Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Abstract: A heat dissipating device comprises a dust-collecting mechanism installed at the air vent passage of a fan, and thus the dust or particles mixed in the airflow of the fan shall be collected on the top of the dust-collecting mechanism; the dust-collecting mechanism can be taken out frequently to remove and clean the collected dust or particles, so that the airflow of the fan can be kept normal and the dust deposited on the surface of the metal fins of a heat sink can be decreased greatly as to normally maximize the heat dissipating efficiency for the heat dissipating device for a long period of time and maintain the heat generating source to operate normally at a permissible temperature.

Abstract: The present invention relates to a method for auto-regulating the fan speed. The method includes detecting the temperature of a thermal source. When the temperature of the thermal source exceeds a target value, the fan speed of the fan is regulated according to a relation between the temperature of the thermal source and the fan speed of the fan. Thereafter, the voltage applied to the fan is micro-adjusted through a feedback control mechanism so that the fan speed of the fan reaches a specified speed in steps.

Abstract: A cooling fan structure installed in a system or a device necessitating radiation, cooling or convection, especially applied to the central processing unit of a computer for forced convection. The cooling fan structure includes a fixed base seat, a rotary vane assembly and a protective cover. The vane assembly and the fixed base seat contact with each other at one single point and an air bearing is formed to retain the vane assembly so that almost no contact abrasion will take place and the noise is minimized and the rotational speed can be increased. The cooling fan structure is manufactured at low cost and can be easily assembled.

Abstract: Air-bearing fan includes a dust-proof cover, a fan blade structure, a magnet, a stator, a sleeve, an electronic circuit board, a housing and a thrust disk. While the fan blade structure is rotating, air can be induced into a ring-shaped gap so that an air-bearing is formed. And, air is also induced into a thrust gap and forms a thrust bearing. Therefore, this invention significantly reduces the noise and increases the fan's rotating speed, fan capacity and life.

Abstract: The heat dissipating structure mainly includes a heat dissipating base, one or several heat dissipating fins, and a fixing frame. It can improve the ratio of fin's height to width, to increase the effective heat transfer area, and to promote the cooling capacity, especially for electronic elements. About the manufacturing method, it includes three steps: machining, inserting and injecting. So, the manufacturing method is simple and the required machines are general.