sequentially arranged along an extending direction of the carrier. The solid-state light-emitting devices are mounted on the device mounting regions and electrically connected to the carrier. An arrangement pitch of the solid-state light-emitting devices on the fourth device mounting region of the device mounting regions is greater than an arrangement pitch of the solid-state light-emitting devices on the other four device mounting regions.
    Type: Application
    Filed: December 30, 2010
    Publication date: March 22, 2012
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Chi-Sheng Chang, Su-Yi Lin, Cheng-Chuan Chen
  • Publication number: 20110169085
    Abstract: A CMOS FinFET semiconductor device provides an NMOS FinFET device that includes a compressive stress metal gate layer over semiconductor fins and a PMOS FinFET device that includes a tensile stress metal gate layer over semiconductor fins. A process for forming the same includes a selective annealing process that selectively converts a compressive metal gate film formed over the PMOS device to the tensile stress metal gate film.
    Type: Application
    Filed: March 4, 2011
    Publication date: July 14, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jeff J. Xu, Clement H. Wann, Chi Chieh Yeh, Chi-Sheng Chang
  • Patent number: 7918179
    Abstract: The present invention relates to an apparatus and method for a drop indicator having a magnet installed therein. The drop indicator according to the invention is used to determine whether a product has ever been dropped or impacted, either in delivery or in use, by inspecting changes in the original condition of the magnet caused by the interaction between the magnetic force and the acceleration of gravity, inertia force, and colliding force, etc. generated upon collision. Take a cell phone or a PDA, for example, changes in the indicative material of the drop indicator will help decide whether the faulty product has ever been dropped or impacted in delivery or in use, so that liability can be determined.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: April 5, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Sheau-Shi Pan, Chi-Sheng Chang, Feng-Yu Yang
  • Patent number: 7915112
    Abstract: A CMOS FinFET semiconductor device provides an NMOS FinFET device that includes a compressive stress metal gate layer over semiconductor fins and a PMOS FinFET device that includes a tensile stress metal gate layer over semiconductor fins. A process for forming the same includes a selective annealing process that selectively converts a compressive metal gate film formed over the PMOS device to the tensile stress metal gate film.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: March 29, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jeff J. Xu, Clement H. Wann, Chi Chieh Yeh, Chi-Sheng Chang
  • Patent number: 7621173
    Abstract: A nano-indentation ultrasonic detecting system for detecting mechanical properties of a target material. An indentation device, disposed on a surface of the target material, generates an indentation on the surface, obtaining the relation between the Young's modulus and the Poisson's ratio of the target material. An ultrasonic generator is movably disposed on the surface of the target material, generating at least two different ultrasonic signals thereon. An ultrasonic receiver is disposed on the surface of the target material and separated from the ultrasonic generator, receiving the ultrasonic signals. The result of a nano-indentation experiment are applied in the ultrasonic theory and iterated by the ultrasonic experimental data and theory, obtaining the Young's modulus of the target material. The obtained Young's modulus of the target material is substituted back in the result of the nano-indentation experiment, obtaining the Poisson's ratio of the target material.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Jiong-Shiun Hsu, Kai-Yu Cheng, Yu-Shyan Liu, Jeah-Sheng Wu, Yu-Yi Su, Chi-Sheng Chang
  • Publication number: 20080186128
    Abstract: The present invention provides a polymeric positive temperature coefficient thermistor, which comprises a first electrode, a second electrode, and a polyimide film sandwiched in between, which comprises (A) a polyimide resin, and (B) nickel powder used to blend with the polyimide resin, wherein the polyimide film has a thickness from 10 to 100 ?m, and the filling proportion of the nickel powder within the polyimide resin reaches a critical volume fraction or above. A process for preparing the above mentioned thermistor is also provided.
    Type: Application
    Filed: July 17, 2007
    Publication date: August 7, 2008
    Inventors: Chi-Sheng Chang, Wei-Kuo Chin
  • Publication number: 20070151340
    Abstract: A nano-indentation ultrasonic detecting system for detecting mechanical properties of a target material. An indentation device, disposed on a surface of the target material, generates an indentation on the surface, obtaining the relation between the Young's modulus and the Poisson's ratio of the target material. An ultrasonic generator is movably disposed on the surface of the target material, generating at least two different ultrasonic signals thereon. An ultrasonic receiver is disposed on the surface of the target material and separated from the ultrasonic generator, receiving the ultrasonic signals. The result of a nano-indentation experiment are applied in the ultrasonic theory and iterated by the ultrasonic experimental data and theory, obtaining the Young's modulus of the target material. The obtained Young's modulus of the target material is substituted back in the result of the nano-indentation experiment, obtaining the Poisson's ratio of the target material.
    Type: Application
    Filed: October 23, 2006
    Publication date: July 5, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiong-shiun Hsu, Kai-Yu Cheng, Yu-Shyan Liu, Jeah-Sheng Wu, Yu-Yi Su, Chi-Sheng Chang
  • Publication number: 20060282973
    Abstract: The present invention discloses an improved windshield wiper structure that includes a wiper arm having a latch disposed at the middle of the wiper arm, a wiper blade integrally fixed with the wiper arm; two auxiliary plates disposed on both left and right sides of the latch on the wiper arm respectively, and two fixing members for integrally fixing the wiper arm, wiper blade and auxiliary plates, so as to increase the pressure of attaching a windshield wiper onto a windshield and enhance the structural stability of the windshield wiper.
    Type: Application
    Filed: June 9, 2006
    Publication date: December 21, 2006
    Inventor: Chi-Sheng Chang
  • Patent number: 6947438
    Abstract: A networking interface device for coupling a system host having one of a plurality configurations to a network medium. The device having a peripheral component interconnect (PCI) interface for coupling the interface device to a system host configured with a PCI based system bus interface; a medium independent interface (MII) for coupling the interface device to a system host configured with a media access controller (MAC) based system bus interface; and a control block for determining whether the interface device is operably coupled to a system host having a PCI based system bus interface or a MAC based system bus interface.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: September 20, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chi-Sheng Chang, Chin-Wei Liang
  • Patent number: 6853645
    Abstract: A networking interface device for coupling a system host having one of a plurality configurations to a network medium. The networking device has a peripheral component interconnect (PCI) interface for coupling the interface device to a system host configured with a PCI based system bus interface; a medium independent interface (MII) for coupling the interface device to a system host configured with a media access controller (MAC) based system bus interface; a PCI control block for managing network data packet traffic exchange between the interface device and the system host; and an MII attachment coupled between the MII and the PCI control block, the MII attachment reformatting management data packets such that the MAC based system bus interface appears to be a PCI based system bus interface by the PCI control block.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: February 8, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chi-Sheng Chang, Chin-Wei Liang
  • Patent number: 6701406
    Abstract: A networking interface device for coupling a system host having one of a plurality configurations to a network medium. The networking interface device has a peripheral component interconnect (PCI) interface for coupling the interface device to a system host configured with a PCI based system bus interface; a medium independent interface (MII) for coupling the interface device to a system host configured with a media access controller (MAC) based system bus interface; and a buffer management device (BMU) having an active state for bursting data packet traffic via the PCI interface when the interface device is coupled to a PCI based system bus interface and a passive state for continuously passing data packet traffic via the MII when the interface device is coupled to a MAC based system bus interface.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: March 2, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chi-Sheng Chang, Chin-Wei Liang, Matthew J. Fischer