Abstract: This disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a first substrate, a second substrate, a first supporting member and a plurality of second supporting members. The first supporting member and the second supporting members are disposed between the first substrate and the second substrate. The first supporting member includes a first bottom surface and a first top surface. The second supporting member is disposed adjacent to the first supporting member and includes a second bottom surface and a second top surface. The difference between the radius of the first bottom surface and the radius of the first top surface is defined as a first radius bias. The difference between the radius of the second bottom surface and the radius of the second top surface is defined as a second radius bias. The first radius bias is greater than the second radius bias.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: A gas detection and cleaning system for a vehicle is disclosed and includes an external modular base, a gas detection module and a cleaning device. The gas detection module is connected to a first external connection port of the external modular base to detect a gas in the vehicle and output the information datum. The information datum is transmitted through the first external connection port to a driving and controlling module of the external modular base, processed and converted into an actuation information datum for being externally outputted through a second external connection port of the external modular base. The cleaning device is connected with the second external connection port through an external port to receive the actuation information datum outputted from the second external connection port to actuate or close the cleaning device.

Abstract: A blood pressure device includes a first blood pressure measuring device, a second blood pressure measuring device, and a controller. The first blood pressure measuring device is to be worn on a first position of a wrist so as to obtain a first blood pressure information of the first position. The second blood pressure measuring device is to be worn on a second position of the wrist so as to obtain a second blood pressure information of the second position. The controller is electrically coupled to the first blood pressure measuring device and the second blood pressure measuring device so as to adjust tightness between the expanders and the user's skin, respectively. The controller receives, processes, and calculates a pulse transit time between the first blood pressure information and the second blood pressure information, and the controller obtains at least one blood pressure value based on the pulse transit time.

Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.

Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.

Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.

Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).

Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.

Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.

Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.

Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.

Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.

Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).

Abstract: An intermittent excitation apparatus of a 3D printer includes at least one guide, a drive rod, a movable seat, and a microcontroller. When the microcontroller controls a first motor in a non-excitation and non-rotation condition, the movable seat is fixed on the drive rod and the 3D printer performs a plane printing operation. When the microcontroller controls the first motor in an excitation and rotation condition, the movable seat moves along the drive rod. Therefore, it is to significantly reduce heat generated inside the first motor, decrease costs, and reduce the size of the 3D printer.

Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.

Abstract: A three-dimensional (3D) printing apparatus, a printing calibration board and a three dimensional printing calibration method thereof are provided. The three-dimensional printing apparatus is adapted to spray the printing material. The three-dimensional printing apparatus includes a nozzle module, a printing platform and a control unit. The printing platform has a carrying surface, where the calibration pattern is disposed on the carrying surface. The calibration pattern at least includes a datum path and a first auxiliary path. The control unit controls the nozzle module coupled to the control unit to spray the printing material along the datum path, and the printing speed of the nozzle module is adjusted in response to the width of coverage of the printing material on the calibration pattern.

Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.

Abstract: A three-dimensional (3D) printing apparatus, a printing calibration board and a three dimensional printing calibration method thereof are provided. The three-dimensional printing apparatus is adapted to spray the printing material. The three-dimensional printing apparatus includes a nozzle module, a printing platform and a control unit. The printing platform has a carrying surface, where the calibration pattern is disposed on the carrying surface. The calibration pattern at least includes a datum path and a first auxiliary path. The control unit controls the nozzle module coupled to the control unit to spray the printing material along the datum path, and the printing speed of the nozzle module is adjusted in response to the width of coverage of the printing material on the calibration pattern.

Abstract: An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin.