Patents by Inventor Chi Wah Cheng

Chi Wah Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210354355
    Abstract: A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 18, 2021
    Inventors: Chi Wah CHENG, Wan Yin YAU, Kwok Pun LAW
  • Publication number: 20210264159
    Abstract: A method for jockey and horse recognition and tracking. The method includes receiving input images or a sequence of images obtained from horse racing videos or video streams; extracting features from the images by computational methods; locating jockey and horse positions of a target horse in the images by the computational methods; deciding to accept or reject the computed jockey and horse positions according to an acceptance function; and producing the final jockey and horse positions and their associated information by an error correction algorithm.
    Type: Application
    Filed: February 23, 2021
    Publication date: August 26, 2021
    Inventors: Yiu Fai YUEN, Wing Chuen CHENG, Ho Ting LEE, Chi Keung FONG, Hon Wah WONG
  • Patent number: 10996308
    Abstract: A testing apparatus and a method for testing electronic devices is provided. The apparatus comprising a plurality of detachably mountable test stations which are operative to perform tests on the electronic devices and a plurality of pick heads for conveying the electronic devices to at least one of the plurality of test stations for testing. The apparatus further comprises an identification element incorporated in each test station indicating a characteristic of the test station, and an identification element detector movable relative to the plurality of test stations, the identification element detector being operative to identify and authenticate the characteristic of the at least one test station by detecting the identification element incorporated in the test station, prior to utilizing the test station for testing the electronic devices.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: May 4, 2021
    Inventors: Chi Wah Cheng, Yu Sze Cheung
  • Publication number: 20200341056
    Abstract: A test handler comprising a primary rotary turret comprising pick heads for transporting electronic components, and a secondary rotary turret arranged and configured to receive electronic components directly or indirectly from the primary rotary turret, the secondary rotary turret including multiple separate test sectors having component carriers for carrying the electronic components received from the primary rotary turret, wherein the multiple test sectors are rotatably movable relative to one another. The test handler also comprises at least one testing device positioned along a periphery of the secondary rotary turret, wherein the component carriers of the respective test sectors are operative to convey the electronic components to a position of the at least one testing device for testing.
    Type: Application
    Filed: September 6, 2019
    Publication date: October 29, 2020
    Inventors: Chi Wah CHENG, Kai Fung LAU, Yu Sze CHEUNG
  • Patent number: 10741434
    Abstract: An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: August 11, 2020
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kai Fung Lau, Chi Wah Cheng
  • Publication number: 20200203305
    Abstract: An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.
    Type: Application
    Filed: December 24, 2018
    Publication date: June 25, 2020
    Inventors: Wan Yin YAU, See Lok CHAN, Chi Wah CHENG
  • Publication number: 20200098614
    Abstract: An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.
    Type: Application
    Filed: September 24, 2018
    Publication date: March 26, 2020
    Inventors: Kai Fung LAU, Chi Wah CHENG
  • Patent number: 10473714
    Abstract: A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: November 12, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Chi Wah Cheng, Chi Hung Leung, Yu Sze Cheung, Kai Fung Lau
  • Publication number: 20190317174
    Abstract: A testing apparatus and a method for testing electronic devices is provided. The apparatus comprising a plurality of detachably mountable test stations which are operative to perform tests on the electronic devices and a plurality of pick heads for conveying the electronic devices to at least one of the plurality of test stations for testing. The apparatus further comprises an identification element incorporated in each test station indicating a characteristic of the test station, and an identification element detector movable relative to the plurality of test stations, the identification element detector being operative to identify and authenticate the characteristic of the at least one test station by detecting the identification element incorporated in the test station, prior to utilizing the test station for testing the electronic devices.
    Type: Application
    Filed: April 17, 2018
    Publication date: October 17, 2019
    Inventors: Chi Wah CHENG, Yu Sze CHEUNG
  • Publication number: 20190289760
    Abstract: An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 19, 2019
    Inventors: Chi Wah CHENG, Wan Yin YAU
  • Publication number: 20190257876
    Abstract: Defects in an electronic device are detected by capturing a first image from a first side of the electronic device, and capturing a second image from a second side of the electronic device which is different from the first side. The first and second images are captured when an inside of the electronic device is illuminated by light rays passed therethrough. If a defect is present in the electronic device, a profile of the defect is determined based on the first and second images and the electronic device is rejected if it is assessed from the profile of the defect that it is of a type for which the electronic device should be rejected.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Chung Yan LAU, Chi Wah CHENG
  • Patent number: 10338006
    Abstract: A method for automated alignment of electronic components with respect to one or more inspection devices for inspecting the electronic components, each electronic component having a plurality of side surfaces. The method comprises: positioning each electronic component relative to an imaging device; determining, by the imaging device, an angular offset and a linear offset between each side surface of the electronic component and the one or more inspection devices; positioning each electronic component relative to the inspection devices; effecting alignment between each side surface and the one or more inspection devices in accordance with the respective angular and linear offsets; and inspecting each side surface after effecting alignment between the side surface and the inspection devices.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: July 2, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Chi Wah Cheng, Kai Fung Lau, Hoi Shuen Tang
  • Publication number: 20190067049
    Abstract: Semiconductor wafer cutting is optimised by directing a plurality of laser beams at the wafer, with the laser beams being focused so that at least some of their respective focal points are located at different depths throughout the wafer.
    Type: Application
    Filed: August 23, 2017
    Publication date: February 28, 2019
    Inventors: Chi Wah CHENG, Lap Kei CHOW, Chi Hang KWOK
  • Publication number: 20180364180
    Abstract: A method for automated alignment of electronic components with respect to one or more inspection devices for inspecting the electronic components, each electronic component having a plurality of side surfaces. The method comprises: positioning each electronic component relative to an imaging device; determining, by the imaging device, an angular offset and a linear offset between each side surface of the electronic component and the one or more inspection devices; positioning each electronic component relative to the inspection devices; effecting alignment between each side surface and the one or more inspection devices in accordance with the respective angular and linear offsets; and inspecting each side surface after effecting alignment between the side surface and the inspection devices.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 20, 2018
    Inventors: Chi Wah CHENG, Kai Fung LAU, Hoi Shuen TANG
  • Patent number: 10115620
    Abstract: Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: October 30, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yu Sze Cheung, Chi Wah Cheng, Chi Fung Chan
  • Publication number: 20180252766
    Abstract: A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.
    Type: Application
    Filed: March 6, 2017
    Publication date: September 6, 2018
    Inventors: Chi Wah CHENG, Chi Hung LEUNG, Yu Sze CHEUNG, Kai Fung LAU
  • Patent number: 10056278
    Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: August 21, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Chi Wah Cheng, Kai Fung Lau
  • Publication number: 20180188318
    Abstract: A test handler for testing electronic components comprises a rotary turret for conveying electronic components, a first input station and a second input station, the first and second input stations each being operative to separately feed electronic components to the rotary turret for conveying the electronic components. The electronic components fed only from the first input station are tested at a first set of test stations comprising a plurality of first test platforms, and the electronic components fed only from the second input station are tested at a second set of second test stations comprising a plurality of second test platforms. For removing the electronic components from the rotary turret, a first off-loading station receives electronic components fed only from the first input station and a second off-loading station receives electronic components fed only from the second input station.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 5, 2018
    Inventors: Cho Tao CHEUNG, Chi Wah CHENG, Kai Fung LAU
  • Publication number: 20180053671
    Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.
    Type: Application
    Filed: August 22, 2016
    Publication date: February 22, 2018
    Inventors: Chi Wah CHENG, Kai Fung LAU
  • Patent number: 9850074
    Abstract: A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: December 26, 2017
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Shing Kai Yip, Yu Sze Cheung, Chi Wah Cheng