Patents by Inventor Chi Wen Hsieh

Chi Wen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296567
    Abstract: A manufacturing method of micro fluid actuator includes: providing a substrate; depositing a first protection layer on a first surface of the substrate; depositing an actuation region on the first protection layer; applying lithography dry etching to a portion of the first protection layer to produce at least one first protection layer flow channel; applying wet etching to a portion of a main structure of the substrate to produce a chamber body and a first polycrystalline silicon flow channel region, while a region of an oxidation layer middle section of the main structure is not etched; applying reactive-ion etching to a portion of a second surface of the substrate to produce at least one substrate silicon flow channel; and applying dry etching to a portion of a silicon dioxide layer to produce at least one silicon dioxide flow channel.
    Type: Application
    Filed: March 16, 2021
    Publication date: September 23, 2021
    Inventors: Hao-Jan Mou, Hsien-Chung Tai, Lin-Huei Fang, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin
  • Publication number: 20210283432
    Abstract: A helmet includes a helmet body and a gas detection and purification device. The gas detection and purification device in includes a body, a purification module, a gas-guiding unit, a gas detection module, and a power module. The gas detection module calculates the gas detection data obtained by the gas detection module so as to control the gas-guiding unit to start or stop operation based on the gas detection data. When the gas-guiding unit is in operation, the gas-guiding unit guides the gas into the body and to pass through the purification module for being filtered and purified to become a purified gas, and the gas-guiding unit discharges the purified gas out of the body to the nose portion, or the mouth portion, or both the nose portion and the mouth portion of the wearer for providing the wearer with the purified gas to breath.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin, Yang Ku, Yi-Ting Lu
  • Patent number: 11094802
    Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: August 17, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Wen Hsieh, Chien-Ping Hung, Chi-Kang Chang, Shih-Chi Fu, Kuei-Shun Chen
  • Patent number: 10843407
    Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 24, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Patent number: 10780638
    Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: September 22, 2020
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Chi-Wen Hsieh, Chi-Chieh Wu
  • Patent number: 10578655
    Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 3, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Chi-Wen Hsieh, Yi-Chun Lin, Tseng-Te Huang, Ming-Chen Yuan, Chien-Hau Chu, Yu-Chin Chi
  • Publication number: 20200058762
    Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 20, 2020
    Inventors: Chi-Wen HSIEH, Chien-Ping HUNG, Chi-Kang CHANG, Shih-Chi FU, Kuei-Shun CHEN
  • Publication number: 20190248070
    Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.
    Type: Application
    Filed: May 2, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Publication number: 20190248071
    Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.
    Type: Application
    Filed: May 25, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Patent number: 10286645
    Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.
    Type: Grant
    Filed: November 16, 2014
    Date of Patent: May 14, 2019
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Yang-Teh Lee, Kwan Ho, Chi-Wen Hsieh, Yu-Chuan Chang, Chi-Chieh Wu
  • Publication number: 20190077078
    Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).
    Type: Application
    Filed: November 1, 2017
    Publication date: March 14, 2019
    Inventors: Chi-Wen HSIEH, Chi-Chieh WU
  • Publication number: 20190022933
    Abstract: An intermittent excitation apparatus of a 3D printer includes at least one guide, a drive rod, a movable seat, and a microcontroller. When the microcontroller controls a first motor in a non-excitation and non-rotation condition, the movable seat is fixed on the drive rod and the 3D printer performs a plane printing operation. When the microcontroller controls the first motor in an excitation and rotation condition, the movable seat moves along the drive rod. Therefore, it is to significantly reduce heat generated inside the first motor, decrease costs, and reduce the size of the 3D printer.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 24, 2019
    Inventors: Kwan HO, Chien-Ying HUANG, Chih-Ming CHANG, Chih-Hao LEE, Hung-Tang TENG, Chung-Chih YANG, Chi-Wen HSIEH
  • Publication number: 20170336446
    Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.
    Type: Application
    Filed: February 14, 2017
    Publication date: November 23, 2017
    Inventors: Chi-Wen Hsieh, Yi-Chun Lin, Tseng-Te Huang, Ming-Chen Yuan, Chien-Hau Chu, Yu-Chin Chi
  • Patent number: 9550324
    Abstract: A three-dimensional (3D) printing apparatus, a printing calibration board and a three dimensional printing calibration method thereof are provided. The three-dimensional printing apparatus is adapted to spray the printing material. The three-dimensional printing apparatus includes a nozzle module, a printing platform and a control unit. The printing platform has a carrying surface, where the calibration pattern is disposed on the carrying surface. The calibration pattern at least includes a datum path and a first auxiliary path. The control unit controls the nozzle module coupled to the control unit to spray the printing material along the datum path, and the printing speed of the nozzle module is adjusted in response to the width of coverage of the printing material on the calibration pattern.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: January 24, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Yang-Teh Lee, Chi-Wen Hsieh, Chi-Chieh Wu
  • Publication number: 20160059491
    Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.
    Type: Application
    Filed: November 16, 2014
    Publication date: March 3, 2016
    Inventors: Yang-Teh Lee, Kwan Ho, Chi-Wen Hsieh, Yu-Chuan Chang, Chi-Chieh Wu
  • Publication number: 20150321426
    Abstract: A three-dimensional (3D) printing apparatus, a printing calibration board and a three dimensional printing calibration method thereof are provided. The three-dimensional printing apparatus is adapted to spray the printing material. The three-dimensional printing apparatus includes a nozzle module, a printing platform and a control unit. The printing platform has a carrying surface, where the calibration pattern is disposed on the carrying surface. The calibration pattern at least includes a datum path and a first auxiliary path. The control unit controls the nozzle module coupled to the control unit to spray the printing material along the datum path, and the printing speed of the nozzle module is adjusted in response to the width of coverage of the printing material on the calibration pattern.
    Type: Application
    Filed: July 7, 2014
    Publication date: November 12, 2015
    Inventors: Yang-Teh Lee, Chi-Wen Hsieh, Chi-Chieh Wu
  • Patent number: 9129974
    Abstract: An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: September 8, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Wen Hsieh, Chi-Kang Chang, Chia-Chu Liu, Meng-Wei Chen, Kuei-Shun Chen
  • Publication number: 20140367869
    Abstract: An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin.
    Type: Application
    Filed: August 28, 2014
    Publication date: December 18, 2014
    Inventors: Chi-Wen Hsieh, Chi-Kang Chang, Chia-Chu Liu, Meng-Wei Chen, Kuei-Shun Chen
  • Patent number: 8822343
    Abstract: An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: September 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Wen Hsieh, Chi-Kang Chang, Chia-Chu Liu, Meng-Wei Chen, Kuei-Shun Chen
  • Patent number: D734814
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: July 21, 2015
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Hong-Chuan Yeh, Ming-En Ho, Chien-Chih Chen, Chi-Wen Hsieh, Kwei-Jui Teng