Abstract: A test handler for testing electronic components comprises a rotary turret for conveying electronic components, a first input station and a second input station, the first and second input stations each being operative to separately feed electronic components to the rotary turret for conveying the electronic components. The electronic components fed only from the first input station are tested at a first set of test stations comprising a plurality of first test platforms, and the electronic components fed only from the second input station are tested at a second set of second test stations comprising a plurality of second test platforms. For removing the electronic components from the rotary turret, a first off-loading station receives electronic components fed only from the first input station and a second off-loading station receives electronic components fed only from the second input station.

Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

Abstract: A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Abstract: A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Abstract: A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.

Abstract: Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components.

Abstract: An apparatus for conveying electronic devices comprises a track for conveying a plurality of electronic devices in a row towards a pick-up position on the track where the electronic devices are removed by a pick-up device. A guiding portion located over the track has a first restraining mechanism formed in the guiding portion that is operative to restrain and secure a first electronic device at a first position next to the pick-up position and a second restraining mechanism formed in the guiding portion that is operative to restrain and secure a second electronic device at a second position away from the pick-up position which is immediately subsequent to the first position. The first and second electronic devices are configured to be released and conveyed towards the pick-up position when the first and second restraining mechanisms respectively are deactivated. A corresponding method is also provided.

Abstract: A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.

Abstract: A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.

Abstract: Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components.

Abstract: Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.

Abstract: Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.

Abstract: Disclosed is a singulation apparatus for cutting a workpiece. The singulation apparatus comprises: i) a processor; ii) at least one chuck device for securing the workpiece to be cut; iii) a cutting device spaced from the at least one chuck device by a separation distance, the cutting device being for cutting the workpiece secured to the at least one chuck device; and iv) an imaging device operable to capture one or more images comprising the cutting device and a reference feature. In particular, the processor is configured to determine a separation distance between the cutting device and the reference feature based on the one or more images as captured by the imaging device, to thereby determine the separation distance between the cutting device and the workpiece as secured to the at least one chuck device.

Abstract: A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

Abstract: Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components.

Abstract: A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.

Abstract: A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.

Abstract: Disclosed is a singulation apparatus for cutting a workpiece. The singulation apparatus comprises: i) a processor; ii) at least one chuck device for securing the workpiece to be cut; iii) a cutting device spaced from the at least one chuck device by a separation distance, the cutting device being for cutting the workpiece secured to the at least one chuck device; and iv) an imaging device operable to capture one or more images comprising the cutting device and a reference feature. In particular, the processor is configured to determine a separation distance between the cutting device and the reference feature based on the one or more images as captured by the imaging device, to thereby determine the separation distance between the cutting device and the workpiece as secured to the at least one chuck device.

Abstract: An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

Abstract: Disclosed is a singulation apparatus, comprising: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being for cutting the workpiece. A singulation method is also disclosed.