Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.

Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.

Abstract: A method of battery charging is to be implemented by an energy station communicable with a cloud server that stores reference battery identifiers. The method includes: detecting a provided battery identifier of a battery, and transmitting the provided battery identifier to the cloud server so as to enable the cloud server to determine one of the reference battery identifiers that matches the provided battery identifier, and to determine to which one of a first lease code and a second lease codes the one of the reference battery identifiers thus determined corresponds; and being controlled to charge the battery when it is determined that the one of the reference battery identifiers thus determined by the cloud server corresponds to the first lease code.

Abstract: A method of battery charging is to be implemented by an energy station communicable with a cloud server that stores reference battery identifiers. The method includes: detecting a provided battery identifier of a battery, and transmitting the provided battery identifier to the cloud server so as to enable the cloud server to determine one of the reference battery identifiers that matches the provided battery identifier, and to determine to which one of first and second lease codes the one of the reference battery identifiers thus determined corresponds; and being controlled to charge the battery when it is determined that the one of the reference battery identifiers thus determined by the cloud server corresponds to the first lease code.

Abstract: A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Abstract: A fan assembly for use in an electronic device is provided. The fan assembly includes a housing, a fan, a throttle valve, and a regulator. The housing has an outlet. The fan is disposed in the housing and adapted to provide an air current. The air current generates an air volume through the outlet. The throttle valve is movably disposed in the housing at the outlet. The regulator is connected to the throttle valve to control the movement of the throttle valve to adjust the size of the outlet.

Abstract: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Abstract: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Abstract: The present invention relates to a method for auto-regulating the fan speed. The method includes detecting the temperature of a thermal source. When the temperature of the thermal source exceeds a target value, the fan speed of the fan is regulated according to a relation between the temperature of the thermal source and the fan speed of the fan. Thereafter, the voltage applied to the fan is micro-adjusted through a feedback control mechanism so that the fan speed of the fan reaches a specified speed in steps.

Abstract: A fastening structure including a first housing, a substrate, a second housing, and a fastening component is provided. The first housing has a first boss with a first opening, and a sidewall of the first opening is made of metal. The substrate has a second opening. The second housing has a second boss with a third opening. One end of the fastening component passes through the third opening and is fastened in the first opening, and the other end of the fastening component is restricted in one end of the third opening to fasten the substrate between the first housing and the second housing. Both the metal sidewall and the sidewall of the fastening component therein do not contact the substrate.

Abstract: A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.

Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Abstract: A method for controlling a fan is provided for adjusting the rotational speed of a fan. The method includes adjusting the rotational speed of the fan from a first mode value to a range of rotational speed variation, wherein the upper bound of the range of rotational speed variation is a second mode value plus a first variation value, and the lower bound of the range of rotational speed variation is the second mode value minus a second variation value; and adjusting the rotational speed of the fan in the range of rotational speed variation during a time period. Thus, a user will not consider the sound from the fan as a noise.

Abstract: A heat dissipating device comprises a dust-collecting mechanism installed at the air vent passage of a fan, and thus the dust or particles mixed in the airflow of the fan shall be collected on the top of the dust-collecting mechanism; the dust-collecting mechanism can be taken out frequently to remove and clean the collected dust or particles, so that the airflow of the fan can be kept normal and the dust deposited on the surface of the metal fins of a heat sink can be decreased greatly as to normally maximize the heat dissipating efficiency for the heat dissipating device for a long period of time and maintain the heat generating source to operate normally at a permissible temperature.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.

Abstract: A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.

Abstract: A method for controlling a fan is provided for adjusting the rotational speed of a fan. The method includes adjusting the rotational speed of the fan from a first mode value to a range of rotational speed variation, wherein the upper bound of the range of rotational speed variation is a second mode value plus a first variation value, and the lower bound of the range of rotational speed variation is the second mode value minus a second variation value; and adjusting the rotational speed of the fan in the range of rotational speed variation during a time period. Thus, a user will not consider the sound from the fan as a noise.